Escolar Documentos
Profissional Documentos
Cultura Documentos
March 2011
Special reports
20 Medical electronics
32 Embedded computing
40 Embedded World preview
Reportage
38 Accelerated processing
Design Application
72 Control gets more remote
Modules with
integrated thermal
sensor technology
from Lexar Media
allow users to
switch LED colour
combinations or patterns on the fly.
Page 12
MEDICS ON
Projected
capacitive
touchscreen
controllers from
Maxim bring
multi-
THE MOVE
touch to handsets, tablets,
e-readers, GPS units,
and other portable
equipment. Page
26
Power management
of portable equipment
PAGE 20
Breakthrough image quality
and low power in a compact solution!
8-channel front-end plus ADC receiver solution provides the highest level of
performance at low power for all ultrasound imaging modalities
MAX2078 MAX1437B
65mW/ch,, octal
+ 96mW/ch, octal,
front-end wi
with
ith CWD 12-bit, 50Msps ADC
beamformer
beamforrmer with serial outputs
BROADBAND
BROA
BROADB
DBAN
AND
D SN
SNR COMPARISON
7700
688
66
64
SNR (dBFS)
62
60
54
14 18 22 26 30 34 38 42 44
GAIN (dB)
www.maxim-ic.com/Ultrasound
DIRECT ™
www.maxim-ic.com/shop
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For free samples or technical support, visit our website or call +3531 2235500.
Innovation Delivered and Maxim are registered trademarks of Maxim Integrated Products, Inc. © 2011 Maxim Integrated Products, Inc. All rights reserved.
;/@161=<B3<BA
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EDITORIAL Marcom Manager
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[72] Design Application: Nordic Semiconductor’s Sony Nisus
Distribution & Test Editor
wireless chip is used by Philips Home Control in the snisus@reedbusiness.fr
Mick Elliott
Bellagio remote control melliott@reedbusiness.fr Production Manager
Electronic Product News Pasquale Spadari
[74] Test Corner Online Editorial Director pspadari@reedbusiness.fr
front cover products Pierre Bouhail
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[12] The Ballistix Smart Tracer modules (Lexar DISPLAY ADVERTISING clatroche@reedbusiness.fr
Media) Director of International
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Semiconductor) jwaddell@reedbusiness.fr
Page Layout & Design
Sales Support Manager Marie Hawksby
[26] The MAX11855, MAX11856 and [78] Distribution Spotlight Sabrine Karmaoui mhawksby@reedbusiness.fr
MAX11871 (Maxim) skarmaoui@reedbusiness.fr
MANAGEMENT
[83] Web Update Sales Coordinator Publisher
Martin Savery
features [86] Index: Companies in this Issue
Sony Nisus
snisus@reedbusiness.fr
msavery@reedbusiness.fr
6 March ½3><7AAC3<!
327B=@7/:1=;;3<B
Apart from forces of nature, another potential source of such a catastrophe is cyber warfare or a high-
tech attack. Terrorists could paralyse a high street bank’s computer system using a microwave gener-
ator, which can fit into a suitcase. At the other end of the scale, a nuclear weapon exploding in space
could create a high altitude electromagnetic pulse which would have a more far-reaching effect on
electrical equipment further afield.
In September, the first Electric Infrastructure Security Council was held in London, UK. The invited scien-
tists, policy makers, energy ministers and members from 20 nations’ administrations heard former US
government adviser, Avi Schnurr, warn that the ubiquitous electrical infrastructure is vulnerable and one
geomagnetic storm, EMP (electromagnetic pulse) or HEMP (high power EMP) “could shatter nations
all over the Earth”. HEMP can cover continents with a radius of up to 1000km from the burst location,
whereas EMP has a 10km radius.
I visited MPE, in Liverpool, UK, which designs and manufactures HEMP filers to meet Mil-Std 188-125
parts 1 and 2. This supersedes the NATO specification for high altitude electromagnetic pulse filters. On
my visit I learned that the company has opted not to add components to power line filters and instead
designed smaller, lighter models than those available before, which have been designed to satisfy the
specification’s PCI (pulse current injection) requirements rather than the insertion loss specification.
MPE is one of the friendliest and technically expert companies I have visited, so it is strange to report
that I hope some of their products never get used!
8 March ½3><7AAC3<!
mouser.com
Semiconductors and electronic
components for design engineers.
UCC24610 600-kHz
Green RectiÄer™ Controller
ler
With the latest power products and technologies, we’re committed to answering engineers’ design needs.
Get your hands on what’s next at Mouser. Manage your power wisely.
Mouser and Mouser Electronics are registered trademarks of Mouser Electronics, Inc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.
