- 1 - Feiling Embedded

OK6410 Development Board Hardware Manual

-2-
Manual Version
Update Summary
V2.0
V2 version of the first edition.
V2.1
1. According to the new version of the schematic diagram, schematic section of this
manual corrections.
2. Add a chip, the interface picture.
3. Add chip pinout description.
4. Add-use development board considerations.
5. Add Crystal description.
6. Add the power chip instructions.
-3-
About eleven OK6410 Development Board
With the rapid development of microelectronics technology, ARM processor
experience, including ARM7, ARM9, including a number of development process, and
the ARM11 embedded mature application development will bring new vitality to make
more high-end product applications possible.
And 5-stage pipeline, compared ARM9, ARM11 has a load-store with a separate
water and 8-stage pipeline arithmetic, under the same process, ARM11 and ARM9
processor performance increase compared to about 40%. ARM11 instruction
execution ARMv6 architecture, ARMv6 instruction includes media processing for a
single instruction stream multiple data stream (SIMD) extensions, using a special
design to improve video processing performance. To be able to fast floating-point
operations, ARM11 increased vector floating point unit. All of these structural
improvement is unparalleled ARM9 processor.
ARM11 for portable and wireless applications, providing superior performance never
seen before, and so our main concern to minimize the cost and power consumption.
ARM11 micro-architecture of the system performance can be guaranteed a basic 350-
500MHz 1GHz extend to the final over. The performance of high efficiency micro-
architecture that allows application developers to adjust according to different clock
frequency and supply voltage, resulting in performance and power consumption to
achieve the best compromise between. For example, a micro-architecture based on
ARM11 processors in the 1.2V supply voltage, using 0.13um process to achieve, its
power will not exceed 0.4mW/MHz.
ARM11 microprocessor is a high performance, low power consumption of the
'standard 64' microprocessor! Most embedded applications for a true 64-bit
processors are still considered unnecessary, and its enormous power and area
unacceptable. In this regard, ARM11 chose a compromise solution with little cost, part
of the implementation of a 64-bit micro-architecture. ARM11 integer unit only in the
processor and cache, and between the whole units and between co-processor 64-bit
data bus. The 64-bit data path allows the processor in one clock cycle to obtain two
instructions simultaneously, but also allows one clock cycle to execute multiple data
read and write commands. This makes the ARM11 in the implementation of many of a
particular code sequence to achieve very high performance, especially those that
allow data movement and data processing of parallel processing code sequence.
S3C6410 Samsung introduced by a low-power, cost-effective RSIC processor, which
is based on ARM11 core (ARM1176JZF-S), can be widely used in mobile phones and
general treatment and other fields; S3C6410 as 2.5G and 3G communication services
provide optimized hardware performance, built-in powerful hardware accelerators
include: sports video processing, audio processing, 2D acceleration, display
processing and scaling; integrates a MFC (Multi-Format video Codec) support
MPEG4 / H.263 / H H.264 and VC1 decoding codec that provides real-time video
conferencing and the NRSC and the TV standard PAL output; In addition, the
processor built using the most advanced technology of a 3D accelerator, support for
OpenGL ES 1.1 / 2.0 and D3DM API, to achieve 4M triangles / s of the 3D
acceleration; the same time, S3C6410 includes the optimization of the external
memory interface, the interface in the high-end communications services to meet the
data bandwidth requirements. Outstanding performance of the above, the famous
Apple IPHONE mobile phone is based on S3C6410 processor.
OK6410 development board based on Samsung's latest ARM11 processor S3C6410,
has a strong internal resources and video processing capabilities, more stable
operation in the 667MHz frequency to support a variety of Mobile DDR and NAND
Flash. OK6410 development board integrates a variety of high-end interfaces such as
composite video signal, camera, USB, SD card, LCD screen, Ethernet, and equipped
with temperature sensors and infrared receiver top. Application of these interfaces can
be used as reference to help users achieve high-end product-level design.
-4-
OK6410 development board using 'core board + chassis' structure, core board size
specifications for the '5 CM × 6CM ', floor size '10 .5 CM × 14CM', the core plate and
the bottom 4 between the use of imported high-quality connectors (nickel and gold
technology, access to good, antioxidant), a total of 320 pins (80 × 4), the second
development to facilitate customers to conduct various forms of extended application.
OK6410 development board designed in strict accordance with CE, CCC certification
standards and other electronic products at home and abroad, to fully consider the
high-speed signal integrity, electromagnetic compatibility measures to ensure OK6410
development board in the harsh electromagnetic environment of reliable operation.
OK6410 software system currently supports WinCE 6.0, LINUX2.6.28, Android2.1 and
uC / OS-II, provides a standard Board Support Package (BSP) and open source,
which contains drivers for all interfaces, customers can directly load use. In addition,
the board can be connected to the company with the support of Feiling serial port
expansion board for use, WIFI module, camera module.
