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16 ⋅ Tclk 9 ⋅ τ
f = ⋅ = 288 and will make the CDAC noise REF
0.5 ⋅ Tclk 1 ⋅ τ 0V
insignificant compared to other noise sources.
Due to the power saving and the better noise performance, the
solution with external capacitor should be chosen. However,
this adds several requirements to the reference buffer. Beside
the stability issue, the buffer must have a good load regulation,
because it has to provide the code dependent current into
REFIN without changing the voltage more than half an LSB, DAC
because the code dependency will cause linearity errors. 0V
In the example of the 2MSPS, 12 bit SAR converter, the total
Fig. 3. String DAC architecture
ADC capacitance CADC is 6pF, the maximum current IREF can
be calculated to:
∆QREF I REF IV. NEW REFERENCE CONCEPT ADDING A DAC
C ADC = = ⇔ I REF = C ADC ⋅ REF ⋅ f conv = 30 µA
REF REF ⋅ f conv The voltage divider is realized with a programmable internal
The load regulation of the buffer has to be better than: digital-to-analog converter (DAC). The best fitting architecture
dREF 0 . 5 ⋅ LSB mV (3) is a string DAC, which is a resistive voltage divider [2].
< = 20 Switches are placed at each interconnection of the resistors, so
dI REF I REF , max mA
that the voltage of interest can be chosen (Fig. 3).
Resistors typically show a severe temperature coefficient, but
III. REFERENCE REQUIREMENTS OF THE in this case, only the resistor matching is important, so that the
APPLICATION temperature drift of the DAC output remains low.
A typical application has its specific input voltage range. As there is no DC current through the switches, the differential
Optical encoders, which are often used for position non-linearity (DNL) of the DAC is also purely dependent on
measurements in electrical motor control, have an output range the resistor matching and on the layout of the interconnections.
of 1Vpp. The same application might also use resolvers, which A good DNL is important in this application, so that the
have an output voltage range of ±2.5V around a common mode reference can be adjusted without gaps.
voltage that often is identical to the reference. The input range The voltage coefficient of the resistors and the layout might
of the ADC is often adjusted to the needs of the application by generate some integral linearity errors. In most applications,
dividing the reference voltage externally (Fig. 1). the gain is calibrated. If calibrated, then the DAC can be
The reference divider will increase the input impedance of the readjusted until the ADCs input range fits the applications
reference, which must remain below the load rejection needs. An integral linearity error is therefore less critical.
calculated in equation (3). The divider can therefore only be The output of the DAC can now be buffered with an on-chip
implemented, if its output is buffered with an additional amplifier, which was already required for the reference output
amplifier. Such amplifiers, which can drive a capacitive load, without the string DAC. However, the amplifier needs to be
are adding essential costs to an application. The concept of Fig. modified, because it has to be insensitive to external capacitors
1a would be preferred. even with some lead inductance being in series.
The new reference architecture (Fig. 2) will satisfy all
requirements by adding the divider and the buffer inside the V. NOISE ADDED BY THE DAC
converter. The reference output is adjustable and no external
Unfortunately, resistors are adding thermal noise to the
components are required beside CREF.
electrical circuitry, which will couple into the ADCs signal
path. The noise [3] of resistors is given to
REFOUT vn2 = 4kTRDAC ∆f (4)
Internal
Reference T is the absolute temperature, k the Boltzmann constant
(1.38·10-23JK-1), RDAC the output resistance of the string DAC
and ∆f the effective noise bandwidth. Reducing the resistance
DAC could lower the noise, but would generate a higher current
REFIN through the string DAC and add power dissipation. Therefore,
ADC CREF the bandwidth needs to be limited to minimize the noise of the
DAC. A capacitor CDAC has to be placed at the output of the
0V DAC, which forms a pole at the output with the -3dB
frequency being
Fig. 2. New reference architecture with internal DAC and buffer
1 (5)
f − 3 dB =
2π ⋅ R DAC ⋅ C DAC
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the input stage of the amplifier (Fig. 5) in eight differential
v n2 Distribution of thermal noise pairs and connecting them either to the upper or the lower
∆f terminal of the resistor of interest [4]. If the three LSBs for
example are programmed to 011, then three of the eight
differential pairs are connected to the higher voltage side of the
f chosen resistor, the other five differential pairs to the lower
voltage side.
Transfer Function of a low-pass filter FRC(f)
Fig. 5 further shows a NCH and a PCH input stage. This is
0dB
f-3dB f necessary as the analog supply AVDD can drop all the way to
2.7V. A rail-to-rail amplifier is required, as the DAC output
can be varied from 0.2V to 2.5V. Rail-to-rail amplifiers
typically change the input stages over a certain input voltage
v n2 Filtered noise distribution range. Within this range, the transfer function is very non-
∆f linear due to the different offsets of the two differential pairs.
Due to this effect, the power supply rejection and therefore
v n2
noise rejection are also very poor within this voltage range.
As the noise of the ADC is more important than the linearity of
f-3dB f the DAC, the amplifier changes the input differential pair at a
Fig.4. Effective noise bandwidth particular code 508 controlled by the signals range and xrange.
A systematic offset is added to ensure that rather an overlap
Fig. 4 shows that noise above f-3dB is suppressed, but not instead of a gap is generated in the transfer function of the
eliminated. Integrating the transfer function FRC(f) will result in DAC.
an effective bandwidth of The 7bit resistor string with 128 resistors, the respective
π 1 (6) switches and the output capacitors is optimized in size. It only
∆ f = ∫ F RC ( f ) df = f − 3 dB = consumes 100x300µm, which is less than 1% of the total die
2 4 ⋅ R DAC ⋅ C DAC
size. The layout of the DAC is shown in Fig. 6.
The noise contribution of the string DAC can therefore be
summarized to
kT (7)
v n = 4 kTR DAC ∆ f =
C DAC
The same noise equation is valid for the sampling process of
the ADC. CDAC has to be designed essentially larger than the
sampling capacitor of the ADC to make the DAC noise
insignificant. Fortunately, the reference is a constant voltage,
so that the voltage coefficient of the capacitor is uncritical.
A high density gate capacitor (Poly-NWell, 2 . 5 fF ) can be
µm 2
used for CDAC, while the sampling capacitor of the ADC
requires a material with low voltage coefficient like Poly-Poly
or Metal-Metal capacitors, where the capacitive density is only
fF or less. In addition, the layout can be implemented
0 .8
µm 2
very area efficient, because CDAC does not have to match to
other capacitors like the sampling capacitor does. In the
particular 12bit design, CDAC was chosen to 20pF, while the
Fig. 5. Amplifier input stage with 3 bit interpolation
sampling capacitor is only 2pF. Furthermore, the ADC has two
sampling capacitors, one for the positive input and one for the
negative input, so that the sample noise vnsamp=64.3µVrms. If
the DAC noise is added geometrically to the sampling noise,
then the sum is vnsamp+DAC=65.9µVrms. It can be seen that the
DAC noise is indeed insignificant.
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The particular CMOS process includes thin-film resistors,
Load Rejection
which provide an excellent voltage and temperature coefficient. 2 .50 0 6
The resistor size was chosen to 5kΩ, so that the total size of the 2 .50 0 4
REF in V
string adds to 640kΩ. This forces a DC current of only 4µA out 2 .50 0 2 5V
of the bandgap circuitry. 2 .5 3.3V
If the bandgap is assumed to an ideal voltage source, then the 2 .4 9 9 8 2.7V
maximum output resistance occurs at code 512, where 320kΩ 2 .4 9 9 6
are connected from the DAC output to the bandgap and the -2 -1 0 1 2
358
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