=<B63E30
Among the news stories to be found on the EPN website this month are:
GPU virtualisation software designed for Pseudo Open Drain technology adapted to high-performance graphic
Intel Sandy Bridge platforms is available from DRAM allows the memory to consume just half the electric current of
LucidLogix. The Virtu software will allow next- DDR3 when reading and writing data.
generation PCs to dynamically balance the www.epn-online.com/search.search_keyword=43727
advanced power-efficient, media features of
Sandy Bridge processor graphics with the DirectX The RFPT200 is a 7x5mm SMD digitally controlled
11 3D performance features of discrete GPUs. TCXO. Rakon claims it brings frequency stability
www.epn-online.com/search.search_keyword=43909 with digital frequency control, separate low
frequency output, timer and alarm functionality
Samsung Electronics has completed development of the industry’s first in military and high-rel applications.
DDR4 DRAM module, using 30nm-class process technology. The module’s www.epn-online.com/search.search_keyword=43730
Read these stories, and many more, Follow EPN on Twitter: CazzaHayesEPN
in full on www.epn-online.com
The site is also the home of industry blogs by Mick Elliott, Helen Duncan and Marisa Robles Consee.
10 March ½3><7AAC3<!
TI’s Analog Applications Journal
Analog Applications Journal is a collection of analog application articles designed to give readers a basic understanding of TI products
and to provide simple but practical examples for typical applications. Written not only for design engineers but also for engineering
managers, technicians, system designers and marketing and sales personnel, the book emphasizes general application concepts over lengthy
mathematical analyses.
12 March ½3><7AAC3<!
<3E>@=2C1BA
1 MOSIS has
developed
an image sensor
/ co-fired PZT bimorph element from
Morgan Technical Ceramics is
claimed to provide excellent mechanical
: ow power, 3D-enabled portable devices
can have access to 3D content, with
no need for glasses when using the
that yields very and electrical stability in critical, high DA8223 2D to 3D video conversion chip.
low dark noise temperature sensing and actuator appli- A parallax barrier screen negates the
and uses dual cations in aerospace, automotive, oil and need for 3D viewing with glasses says
gain readout medical industries. The two-layer piezo- Dialog Semiconductor. The IC analyses each
to increase the electric device is configured with a central 2D video frame and creates a layered depth
dynamic range above 89.5dB. It can be used encapsulated electrode region. By electri- map, isolating foreground and background
for image processing in scientific, diagnostic cally driving one of the two piezo plates objects. From this, each original image pixel
and security applications. The sensor is based to expand, the component bends, is mapped into left and right eye pixels
on a special pixel type where the dynamic providing an active component. It is that, when viewed through a parallax
range is increased by its very low dark noise similar in construction to conventional barrier filter on the display module, renders
of less than 3.4e- at a full well capacity of bonded bimorphs, but is fired at a high the 3D image directly. The IC integrates the
100ke-. The integration of the image charge temperature that sinters the two piezo 3D conversion process so unlike traditional
takes place simultaneously at a low and layers into a monolithic structure sepa- software-based solutions, there is no extra
a high amplification setting. The dual gain rated only by the inner electrode. This load on
readout results in two different images. They construction makes it more mechanically the host
are read out sequentially and combined stable than alternative bimorphs as there application
externally into a final image, which dynamic is a uniform mechanical interface at the processor
range extends to more than 89.5dB. The edges. There are no seams for potential and no
image capture array based on this pixel type infiltration and as a result they can be external
offers an electronic rolling shutter, whose used in harsh environments. The bimorphs memory
lines can be selected and read out via the are manufactured from the company’s require-
columns. The twofold readout of each pixel, piezoceramic materials PZT5A3, PZT5H2 ment. Compatible with 3D-capable displays
delivers twice the number of column ampli- and PZT702. PZT702 has excellent aging from 3.8 to 10inches, it can be used in
fiers than columns. Amplification factors are characteristics, claims the company, low smartphones and tablet PCs. It will also
programmable at one to 16X. Several multi- signal to noise ratio and high sensitivity work with any display equipped with a
plexers select the proper column and transfer for impact and sound sensing which give parallax barrier filter including OLED and
the analogue signals to a three-stage output superior component performance. Bespoke, TFT displays from Sharp. The 5x5mm 81-ball
circuit, which consists of an amplifier for co-fired PZT bimorphs can be supplied. UFBGA chip can be mounted on the PCB,
correlated double sampling at one, two or They are available in a variety of styles, between the application processor and
4X and programmable offset, limiter and including squares, rectangles, discs and 3D display, or on the display module as
output driver. ADC can be performed off-chip rings, and are offered in a range of sizes, a chip-on-flex. Device samples are available,
while programmable amplification and offset from six to 74mm in length and one to with mass production from the second
can adapt the sensor IC to different ADCs. 43mm in width. half of 2011.