-5-
OK6410 development board hardware resources twenty-two
-6 Core layer PCB board design, performance and stability, after a strong test of the
electromagnetic environment
Samsung S3C6410 processor, ARM1176JZF-S core clocked at 533MHz/667MHz; • •
Mobile DDR 128M bytes of memory; • •
1G bytes of NAND Flash (MLC); • •
12MHz, 48MHz, 27MHz, 32.768KHz clock source; • •
Support 5V voltage supply; • •
Board laminates designed -4
A reset button, reset the chip using a dedicated, stable and reliable • •
8-bit DIP switch used to set the system startup mode • •
4 serial ports, including a five-wire RS 232 level serial (DB9 female) and three three-
TTL-level • • Serial Port (20pin 2.0mm pitch socket)
1 100M Ethernet ports, with DM9000AE, with connection and transmission indicator
light • •
A USB HOST jack to support the USB1.1 protocol, plug the mouse, U disk, etc. • •
1 USB Slave interface, support USB2.0 protocol, using mini-USB socket, can be
connected with the PC • •
A high-speed SD card connector. SD Memory function can be achieved, and SDIO
capabilities • •
A wireless card (WIFI), the interface can be reused for the SD card interface • •
3 3.5MM standard stereo audio jack. These include an audio output jack can be
connected with headphones connected • •; a microphone input socket; a line input
jack
Touchpad interface supports 4-wire resistive touch pad; LCD interface supports 3.5-
inch, 4.3 inch, 5.6 inch, • • 5.7-inch, 7 inch, 8 inch, 10 inch TFT LCD, another
exclusive 10-inch LVDS LCD support
1 channel CVBS output (PAL / NTSC) • •
A CMOS camera interface, support ITU-RBT601/656 8-bit mode, using the 10 * 2 pin
connectors • • control
Internal real time clock with lithium battery back-seat, power-off time is not lost after
the system • •
A JTAG interface, using 10 × 2 pin connector • •
A single digital temperature sensor (DS18B20) • •
An infrared receiver • •
4 LED • •
A buzzer • •
3 '10 × 2 'pin expansion port. Among them, an extension of the port, including a road
GND, 1 Road, DA, 8 Road • • AD, 10 Road, IO, 1 Road, SPI; another expansion port
is used to extend the keyboard 8 × 8 matrix; the third expansion port 3 can be
connected TTL level serial port and 6-channel IO (Note: 3 serial ports, including a five-
wire serial port and two three-wire serial port)
-6-
OK6410 startup mode introduces three three
S3C6410 processor supports NAND FLASH, NOR FLASH and SD cards and other
boot method, through the system configuration pins on power to determine the
different states of the corresponding startup mode.
OK6410 development board through configuration DIP switch SW2 select startup
mode, as shown below:
SW2 Pin Pin 8Pin 7Pin 6Pin 5Pin 4Pin 3Pin 2Pin 1 start 10011XXXSD card pin
definitions SELNANDOM4OM3OM2OM1GPN15GPN14GPN13Nandflash start
X1111000 Note: (1) SW2 switch is ON when "1"; OFF when "0", "X" is high or low (2)
OK6410 development board factory default setting for the NAND FLASH boot mode
Startup mode related design method is as follows:
JTAGBOOT SELECTCOM0HOME: 9C560.1uC570.1uC630.1uC640.1u1C1 +2 V +3
C1-4C2 +5 C2-6V-
10T2IN9R2O16VCC15GND11T1IN12R1O13R1IN14T1O7T2O8R2INU5MAX202ER2
115KR715KR815KR915KR1015KR1115KR5315KR1215K123456781615141312111
0SW2SWITCH8R4115KR5215KVDD33VNRESETTDON48TCKTMSTDITRSTNRTCK
DBGSELVDD33VGNDGNDTXD0CTSN0RXD0VDD5VRTSN0VDD33VEINT15OM1O
M2OM3OM4SELNNDVDD33VOM0EINT14EINT13GND
'OM0' signal for the S3C6410 chip clock source select signal, when the 'OM0' signal is
"0" select 'XTlpll': When 'OM0' signal is "1" select 'EXTCLK'. Here, OK6410
development board using the 'XTlpll', so 'OM0' direct drop-down to ground.
'SELNAND' signal is used to select the system FLASH memory types, when the
choice must be high when the NAND FLASH '1 ', select ONENAND memory is low '0',
OK6410 development board NAND FLASH memory, so here directly on Access to
high.
'EINT13-EINT15' way of equipment selection for the IROM start pin, when using
IROM start mode, S3C6410 processor first firmware running on-chip ROM, read
EINT15, EINT14, EINT13 three port pin state, then under this configuration different
states, so choose a different startup. OM1-OM4 signal for the S3C6410 processor
startup mode configuration pins.
-7-
OK6410 hardware design description of the main four-four
NAND FLASH11
Latest OK6410 development board configuration 1G Bytes NAND FLASH, model
K9G8G08U0A (another SLC 256M bytes of K9F2G08U0M structure for users to
choose), chip select signal used CSn2. NAND FLASH memory used to store the main
kernel code, applications, file systems and data.
To facilitate the expansion of capacity, OK6410 designed to support dual-chip select
architecture NAND FLASH chip, chip select signals to use CSn2 and CSn3,
customers can be customized selection of 128M-2GB of space the size of the NAND
FLASH, the specific design see design schematics.
Note: OK6410 development board NAND FLASH memory, when using the NAND
FLASH boot, S3C6410 processor also configured CSn2, CSn3 for the NAND FLASH
memory chip select signal, so in this case CSn3 not connected bus devices other than
the NAND FLASH .
NAND FLASH design schematics:
HOME: FL6410 Core Board COMPANY: Forlinx Embedded TITLE:
www.forlinx.comMobile
FLASH1NC12NC23NC34NC45NC511NC614NC729I/O030I/O131I/O232I/O341I/O44
2I/O543I/O644I/O79CE110CE218WE8RE16CLE17ALE7R/B16R/B215NC820NC921
NC1022NC1123NC1224NC1325NC1426NC1527NC1628NC1733NC1834NC1935NC
2038NC2139NC2240NC2345NC2446NC2547NC2648NC2712VCC13VCC213VSS11
9/WP36VSS2U3K9GAG08R1710RR1810RR194.7kR204.7kC550.1uC570.1u +
C5610u + 0:15]
DATA0DATA1DATA2DATA3DATA4DATA5DATA6DATA7CSN2CSN3FWENFRENFC
LEFALERNBVDD_IOVDD_IOVDD_DQS2XM1_DQS3XM1_DQM2XM1_DQM3XM1_
DATA [16:31]
XM1_DATA16XM1_DATA17XM1_DATA18XM1_DATA19XM1_DATA20XM1_DATA2
1XM1_DATA22XM1_DATA23XM1_DATA24XM1_DATA25XM1_DATA26XM1_DATA
27XM1_DATA28XM1_DATA29XM1_DATA30XM1_DATA31
-8-
The following two figures, the first photo graph is K9G8G08U0A chip, the second
figure is the pin-points
Cloth. The first pin is the upper left corner of the first pin of the chip. K9G8G08U0A
located in the core board.