CMOSIS MORGAN TECHNICAL CERAMICS DIALOG SEMICONDUCTOR
www.epn-online.com/search?search_keyword=43443 www.epn-online.com/search?search_keyword=43440 www.epn-online.com/search?search_keyword=43584
14 March ½3><7AAC3<!
For embedded systems
systems i.e. MEMS, MOEMS, ICs and combined with Intel Architecture
95mm
technology and nanotechnology, optics, Intel® Atom™ Processor E600 Series
All power supplies and control possible from Management Power Intel® Atom
SDVO
PWRBTN#
IC Processor
a single chip. Integrated power management Power E600 Series
HD Audio
Fraunhofer IZM, Uwe Schwarz, XFAB, All required clocks generated from a single chip.
ROHM Clock PCH EG20T I2S
High accuracy, low jitter one-chip clock system. PCI Express* Etc.
16 March ½3><7AAC3<!
HIGHEND QUALITY
MLCC 0402 - 0,15mm Height Ferrite Bead 01005 case size Power Inductor 5 x 5 mm
Taiyo Yuden Co., Ltd. announce a new multilayer TAIYO YUDEN is expanding its lineup of EIA Rated Current Improved By 25% and DC
ceramic capacitor featuring an industry-high 01005 size multilayer ferrite chip beads, Resistance Improved By 20%
capacitance of 0.22μF in the EIA 0402 size and BK0402 (0.4 x 0.2 x 0.2 mm), targeting noise Taiyo Yuden Co., Ltd release two new wire-wound
a maximum height of just 0.15mm. The new reduction in compact mobile devices such power inductors, the NRS5020 (5.0x5.0mm, with
AMC105BJ224MH capacitor is specifically as advanced mobile phones which are a maximum height of 2.0mm) and the NR5040
designed for use in compact mobile devices exemplified by smart phones. (5.0x5.0mm, with a maximum height of 4.0mm).
such as mobile phones where high-density The BK0402 has been miniaturized by Both new products boast the best DC bias
surface mounting is essential... approximately 70% when compared to the characteristics...
For further information click here! company’s previous BK0603 (0.6 x 0.3 x 0.3 mm). For further information click here!
In addition to the HS series represented by
BK0402 HS121, which achieved the industry’s
lowest DC resistance when used in broadband
noise reduction, the BK0402 has been expanded
for the best noise reduction in higher frequency
bands by the introduction of the HM series
BK0402 HM750 and BK0402 HM121, and the
LL series BK0402 LL220.
MLCC 0805 - 100μF Taiyo Yuden believes that with this lineup expansion, Battery Back-up Capacitor
it will be able to respond to the growing varieties of
Taiyo Yuden Co., Ltd. announced details of the noise which will accompany the trend towards PAS can store a large number of ions into
commercial release of the “AMK212BJ107MG” increasingly multifunctional devices in areas its amorphous structure (doping), therefore
(2.0x1.25x1.25mm), achieving an industry- such as advanced mobile phones, exemplified PAS capacitor has much larger capacity than
leading capacitance of 100μF in an EIA 0805 by smart phones, which continue to become conventional electric double layer capacitor.
size multilayer ceramic capacitor. evermore compact... In addition, PAS is extremely stable material and
For further information click here. PAS capacitor shows excellent performance of cycle...
With this release, the lineup of multilayer...
For further information click here! For further information click here!
18 March ½3><7AAC3<!
Image Sensors Europe 2011 Connectors for Sensors
two pre-conference workshops are announced meet IP 69K for hydraulic and mobile use
Portable healthcare devices help medical professionals to monitor vital signs, restart the heart, and look
inside the body with ultrasound before the patient is taken to the hospital. Today, patients are also using
portable medical equipment at home to monitor blood pressure, lung capacity, glucose levels, and log heart
events. Many portable medical devices come with USB or wireless data connections, allowing medical professionals to
monitor patients 24/7 in the hospital and at home.
B
he Continua Alliance is establishing the a long standby time. As different as the end before recharging or replacement is required)
interoperability protocols based on USB, applications may be, most portable systems is determined by power system elements such
Zigbee and Bluetooth standards that can be simplified to a core set of functions: a as battery capacity, power system efficiency,
will accelerate the adoption of communication sensor to collect data, a microprocessor with and power management software. Battery
interfaces. The requirements for increased application specific software to analyse the life can be maximised only when all of these
computing power, smaller size, and longer data, memory to store the software and data, power system elements are working together
runtime when operating on battery power make and a data connection to access the results. to reduce the drain on the battery. Most high-
the power system design for portable medical Figure 1 shows a typical handheld portable performance portable systems are powered
devices very challenging. system with keypad and display. by rechargeable Lithium-Ion batteries with a
Portable medical systems cover a wide range of Portable systems must be capable of maximum nominal 3.6V output.