FLASH MEMORY
4
Preliminary
K9G8G08U0M
K9LAG08U1M
PIN CONFIGURATION (TSOP1)
K9G8G08U0M-PCB0/PIB0
48-pin TSOP1
Standard Type
12mm x 20mm
123456789
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
N.C
N.C
N.C
N.C
N.C
N.C
R/B
RE
CE
N.C
N.C
Vcc
Vss
N.C
N.C
CLE
ALE
WE
WP
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
N.C
I/O7
I/O6
I/O5
I/O4
N.C
N.C
Vcc
Vss
N.C
N.C
N.C
I/O3
I/O2
I/O1
I/O0
N.C
N.C
N.C
N.C
N.C
PACKAGE DIMENSIONS
48-PIN LEAD / LEAD FREE PLASTIC THIN SMALL OUT-LINE PACKAGE TYPE (I)
48 - TSOP1 - 1220AF Unit: mm / Inch
0.787 � 0.008
20.00 � 0.20
#1
# 24
0.16 +0.07
-0.03
0.008 +0.003
-0.001
0.50
0.0197
# 48
# 25
0.488
12.40MAX
12.00
0.472
0.10
0.004
MAX
0.25
(0.010)
0.039 � 0.002
1.00 � 0.05
0.002
0.05 MIN
0.047
1.20 MAX
0.45 ~ 0.75
0.018 ~ 0.030
0.724 � 0.004
18.40 � 0.10
0~8�
0.010
0.25 TYP
0.125 +0.075
0.035
0.005 +0.003
-0.001
0.50
0.020 ()
0.20 +0.07
-0.03
DataSheet4U.com
www.ic-cn.com.cn
22DDR memory
OK6410 development board configuration 128M Bytes Mobile DDR memory, using
two Samsung
K4X51163PC chip, DDR data bus frequency up to 266MHz
Chip BGA package with small size, PCB board layout give full consideration to
reflection, crosstalk and signal so long
EMC design rules to ensure reliable operation OK6410 development board.
Mobile DDR design schematics:
Mobile DDR
R19 R20 + C58
10u
C59
0.1u
C60
0.1u
C61
0.1u
C62
0.1u
C63
0.1u
C64
0.1u
C65
0.1u
C66
0.1u
C67
0.1u
J8 A0 J9 A1 K7 A2 K8 A3 K2 A4 K3 A5 J1 A6 J2 A7 J3 A8 H1 A9 J7 A10 H2 A11 H3
A12
H8 BA0 H9 BA1
G2 CK G3 CK
G9 RAS G8 / CAS G7 / WE
H7 / CS0 G1 CKE0
F3 NC/CKE1 F7 NC/CS1
B1 VDDQ1 D1 VDDQ2 A7 VDDQ3 C9 VDDQ4 E9 VDDQ5
A9 VDD1 F9 VDD2 K9 VDD3
DQ0 A8 DQ1 B7 DQ2 B8 DQ3 C7 DQ4 C8 DQ5 D7 DQ6 D8 DQ7 E7 DQ8 E3 DQ9
D2 DQ10 D3 DQ11 C2 DQ12 C3 DQ13 B2 DQ14 B3 DQ15 A2
LDQS E8 UDQS E2
LDM F8 UDM F2
VSSQ1 A3 VSSQ2 C1 VSSQ3 E1 VSSQ4 B9 VSSQ5 D9
VSS1 A1 VSS2 F1 VSS3 K1
U11
K4X51163PEL
J8 A0 J9 A1 K7 A2 K8 A3 K2 A4 K3 A5 J1 A6 J2 A7 J3 A8 H1 A9 J7 A10 H2 A11 H3
A12
H8 BA0 H9 BA1
G2 CK G3 CK
G9 RAS G8 / CAS G7 / WE
H7 / CS0 G1 CKE0
F3 NC/CKE1 F7 NC/CS1
B1 VDDQ1 D1 VDDQ2 A7 VDDQ3 C9 VDDQ4 E9 VDDQ5
A9 VDD1 F9 VDD2 K9 VDD3
DQ0 A8 DQ1 B7 DQ2 B8 DQ3 C7 DQ4 C8 DQ5 D7 DQ6 D8 DQ7 E7 DQ8 E3 DQ9
D2 DQ10 D3 DQ11 C2 DQ12 C3 DQ13 B2 DQ14 B3 DQ15 A2
LDQS E8 UDQS E2
LDM F8 UDM F2
VSSQ1 A3 VSSQ2 C1 VSSQ3 E1 VSSQ4 B9 VSSQ5 D9
VSS1 A1 VSS2 F1 VSS3 K1
U13
K4X51163PEL
VDD_IO
VDD_MDDR
XM1_ADDR [0:15]
XM1_ADDR0
XM1_ADDR1
XM1_ADDR2
XM1_ADDR3
XM1_ADDR4
XM1_ADDR5
XM1_ADDR6
XM1_ADDR7
XM1_ADDR8
XM1_ADDR9
XM1_ADDR10
XM1_ADDR11
XM1_ADDR12
XM1_ADDR14
XM1_ADDR15
XM1_SCLK
XM1_SCLKN
XM1_RASN
XM1_CASN
XM1_WEN
XM1_CSN0
XM1_CKE0
VDD_MDDR
XM1_ADDR [0:15]
XM1_ADDR0
XM1_ADDR1
XM1_ADDR2
XM1_ADDR3
XM1_ADDR4
XM1_ADDR5
XM1_ADDR6
XM1_ADDR7
XM1_ADDR8
XM1_ADDR9
XM1_ADDR10
XM1_ADDR11
XM1_ADDR12
XM1_ADDR14
XM1_ADDR15
XM1_SCLK
XM1_SCLKN
XM1_RASN
XM1_CASN
XM1_WEN
XM1_CSN0
XM1_CKE0
VDD_MDDR
XM1_DQS0
XM1_DQS1
XM1_DQM0
XM1_DQM1
XM1_DATA [0:15]
XM1_DATA0
XM1_DATA1
XM1_DATA2
XM1_DATA3
XM1_DATA4
XM1_DATA5
XM1_DATA6
XM1_DATA7
XM1_DATA8
XM1_DATA9
XM1_DATA10
XM1_DATA11
XM1_DATA12
XM1_DATA13
XM1_DATA14
XM1_DATA15
XM1_DQS2
XM1_DQS3
XM1_DQM2
XM1_DQM3
XM1_DATA [16:31]
XM1_DATA16
XM1_DATA17
XM1_DATA18
XM1_DATA19
XM1_DATA20
XM1_DATA21
XM1_DATA22
XM1_DATA23
XM1_DATA24
XM1_DATA25
XM1_DATA26
XM1_DATA27
XM1_DATA28
XM1_DATA29
XM1_DATA30
XM1_DATA31
-9-
The following two figures, the first map is KSX51163PG chip photo, second chart is
overlooking the pin distribution. KSX51163PG located in the core board.