applications, including blood pressure monitors, processing power when connected to the
glucose meters, pulse oximetry and ultrasound. power line without generating excess heat, Battery operation
Some applications require the hardware to and maximum battery lifetime when portable. There are multiple ICs, each with its own
operate for long periods of time, while other Maximum battery life (the time that the optimised semiconductor process and
applications require a short operation time and portable device can operate from the battery operating voltage requirements, in portable
systems. ICs designed for portable applications
use a lower operating voltage than supplied
by the battery, creating the need for step down
voltage regulators. The most popular regulators
in use today are LDO (low dropout) and step-
down switching regulators (Figure 2). An LDO
consists of a voltage reference, error amplifier,
voltage divider and a pass transistor. The low
dropout regulator is a simple way to produce
a lower DC voltage from a higher one using
only two external capacitors. Unfortunately,
LDOs can be inefficient when Vin is much
greater than Vout because power not delivered
to the load is lost as heat. LDO efficiency is
Figure 1: Generic handheld portable system. approximately (Vo/Vin)×100%. The LDO has
20 March ½3><7AAC3<!
ons for portable medical devices
system voltage from 3.6 to 1.2V to power a
microprocessor core with a load current of
300mA, the LDO efficiency is approximately
1.2 or 3.6V × 100%, or 33%, with 67% of the
input power lost to heat.
Temperature efficiency
To improve efficiency and lower the operating
temperature, engineers can replace the
LDO with a buck converter such as Analog
Devices’ ADP2108. A buck achieves higher
efficiency because energy is stored in the
inductor’s magnetic field. Using ADIsimPower,
the ADP2108’s efficiency for the same
conditions is 80%, an improvement of 48%
over the LDO. The device uses only two
decoupling capacitors and a 1μH chip inductor,
making it almost a drop-in replacement for the
LDO. Additional power saving features to look
for when specifying buck converters are low
quiescent current, enable, and a power saving
mode when the load current is small.
Optimising portable system hardware efficiency
will not achieve optimum battery life without
Figure 2. Functional block diagram for LDO and buck converter. also optimising the power management
software. System efficiency can be improved
no way to store significant amounts of unused battery life. The ADP150 is a good example of a by selecting the optimum processor speed for
energy, so power not delivered to the load is low Iq LDO. the application. Another way to save power
dissipated as heat within the LDO. For example, When the supply voltage is much greater in portable systems is to shutdown unused
a 2.6V LDO connected to a 3.6V battery has than the operating voltage, switching DC/DC subsystems such as the microprocessor,
72% efficiency. converters are a better choice for high efficiency display backlighting, data port, and sensors
Low quiescent current (Iq) increases system because they transform one voltage to another, between measurements, using the regulator’s
autonomy by consuming less power when temporarily storing energy in an inductor’s enable input or load switches such as the
the system is in idle mode between normal magnetic field and then releasing it to the load. company’s ADP190 or ADP195 to isolate the
operation and sleep modes. An enable input System efficiency can be improved by replacing battery (Figure 1).
pin permits the LDO to shut down, consuming an LDO regulator with a buck regulator. For ANALOG DEVICES
less than 1μA in sleep mode and increasing example, when using an LDO to lower the www.epn-online.com/search?search_keyword=43946
3><7AAC3<!½March 21
;3271/:3:31B@=<71A
22 March ½3><7AAC3<!
fischer
Ultrasound Driver Chipsets connectors
push- pull
generate a high-resolution, five-level waveform
Healthcare Tracking Tag Audio Decoders With ROM Colour Camera Head Sensor
MEMS-based tracking developed for biobanks provide alarms for remote monitoring is miniature and lightweight for endoscopes
REDEL XP Series
Patented Push-Pull system
Sterilisable
Solder, crimp and print
contacts
4 to 22 contacts
Gray, black or white
outershell
XLN Fixed socket XAN Straight plug Colour coding: red, gray,
with key(s) and nut fixing with key(s) and cable collet white, black, green, blue,
yellow
100% scoop proof
ergonomic design and
comfortable grip
XKN Fixed socket XRN Free socket
with key(s) and two nuts with key(s) and cable collet
(back panel mounting)
26 March ½3><7AAC3<!
<3E>@=2C1BA
Male headers for the through hole reflow soldering technique (“THR”)
Fischer Elektronik are able to offer their customers with immediate effect a new
design of male headers suited to the “through hole reflow soldering technique”.
The headers are available in single and double row design with 1-36 poles (single
row design) and 2-72 poles (double row design) with five different pin lengths.The
“through hole reflow soldering technique” offers the same degree of mechanical
stability as the standard soldering-in process and can be applied using the surface mounting technology
(SMT). The insulators are made from high temperature-resistant plastic and are designed for processing using
the SMT soldering technique. The contacts are available in three versions, i.e. partially gold plated (plug-in
area gold plated - soldering area tinned), completely gold plated and completely tinned. All three versions are
provided with a nickel insulation layer. The soldered side has a pin length of 2mm. This is inserted into the PCB
holes filled with filler metal (diameter 1 mm).The filler metal deposits on the contacts and is then soldered to
the PCB by the through hole reflow soldering technique (THR).
30 March ½3><7AAC3<!
3;0322321=;>CB7<5
Modern devices tend to have wireless interfaces like those based on WiFi, Bluetooth or NFC, which have
different properties with respect to range, data rate and mobility. In the future, the exchange of data to and
from an embedded device will probably be over a wireless interface. Electronic terminals will store medical
records and be synchronised with a patient’s local bed-units or a central server. There will also be wireless payment
systems that will need to be secure.
4
rom a software perspective transmission covering a few
it is important to seamlessly metres. These are mainly non-
and reliably integrate licensed frequency bands that
wireless technology into the can be provided at lower cost.
embedded system and prevent The use of infra-red technology
unauthorised access. (IrDA) for transmission is
In virtually all cases wireless becoming obsolete. More
transmission is performed via interesting technologies are
electromagnetic radiation of a Bluetooth (IEEE 802.15.1) or
different frequency. The properties NFC, Near Field Communication
of the air interface of technologies (ISO/IEC 14443).
differ in: range and data rate; ZigBee (based on IEEE
transmission power; mobility i.e. 802.15.4) focuses on low-
how fast the endpoint may move; Figure 1: Comparison of wireless technologies with the OSI cost implementation of low
duplex, or time division versus reference model. bandwidth (20 to 250kbit/s) at
frequency division; encryption, 10 to 75m and very low power
and modulation. well as the use of access control consumption (1mW).
The capability of the endpoint is limited (authentication), secure data In the range of up to a few hundred
by its hardware and the embedded storage, separated software modules and, metres there are two popular standards.
software running on it. The endpoint is if necessary, virtualisation to integrate One is wireless LAN technology (WiFi
where the protocol stacks are running, existing and potentially unsecure - IEEE 802.11a, b, g, n) that can be
where the data is generated, received software. Finally, power consumption has regarded as the replacement of wired
and stored. This influences reliability and to be kept within reasonable limits. Ethernet. The other is the DECT Standard
stability as well as its capability to resist (ITU IMT-2000), known for wireless
attacks. Network types telephony.
One key to security is the encryption In short distance communications, Technologies covering several km,
of the data on the air-interface as frequencies and power ranges provide normally need the frequency bands to
32 March ½3><7AAC3<!
be licensed. One exception is the with 79 channels. This results in a focuses on layers 1 and 2. For NFC
so-called Muni-WiFi, which uses a maximum transmission rate per and Bluetooth the assignment to
network of distributed WiFi access channel of 1Mbit/s with Bluetooth the layers it not obvious, particularly
points to set up a virtual urban WAN. 1.1 or 2 to 3MBit/s respectively with with respect to layers 3 to 7.
A real WAN technology is WiMax (IEEE Bluetooth 2.0 and EDR (Enhanced Especially with Bluetooth, a host
802.16), for example. It uses a data-rate Data Rate). control interface serves between
of 35 to144Mbit/s and reaches a the host stack and the Bluetooth
maximum distance of 50km. For WAN Near Field Communication controller.
we need to talk about the mobile When looking for a wireless technology When integrating protocols into the
radio communication standards, for very short distances, NFC (ISO/IEC embedded software, the protocol
like GPRS with data rates of 56 to 18092:2004) is a candidate. Physically standards need to be met. The
114kbit/s, UMTS-TDD (ITU IMT-2000) NFC is based on ISO/IEC 14443 conformance to the standard must
with data rates of up to 7.2Mbit/s (13.56MHz), which is also used in to be verified by validations and
or HSPA with data rates of up to RFID. The range is usually below 20cm interoperability tests. However, this is
42Mbit/s. There are many other and the possible data rates are also not enough to make sure the system
technologies LTE, iBurst, WiBro and very small (106, 212, 424 or 848kbit/s). is secure. The underlying OS and the
EVDO, for example. The transmission power is also very low system architecture need to support
and it is possible to build NFC devices reliable and secure operation of the
Bluetooth that operate in passive mode, i.e. software. It is mandatory to separate
Wireless LAN (IEEE 802.11) usually without their own power supply. In critical parts, like those handling
replaces Ethernet in the physical layer of that case they get their energy from sensitive data, from the less critical
communications and is mainly used for the RF field via induction. NFC supports portions, like the user-interface, for
transmission of TCP/IP traffic. Typically several modes of data transmission example. Furthermore the OS needs to
the endpoints send with a power of 25 including encryption, based on Mifare guarantee memory, CPU-time and other
to 30mW, where the legal maximum is (Philips) or Felica (Sony) technology, for hardware resources to the separated
at 100mW in the EU. example. software modules. A micro-kernel OS
In the early days of WiFi, the encryption In general, looking at mobility only would put most of the code into user-
and authentication were based on WEP makes sense with LANs and WANs. In a mode and reduce critical code in the
(Wired Equivalent Privacy) that is now PAN, the mobility is limited by the short kernel. The more code is running in
proven to be insecure. In 2003 it was range of the underlying technology. As kernel-mode, the bigger the risk that
replaced by WPA (WiFi Protected Access) the data rate increases, the mobility of a software bug can crash or expose
or WPA2 (IEEE 802.11i). It uses a four- the endpoint is reduced. the system.