The figure is
K4X51163PC - L (F) E / GFebruary DDR SDRAMPackage Dimension and Pin
ConfigurationBall NameBall FunctionCK, CKSystem Differential ClockCSChip
SelectCKEClock EnableA0 ~ A12AddressBA0 ~ BA1Bank Select AddressRASRow
Address StrobeCASColumn Address StrobeWEWrite EnableL (U) DMData Input
MaskL (U) DQSData StrobeDQ0 ~ 15Data Input / OutputVDD / VSSPower Supply /
GroundVDDQ / VSSQData Output Power / Ground <Bottom View * 1> 60Ball (6x9)
FBGA123789AVSSDQ15VSSQVDDQDQ0VDDBVDDQDQ13DQ14DQ1DQ2VSSQC
VSSQDQ11DQ12DQ3DQ4VDDQDVDDQDQ9DQ10DQ5DQ6VSSQEVSSQUDQSDQ
8DQ7LDQSVDDQFVSSDMN.CNCLDMVDDGCKECKCKWECASRASHA9A11A12CS
BA0BA1JA6A7A8A10/AP A0A1KVSSA4A5A2A3VDD <Top View * 2>
FEDCBJHGAK631745982K4X51163PC-XXXXSAMSUNGWeek # A1 Ball Origin
IndicatoreDED1E1 <Top View * 2> * 2 : Top View * 1: Bottom
ViewSymbolMinTypMaxA - 1.0A10.25 - E11.411.511.6E1-6.4-D9.910.010.1D1-7.2-e-
0.80-b0.450.500.55z - 0.10 [Unit: mm] zAA1b
33 UART Interface
OK6410 development board designed with 4 serial ports, including a five-wire RS-232
level serial port (DB9 female) and three three-wire TTL level serial port (20pin 2.0mm
pitch socket), in order to facilitate the special needs of the users, which developed a
special product to support additional serial port terminal board.
The default for the debug serial port UART0 which can be connected directly to PC, to
view the system debugging information.
- 10 -
Schematic design of the serial port 0:
9C560.1uC570.1uC630.1uC640.1u1C1 +2 V +3 C1-4C2 +5 C2-6V-
10T2IN9R2O16VCC15GND11T1IN12R1O13R1IN14T1O7T2O8R2INU5MAX202ER2
115KR715KR815KR915KR1015KR1115KR5315KR1215K123456781615141312111
0 the following two diagrams, the first map is MAX202E chip photo, second chart is
overlooking the pin distribution. MAX202E development board in the floor.
� � � � �� � �� � �� � �� �� � � � �� � �� � �� � �� �� � � � �
� � � � �± � �� � �� � �� � �� � � �� � �SLLS576D - JULY 2003 -
REVISED JANUARY 20041POST PerJESD drivers, two line receivers, and a dual
charge-pump circuit with ± D, DW, N, OR PW PACKAGE (TOP VIEW)
12345678161514131211109C1 + V + C1-C2 + C2-V-
DOUT2RIN2VCCGNDDOUT1RIN1ROUT1DIN1DIN2ROUT2
- 11 -
The following chart is a DB9 female COM0 Block. COM0 of the DB9 female on the
development board seat bottom. Schematic in COM0, this seat is the name of the
mother RS232_9.
Figure 1-9 can be removed to see the number of labels.
The following is the mother of the connection table seat with MAX202E
Parent coordinates number 123456789
Electrical connection GND RXD TXD DTR GND DSR RTS CTS RI
44 USB HOST Interface
OK6410 development board USB HOST port, support USB1.1 protocol, the use of
horizontal USB plug-type female port (A type socket); can be connected to U disk,
USB mobile hard disk, USB mouse, USB keyboard and other equipment.
USB HOST design schematics:
USB OTGUSB HOSTUSER KEYUSER 3D +4
GND5SHELL16SHELL2CN1USB2.1C330.1uC580.1uR5810KR5910KR7410KR7510
KR7710KR7810KR5510KLED1SMD
PUSH212S3SW_PUSH212S4SW_PUSH212S5SW_PUSH212S6SW_PUSH212S7S
W_PUSH21GND2DQ3VDDDS1DS18B20R384.7K678954321U956579-
0576R2522RR2622R1OP2GND3VCCH1HYR404.7K12LED4SMD B210uH +
C1210uC280.1uUSBDNUSBDPVDD33VVDD33VNLED2VDD33VNLED3VDD33VNL
ED1VDD33VNLED4KEYINT1KEYINT2KEYINT3KEYINT4KEYINT5KEYINT6VDD33V
VDD33VUSB HOST interface uses a USB female port (A type socket). USB HOST
contacts and menu below.
Contact
1
2
3
4
Features
VBUS
D-
D+
Ground
- 12 -
USB OTG Interface 55
USB OTG interface supports 2.0 protocol, with Mini USB A / B Type Interface (U9),
maximum operating speed of up to 480Mbps.
System development, you can use the USB OTG interface for program download.
USB OTG Schematic Design:
USB OTGUSB HOSTUSER KEYUSER 3D +4
GND5SHELL16SHELL2CN1USB2.1C330.1uC580.1uR5810KR5910KR7410KR7510
KR7710KR7810KR5510KLED1SMD
PUSH212S3SW_PUSH212S4SW_PUSH212S5SW_PUSH212S6SW_PUSH212S7S
W_PUSH21GND2DQ3VDDDS1DS18B20R384.7K678954321U956579-
0576R2522RR2622R1OP2GND3VCCH1HYR404.7K12LED4SMD B210uH +
C1210uC280.1uUSBDNUSBDPVDD33VVDD33VNLED2VDD33VNLED3VDD33VNL
ED1VDD33VNLED4KEYINT1KEYINT2KEYINT3KEYINT4KEYINT5KEYINT6VDD33V
VDD33VUSB OTG interface uses a miniUSB male population (B-type plug). USB
OTG contacts and menu below.
Contact
1
2
3
4
5
Features
VBUS
D-
D+
ID
Ground
- 13 -
JTAG Interface 66
OK6410 development board JTAG interface uses 10X2 pole interface (CN2).
S3C6410 processor design JTAG interface is used to access the ARM11 core, or chip
equipment, can be configured by SBGSEL signal selection, the specific configuration
is as follows:
DBGSEL signal is high, JTAG interface processor peripherals. • •
DBGSEL signal is low, JTAG connection to access the ARM11 core, the code for
debugging. • •
OK6410 development board DBGSEL signal can be jumper J9 to select.
JTAG design schematics:
JTAGBOOT ICE18273645RA210KR130R3330 | ¸
R515K112233J9CON3R615K1DCD2RXD3TXD4DTR5GND6DSR7RTS8CTS9RIP1R
S232_2V +3 C1-4C2 +5 C2-6V-
10T2IN9R2O16VCC15GND11T1IN12R1O13R1IN14T1O7T2O8R2INU5MAX202ER2
115KR715KR815KR915KR1015KR1115KR5315KR1215K123456781615141312111
0 the following diagram, is the JTAG interface, overlooking the photos, PCB silkscreen
triangle pointing to the pin for the JTAG interface, the first pin, all pins can diagram to
see the connection. JTAG interface is located development board floor.
- 14 -
RTC circuit 77
Development board equipped with a 'CR1220' type of button batteries, when in power
from the system RTC (Real Time Clock) power supply.
RTC design schematics are as follows:
POWERUSER IO 1HOME: IO 3USER IO
2D2BAT1BATTERYD1R174.7KC340.1uR494._RTCVDD33VRXD1KP_SO1SPICLK0
SPIMISO0GNDDAC_OUT1SPIMOSI0SPICS0HSYNCVD20VD19VD17VD7VD2EINT
15EINT11KEYINT5KEYINT1VD12OM4PWRRGTONOM0OM2DBGSELOTGIDOTGD
POTGDMEINT12TRSTNDAC_ROW1KP_ROW2KP_ROW3KP_ROW4KP_ROW5KP
_ROW6KP_ROW7KP_COL1KP_COL2KP_COL3KP_COL4KP_COL5KP_COL6KP_C
OL7GPP1GPP8GPP9GPP12GPP13GPK5TXD1RXD1RTSN1CTSN1RXD2TXD2RXD
3TXD3KP_ROW0KP_COL0VDD5VGNDVDD5VI2CSDA0I2CSCL0I2CSCL0I2CSDA0
VBUS
BATTERY schematic of the battery.
The following picture shows the Block button batteries and button cells. Button
batteries and button cells in the development board seat bottom.
- 15 -
SD CARD0 deck 88
OK6410 development board integrates an SD card connector (CON2), using the four-
SD card interface, supporting SD Memory and SDIO specification 2.0 protocol
specification 1.0 protocol. As can support 8G SD SD Memory card.
This port can be used as the system boot device, user volume, and software
upgrades.
SD CARD deck design schematics:
SD CARDSDCARD0SDCARD WIFI INTERFACEPWM BUZZERAD
CONVERTHOME:
DAT32CMD3VSS14VDD5CLK6VSS27DAT08DAT110WP11NCD12PAD113PAD2CO
N2SD CARD SOCKET (SKT SD / MMC Standard Type)
R1910KC160.1uR1810KR2010KR2210KR2310KR2410KR2910KR3010KR3110KR32
10KR3310K +
C2510uC260.1uB110uHR5010KR5110K112233445566778899101011111212131314
14151516161717181819192020CN4MULTI_ICER12kEBCQ5BAU4BELLR220 | ¸
CN3DZQVDD33VMMC0_DATA2MMC0_CLKMMC0_DATA3MMC0_CMDMMC0_DA
TA0MMC0_DATA1MMC0_CDNMMC0_WPNVDD33VMMC1_WPNMMC1_DATA1M
MC1_DATA0MMC1_CLKMMC1_CDNMMC1_CMDMMC1_DATA3MMC1_DATA2VD
D_WIFIGPP11GPP10GPP11GPP10VDD33VVDD_TOUT1VDD5VVDD33VADCIN0V
DD33V
The following picture shows the SD card connector. SD card connector development
board in the floor.