way handshake for authentication and A kernel separates and guarantees
for the exchange of keys. Alternatively, Software Integration resources and executes drivers in user-
WiFi supports the use of a Radius server The main goal of the software mode. Virtualisation is not a requirement
for authentication, authorisation and integration is the correct implementation to achieve a secure system. However, it
accounting. of the respective protocol stacks. can add features to extend an already
In the same way as WLAN, Bluetooth Figure 1 shows how WLAN, NFC and secure device.
transmits in the 2.4GHz frequency band Bluetooth compare to the OSI reference- GREEN HILLS SOFTWARE
and uses a total bandwidth of 83.5MHz model. The main part of these protocols www.epn-online.com/search?search_keyword=43875
3><7AAC3<!½March 33
3;0322321=;>CB7<5
Cell Development Range Small Form Factor Module Single Board Computers
has hardware and open source software supports two independent video channels can be used in military, aero- and transport
< etworking
company
Multi-Tech
B he range of Intel processor-based
COM Express products available from
Congatec has been expanded with the
1 oncurrent Technologies claims
that the TR 80x/39 is the first 3U
OpenVPX high performance embedded
Systems’ Cellular highest performance module, conga-BM67. SBC to feature the Intel Core processor
Develop- It features the Core i7-2710QE processor and Intel 6 series chipsets. It has
ment Platform operating at 2.1GHz at 45W; and the dual- enhanced processing
embeds the company’s modems directly core Core i5-2510E processor, operating at and graphics
into applications that require cellular data 2.5GHz at 35W. It has up to 8Gbyte dual performance
connectivity. It can be used for health moni- channel DDR3 memory at 1333MHz. The with the quad-core
toring systems; roadside signage or fleet module has uses the QM67 Express chipset. Intel Core i7-2715QE
management applications; smart metering The processor graphics supports Intel’s flex- processor and the
or other instances of remote monitoring ible display interface, which allows for two dual-core Core i5-2515E processor and
and management of connected devices. An independent video channels on the VGA, maintains the power consumption of the
ARM9, 400MHz processor runs the compa- LVDS, HDMI, DisplayPort or SDVO interfaces. previous Core processors. The 3U OpenVPX
ny’s CoreCDP distribution version of Linux According to the company, a major high- processor board supports quad-core or
and is combined with the Linux build envi- light of the Type dual-core processors, up to 8Gbyte of ECC
ronment, allowing developers to access the 2 pinout COM DDR3 SDRAM, configurable PCI Express
open source software within the community Express Basic fabric interface supporting 1 x8, 2 x4,
and to create custom applications. Existing module is the 1 x4 + 1 x4 at Gen 1 or Gen 2 data
applications can be incorporated and run boost in graphics rates, dual Gigabit Ethernet or dual
with little or no modification, claims the performance. 1000Base-BX channels, dual SATA600,
company. Field-tested hardware eliminates The 3D performance has been increased o single XMC slot, serial RS232/422/485
the need for developers to conduct carrier be used in gaming, medical, automation or port, dual USB 2.0 ports, independent
and regulatory approvals, including FCC, IC, digital signage applications. Six PCI Express VGA and display port all. The board can
UL, PTCRB and R&TTE. According to Adrian lanes, eight USB 2.0 ports, four SATA with be used for security, transportation,
Girling, the company’s EMEA director, the RAID support, one EIDE and a Gigabit military and embedded systems as well
platform can reduce the software develop- Ethernet interface allow for system exten- as control systems and video signal
ment cycle to just four months and reduce sions. Fan control, LPC bus for slow speed processing. Operating systems currently
expenditure by nearly 25% compared with extensions and Intel High Definition Audio supported are Windows 7, Windows XP,
outsourcing or building the hardware, are also included. All modules are equipped Windows Embedded Standard 7, Linux
software and complying to certifications with an embedded UEFI and board controller and VxWorks. The SBC is available in
in-house. It combines hardware and the that enhance embedded features such as three temperature grades; 0°C to +55°C
Linux environment in one unit and includes system monitoring, watchdog timer and the (N-Series), -25°C to +70°C (E-Series),
interfaces for serial, USB, Ethernet and SD I²C bus. The board controller can isolate itself -40°C to +85°C (K-Series). For extreme,
cards with internal peripherals including a from the main x86 processor and provide rugged applications computer is available
cellular modem and GPS receiver. these features even when in standby mode. in VPX-REDI variants.