- 16 -
WIFI Interface 99
OK6410 development board can be connected to WIFI module, the interface with the
SDCARD1 deck using the same signals. Development board by matching the WIFI
connection module to achieve WIFI Internet access and other functions; In addition,
users can also use the interface to expand SD card connector, dual SD card
functionality.
WIFI Interface schematic diagram is as follows:
SD CARDSDCARD0SDCARD WIFI INTERFACEPWM BUZZERAD
CONVERTHOME: OK6410 Expansion COMPANY: Forlinx Embedded TITLE:
www.forlinx.comR9310KR9410KR9510KR9110KR9210K9DAT21CD/DAT32CMD3VS
S14VDD5CLK6VSS27DAT08DAT110WP11NCD12PAD113PAD2CON2SD CARD
SOCKET (SKT SD / MMC Standard Type)
R1910KC160.1uR1810KR2010KR2210KR2310KR2410KR2910KR3010KR3110KR32
10KR3310K +
C2510uC260.1uB110uHR5010KR5110K112233445566778899101011111212131314
14151516161717181819192020CN4MULTI_ICER12kEBCQ5BAU4BELLR220 | ¸
CN3DZQVDD33VMMC0_DATA2MMC0_CLKMMC0_DATA3MMC0_CMDMMC0_DA
TA0MMC0_DATA1MMC0_CDNMMC0_WPNVDD33VMMC1_WPNMMC1_DATA2M
MC1_CLKMMC1_DATA3MMC1_CMDMMC1_DATA0MMC1_DATA1MMC1_CDNMM
C1_WPNMMC1_DATA1MMC1_DATA0MMC1_CLKMMC1_CDNMMC1_CMDMMC1_
DATA3MMC1_DATA2VDD_WIFIGPP11GPP10GPP11GPP10VDD33VVDD_WIFIPW
M_TOUT1VDD5VVDD33VADCIN0VDD33V
Below SD1 seat. PCB silkscreen triangle pointing to the interface pin for the SD1 the
first pin, all pins according to the diagram to see the connection. SD1 floor seats in the
development board.
- 17 -
LCD screen and touch screen LCD interface, 111
OK6410 development board can support 3.5-inch, 4.3 inch, 5.6 inch, 7 inch, 8 inch, 10
inch TFT LCD screen.
LCD screen, touch-screen interface method is as follows:
POWERLCDHOME:
comTV1234567891011121314151617181920JP1CAM_28292930303131323233333
434353536363737383839394040CON1FPC-
40AR154.7KR16012C11nf12C21nf12C315pf (NC)
5GND4VIN1POWER2VOUT3VSAGU6NJM2561F1R34150RR350C140.1uC170.1uR
364.7K + C1847u +
C1947uR3775R12TV1BNCR422R6422R6522R6622I2CSDA0I2CSCL0CAMRSTNCA
MCLKCAMHREFCAMVSYNCCAMPCLKCAMYDATA7CAMYDATA6CAMYDATA5CA
MYDATA4CAMVVDD_LCDVD0VD1VD2VD3VD4VD5VD6VD7GNDVD8VD9VD10VD
11VD12VD13VD14VD15GNDVD16VD17VD18VD19VD20VD21VD22VD23GNDLVD
ENLVSYNCLVCLKLHSYNCTSXMTSXTSYMTSYPVDD_LCDCLKOUTVDD33VI2CS
DA0I2CSCL0VDD33VDAC_ Below LCD seat, then under the FPC are 40pin Block
(0.5mm pitch). LCD development board seat at the bottom.
- 18 -
TV OUT Interface 111
OK6410 development board integrates a TV OUT video output (S3C6410 processor
supports), the use of 2Pin standard TV interface.
TVOUT design schematics:
CAMCAM POWERLCDHOME: OK6410 COMPANY: Forlinx TITLE:
www.comTV1234567891011121314151617181920JP1CAM_EXTEND3+
40AR154.7KR16012C11nf12C21nf12C315pf (6V +5
GND4VIN1POWER2VOUT3VSAGU6NJM2561F1R34150RR350C140.1uC170.1uR3
64.7K + C1847u +
C1947uR3775R12TV1BNCR422R6422R6522R6622I2CSDA0I2CSCL0CAMRSTNCA
MCLKCAMHREFCAMVSYNCCAMPCLKCAMYDATA7CAMYDATA6CAMYDATA5CA
MYDATA4CAMTSYMTSYPVDD_OUT0GND
The following picture shows the TV interface. TV Interface in the development board
floor.
- 19 -
111 audio interface
OK6410 S3C6410 development board audio processor using the AC97 bus. Add
WM9714 audio chip, which integrates audio output, Line in input and Mic input.
Audio output and MIC input and LINE IN audio jacks are standard.
(1) The following is the WM9714 chip and audio line in the schematic:
POWERHOME:
IN5SDATA_OUT11RESTB14NC115NC216NC317NC424LINER23LINEL20MONO_I
N38SPKVDD25AVDD143HPVDD49GNDPADDLE42AGND226AGND140HPGND18A
GND348GPIO5/PCMADC47GPIO4/PCMDAC46GPIO3/PCMFS45GPIO2/RQ44GPIO
1/PCMCLK39HPOUTL41HPOUTR31MONO35SPKL36SPKR21MIC122MICCM19PC
BEEP29MIC2A/AUX128MICBIAS33OUT437OUT32MCLKA3MBCLKB30MIC2B/AUX
212AUX413AVDD227VREF32CAP234SPKGNDU2WM9714LGEFL4VDD1OE3OUT2
GNDU11Y705024.576MHzR600R6110KR620C351uC361uC371uC391uC411uC421u
+ C4647u +
C4447uR63100K12354J6R6947KC49220pfC48220pfR6847K12354J7R7047KR710R
73680R1VIN2GND3EN5VOUT4NCU8XC6219B33AMRR27100KC100.1uR280RC11.
1uC661uC670.1u +
C6810uR390C150.1uC591uC600.1uC611uC620.1uC651u12354J14VDD33VVDD33
VMICVDD_AC97GND_AC97HPLHPRMICBIASAC97_BITCLKAC97_SYNCAC97_SD
IAC97_SDOAC97_RSTNGND_AC97GND_AC97HPLHPRGND_AC97MICBIASMICV
DD5VVDD_AC97GNDGND_AC97VDD33VVDD_AC97GND_AC97GND_AC97
- 20 -
The following picture shows the WM9714 chip. PCB silkscreen triangle pointing to the
pin for the WM9714 the first pin, all pins according to the diagram to see the
connection. WM9714 development board in the floor.
Below is the audio line in the top view of Block. Audio line input on the development
board seat bottom. In WM9717 the schematic labeled J14.
(2) Below is the mic Block diagram:
SPEAKERMICAUDIOAUDIO OK6410 Expansion Board COMPANY: Forlinx
Embedded TITLE:
C4447uR63100K12354J6R6947KC49220pfC48220pfR6847K12354J7R7047KR710R
73680R1VIN2GND3EN5VOUT4NCU8XC6219B33AMRR27100KC100.1uR280RC11
C6810uR390C150.1uC591uC600.1uC611uC620.1uC651u12354J14VDD33VVDD33
VMICVDD_AC97GND_AC97HPLHPRGND_AC97GND_AC97MICBIASMICVDD5VV
DD_AC97GND_AC97GND_ Block below shows the top view of MIC input. Audio line
input on the development board seat bottom. In the schematic labeled J7. The seat
can be used to access the microphone input.
- 21 -
(3) The following is the speaker Block diagram:
SPEAKERMICAUDIOAUDIO OK6410 Expansion Board COMPANY: Forlinx
Embedded TITLE:
www.forlinx.com1DBVDD9DCVDD4DGND17DGND26BITCLK10SYNC8SDATA_C44
47uR63100K12354J6R6947KC49220pfC48220pfR6847K12354J7R7047KR710R736
80R1VIN2GND3EN5VOUT4NCU8XC6219B33AMRR27100KC100.1uR280RC11C68
10uR390C150.1uC591uC600.1uC611uC620.1uC651u12354J14VDD33VVDD33VMI
CVDD_AC97GND_AC97HPLHPRGND_AC97GND_AC97MICBIASMICVDD5VVDD_
AC97GND_ speaker under the seat map is a picture, you can access the headset.
development board seat in the bottom speaker. In the schematic labeled J6.
- 22 -
100M Ethernet port 111
OK6410 development of a 100M-board Ethernet interface, to extend through the
DM9000AE chip.
In the development process, the Ethernet interface can be used to connect PC,
download the WINCE image; in the Linux system development, can be used to mount
the NFS network file system. Use, to be directly connected via crossover cable PC,
you can also use direct cable networking switch or router.
DM9000AE use S3C6410 processor interrupt signal interrupts 'EINT7' signal.
Ethernet port RJ45 socket by socket, built-in transformer.
DM9000AE design schematics are as follows:
ETHERNETETHERNET 38LED239LED140PWRST #
41TEST42VDD043X244X145GND046SD47RXGND048BGGND24SD1423VDD122S
D1521EECS20EECK19EEDIO18SD017SD116SD215GND14SD313SD425SD1326S
D1227S1128SD1029SD930VDD231SD832CMD33GND134INT35IOR36IOW12SD51
1SD610SD79TXVDD258TX-7TX +6 TXGND5RXGND4RX-3RX +2
RXVDD251BGRESU7DM9000AR426.8k 1% 12X125.0Mhz12C2022pf12C6922pf1RX
+ C75100nfR474.7KR484.7K12C76100nfR9022R +0:15]
DATA0DATA1DATA2DATA3DATA4DATA5DATA6DATA7DATA8DATA9DATA10DAT
A11DATA12DATA13DATA14DATA15VDD33VVDD33VADDR2IRQ_LANVDD33VRX
D + RXD-TXD + TXD-AVDD25RXD +
- 23 -
The following picture shows two photographs and DM9000AE chip I / O distribution,
the lower left corner for the first pin chip. Development board for 16-bit mode
DM9000AE, and another description of the eight models, users can find in the
DM9000AE datesheet. DM9000AE development board in the floor.
- 24 -
RJ45 socket design method is as follows:
ETHERNETETHERNET INTERFACEHOME: OK6410 Expansion Board COMPANY:
Forlinx Embedded TITLE:
www.forlinx.comC990.1uFC1030.1uFC1000.1uFC1010.1uFC1040.1uFC980.1uFC10
20.1uF37CS # 12X125.0Mhz12C2022pf12C6922pf1RX +2 RX-3TX +4
N/C5N/C_56TX-7N/C_78N /
C_813SHIELD114SHIELD212YLED_R11YLED_L10GLED_R9GLED_LJ10HR911105
AR4350 1% R4450 1% C70100nfR4550 1% R4650 1%
C75100nfR474.7KR484.7K12C76100nfR9022R + C7710uVDD33VDATA [RXD-TXD
+ TXD-AVDD25VDD33VVDD33VLED2LED1LED1LED2CSN1XNRSTOUTWENOEN
CMOS camera interface 111
S3C6410 processor, camera support ITU-BT 601/656 8-bit mode, the maximum you
can achieve 4096 X 4096 pixels.
OK6410 leads to the development board camera interface, using 10X20 pin method
(CAM), can be used directly Feiling supporting the camera module. CAMERA signals
in addition to the interface, but also increased the IIC signal, the parameters used to
configure the camera; also added a GPIO signal (GPP14), mainly used in CAMERA's
power control, to help implement power management system.