MULTI-TECH SYSTEMS CONGATEC CONCURRENT TECHNOLOGIES
www.epn-online.com/search?search_keyword=43696 www.epn-online.com/search?search_keyword=43811 www.epn-online.com/search?search_keyword=43814
34 March ½3><7AAC3<!
3;0322321=;>CB7<5
36 March ½3><7AAC3<!
Quad-Core Processor Module Multi-Port PCI Computers
has USB 3.0 and digital display interfaces low profile and standard height versions
/ COM from
Kontron is
claimed to have all
0 rainboxes has added three products
to its uPCI communication cards
range, adding four RS232 ports with
the innovations of an LPT port to PCI-based computers in
the PICMG COM 0 a variety of profiles. The UC-263 is a
revision 2.0 specifi- low profile
cation for application developers. The basic card occupying
form factor ETXexpress-SC COM has an one PCI slot. It
Intel Core i7 2715QE quad-core processor, provides four
Intel Mobile QM67 I/O Hub and USB 3.0. RS232 ports on
They are available with the Type 2 or Type the bracket via
6 pin-out of the PICMG COM Express rev a high density
2.0 specification. The modules integrate the connector.
monolithic Intel microarchitecture with a The 1m spider cable brings these out as
CPU, graphics and ECC memory controller four, industry standard, 9pin male RS232
as well as a PCI Express controller all on ports. A fly lead makes the LPT port acces-
an energy-efficient 32nm die. First bench- sible via the industry standard 25pin
marks show a performance gain of 205% female D connector. The second addition,
for the CPU (Dhrystone Alu MIPS) and a the UC-295 is a standard height version
170% graphics performance improvement of the UC-263. Finally, the UC-414 is a
(3DMark06) as compared to platforms standard height PCI card occupying one
with the previous Intel Core i7 processor PCI slot and providing three industry
and comparable core speed. With the Intel standard 9pin D RS232 ports on the
iGFX Gen6 graphics, the company says bracket with a further 9pin D RS232
that 2D and 3D graphics performance, on port and 25pin D LPT port on a fly lead.
par with dedicated graphics cards, is now All have LPT printer port connectivity
available. Applications that are built around providing fully bi-directional standard
the modules will be able to simultaneously printer ports for backwards compatibility
use two high-quality HD video streams, with peripherals. Cards are supplied with
enabling economic multi-display solu- an installation CD including manual,
tions with one platform supporting several Microsoft signed drivers and utilities.
displays. The module can be used for The company is a Microsoft Certified
feature-rich, graphics-oriented applications Gold Partner and these cards are compat-
such as digital-signage servers running ible with 32- and 64 bit editions of
several displays, gaming systems and high- Windows 7, Server 2008, Vista, XP,
performance medical appliances. Server 2003 and 2000.
KONTRON BRAINBOXES
www.epn-online.com/search?search_keyword=43812 www.epn-online.com/search?search_keyword=43874
@3>=@B/53
AMD has introduced the first accelerated processing unit, or APU, based on Fusion technology. The
Embedded G-Series processor architecture has been adopted by several companies to raise the bar on
graphics and performance for embedded systems. At this year’s Embedded World in Nuremberg, Germany
(1 to 3 March) several companies will be showing how G-Series technology can be used.
B
he AMD Embedded G-Series (Figure enable graphics-intensive design, such Specifications
1) is based on the company’s as in digital signage, internet-ready set The series is made up of one or two
Fusion technology. The single piece top boxes, mobile and desktop thin clients, cores with 1Mbyte L2 cache, 64bit
of silicon incorporates the low-power, casino gaming machines, point-of-sale floating point unit. The processors
x86 CPU based on the Bobcat core, with kiosks, and small form factor PCs, as well operate at up to 1.66GHz and have a
DirectX 11-capable GPU and parallel as SBCs. choice of SIMD engines, such as the
processing engine. It is described as a The open development ecosystem for the DirectX 11-capable graphics as well as
new class of accelerated processor and Embedded G-Series platform includes 3D and graphics processing. There is also
the company claims that it combines more multiple BIOS options, support for various a third generation unified video decoder.
compute capabilities on a single die than Microsoft Windows, Linux, and real-time For power management there is C6 and
any processor in the history of computing. operating systems, the integrated OpenCL power gating. There is a DDR3 800-1066
The company identified that the embedded programming environment, and source- memory with support for 64bit channel
market is calling for increased power level debug tools. and two DIMMs. All of this is packaged
efficiency, reduced footprint, high CPU in a BGA with a physical footprint
performance, full feature sets with an of 890mm², including the Fusion I/O
emphasis on graphics performance to controller hub. AMD is exhibiting at
produce the APU. Embedded World, Hall 9: 557.
Differentiation can be the critical factor One manufacturer to use the technology
in a product’s success and longevity in is Congatec, in its COM Express line.
the market. Chris Cloran, corporate VP Visitors to Embedded World will be able
and GM, Computing Solutions Group, to see the conga-BAF (Figure 2)
AMD said “By combining the processing in Nuremberg (Hall 12: 122).
of the CPU with the GPU on a single The COM Express standard has been
energy-efficient chip, customers can take expanded with the Fusion technology to
advantage of better price/performance, combine processors and graphics cores
superior 1080p HD playback, and small Figure 1: Embedded G-Series APUs raise in a compact package. It boasts a strong
form factors for innovative designs.” the bar on graphics, power and processing performance/W ratio and flexible task
The power of the architecture will performance. allocation on the CPU and GPU. The
38 March ½3><7AAC3<!
module can stream high-definition provided by the Embedded
multimedia content and play the G-Series platform.
next-generation 3D games.
The company integrates five Three versions, one company
processors from the series, from Kontron has introduced three
the T44R 1.2GHz single-core small form factor embedded
(64kbyte L1 cache, 512kbyte L2 platforms based on the Embedded
cache) with 9W TDP to the T56N G-Series. It has developed COMs,
1.6 GHz dual core (64kbyte L1 embedded motherboards and
cache, 512kbyte x2 L2 cache) SBCs for multimedia delivery
with 18W TDP. The module uses applications based on the
the Hudson E1 Fusion controller APUs’ energy efficient processor
hub and provides a two-chip cores and advanced GPU with
solution with up to 8Gbyte support for DirectX 11.
dual-channel DDR3 memory. The COM Express will debut
The integrated graphics core with Figure 2: Congatec capitalises on the graphics performance at Embedded World (Hall 12:
the Universal Video Decoder 3.0 in the conga-BAF. 404), followed by a compact
for seamless processing of Blu- embedded motherboard and an
ray content via HDCP (1080p), MPEG-2 a durable, fanless casing for what it ultra-small SBC in Q2 2011. Additionally,
HD and DivX (MPEG-4) video interfaces says is its most powerful, miniature, with the support for OpenCL and
supports DirectX 11 and OpenGL 4.0 fanless IPC to date. Microsoft DirectCompute, parallel
for fast 2D and 3D image display as The IPC measures 6.3x6.3x0.98inch processing executed by the graphics
well as OpenCL 1.1. The choice of and exploits the APU’s low power core will speed up vector processing
graphics interfaces includes VGA, x86 CPU and discrete-class GPU to applications such as situational
single channel LVDS as well as provide performance, visual experience awareness and video surveillance
DisplayPort and DVI/HDMI for direct and features that are claimed to be required by the industrial automation,
control of two independent displays. comparable to much larger systems military and medical markets where
Six PCI Express x1 lanes, eight USB while consuming a fraction of the power. radar, sonar and image recognition
2.0 ports, four SATA, one EIDE and Irad Stavi, director of business will benefit from where the advantages
one Gigabit Ethernet interface allow development, CompuLab said. “We of the built-in GPU for cost savings
flexible system expansion with high expect that the dual-core CPU, visual compared to using a number of
data bandwidth. The board controller performance, low power and the x86 multi-core processors.
features, ACPI 3.0 power management eco-system provided by the platform AMD
and high-definition audio complete the together with the small size, durability www.epn-online.com/search?search_keyword=43883
package. and versatility of the fit-PC3 design CONGATEC
will prove an attractive combination for www.epn-online.com/search?search_keyword=43884
Computing design many industry segments.” COMPULAB
CompuLab has selected the Embedded The IPC can host an extension card www.epn-online.com/search?search_keyword=43910
G-Series as the basis for its next- that can be tailored to fit custom I/O KONTRON
generation fit-PC3 with a design in requirements for the set of interfaces www.epn-online.com/search?search_keyword=43885
3><7AAC3<!½March 39
3;032232E=@:2>@3D73E
EPN
Hall
11: 228
EDN
Hall
11: 228
40 March ½3><7AAC3<!
boards. systems. solutions.
Computers
Single Board Computers Cortex Microcontrollers Embedded
rmany.
based on i7 core and QM57 Express chipset have 12Mbit/s USB-device connectivity Made in Ge
om
www.ekf.c