CMOS camera interface design schematics:
CMOS CAMCAM POWERLCDHOME:
comTV1234567891011121314151617181920JP1CAM_EXTEND3 + C5010u +
C5110uC520.1uC530.1u1IN2GND3OUT4U3LM1117-CT1.8R850 +
C5510uF/16VR830R840C540.1uC840.1uC850.1uR140112233445566778899101011
1112121313141415151616171718181919202021212222232324242525262627272C
1947uR3775R12TV1BNCR422R6422R6522R6622I2CSDA0I2CSCL0CAMRSTNCAM
CLKCAMHREFCAMVSYNCCAMPCLKCAMYDATA7CAMYDATA6CAMYDATA5CAM
YDATA4CAMDATA3CAMYDATA2CAMYDATA1CAMYDATA0VDD33VVDD18VVDD3
3VGNDVDD18VVDD5VGNDVDD33VGPP14GNDVCLKHSYNCVSYNCVDENLVCLK
LHSYNCLVSYNCLVDENGNDVDD
- 25 -
The figure below shows the top view of CAM blocks. PCB silkscreen triangle pointing
to the pin for the CAM interface, the first pin, all pins according to the diagram to see
the connection. CAM on the development board seat bottom. The CAM blocks can be
used to access Feiling the CMOS camera.
Reset button 111
OK6410 development board using the reset button 6X6mm touch switch, reset the
chip select MAX811t (in the core board), professional reset chip can guarantee stable
and reliable system.
(1) Reset button design method is as follows:
INTERFACERESETExpansion C410uC50.1u + C610uC70.1u +
C810uC90.1uC130.1u +
CT3.312R7610K1342S1SW_PUSH21M1MHOLE_C2710u123J5SIP2.0C920.1uC940.
1uC810.1uC830.1uC860.1uC900.1uC910.1uC960.1uC970.1uGNDVDD_RSTVDD33
V
RESET button below shows the top view. RESET button located in the floor boards.
Press this key to restart the development board.
- 26 -
(2) reset chip MAX811 design schematics are as follows:
The picture shows the MAX811 chip
clock12R8144.2RD20XURXD0/GPF13AE17XEINT0/GPN15AD16XNRSTOUTAD15
WR_GPG0U1-
BS3C641012R1100k1GND2RESET4VCC3MRU6MAX81112R2012R30R44.7kC1025
pfR510k12R610K12R7012R8100k12X227Mhz12X348MhzC225pfC125pfC325pfC45p
fC525pfC625pfR91MR101MR111MC1813pfC5213pf12X532.768KHzR125MR132kR1
42k12X112MhzRXD0TXD0CTSN0RTSN0RXD1TXD1CTSN1RTSN1RXD2TXD2RXD
LANMMC1_CDNKEYINT6KEYINT5KEYINT4KEYINT3KEYINT2KEYINT1GPF13CLK
OUTPWM_TOUT1RTCXTIRTCXTO27MXTI27MXTOXTIXTOVDD_IOTRSTNTMSTC
KTDITDORTCKDBGSELOM0OM1OM2OM3OM4XNRSTOUTNRESETKEY_RSTVD
D_IOVDD_IOSELNANDNBATFPWRRGTONVDD_ the following two pictures and I /
O distribution, the upper left corner for the first pin chip. MAX811 located in the core
board.
DescriptionThe microprocessor (power sup-provide excellentcircuit eliminating
externalcomponents used with 5V-MAX811/MAX812also input.They assert areset
voltage fallsbelow asserted for atleast reset thresh-devices is thatthe RESEToutput
(which isguaranteed VCC down to1V), RESET out-ignore fasttransients available
foroperation MAX812 idealfor devices come in a4-
ApplicationsComputersControllersIntelligent Features � Precision Monitoring of 3V,
3.3V, and 5V Power-Supply Voltages � 6μA Supply Current � 140ms Min Power-On
Reset Pulse Width; RESETOutput (MAX811), RESET Output (MAX812) �
Guaranteed Over Temperature � Guaranteed RESETValid to VCC = 1V (MAX811) �
Power-Supply Transient Immunity � No External Components � 4-Pin
SOT143PackageMAX811/MAX8124-Pin μP Voltage Monitors with Manual Reset
Input________________________________________________________________
Maxim Integrated Products11243VCCMR (RESET)
RESETGNDMAX811MAX812SOT143TOP VIEW () ARE FOR MAX812NOTE: SEE
LAST PAGE FOR MARKING INFORMATION.___________________Pin
ConfigurationMAX811MAX812VCCVCCRESET (FOR
MAX812PUSHBUTTONSWITCHMR___________Operating Circuit19-MAX811_EUS-
TMAX812_EUS-T-40 ° C to +85 ° C-40 ° C to +85 ° CTEMP. RANGEPIN-PACKAGE4
SOT1434 SOT143_______________Ordering Information * This part offers a choice
of five different reset threshold voltages. Select the letter corresponding to the desired
nominal reset threshold voltage, and insert it into the blank to complete the part
number.RESET THRESHOLDSUFFIXVOLTAGE (V)
L4.63M4.38T3.08S2.93R2.63For literature: http : / / www.maxim-ic.com, or phone 1-
800-998-8800.835-8769.
- 27 -
Temperature sensors & infrared receiver 111
OK6410 DS18B20 development board with high-precision temperature sensor, and
HS0038B integrated infrared receiver;
Related design method is as follows:
OTGUSB HOSTUSER KEYUSER TYPE (RED) R5710KLED2SMD TYPE (RED)
R8010KLED3SMD TYPE (RED)
R8210K12S2SW_PUSH21GND2DQ3VDDDS1DS18B20R384.7K678954321U956579
-TYPE (RED) PE0VBUSOTGIDOTGDPOTGDMVDD5VVDD5VGPE1VDD5V
(1) DS18B20 following picture shows the top view of the two and I / O distribution, the
left foot for the first chip. DS18B20 in the development board floor.
only one serial code distributed Power supply 55 ° C to C selectable word in alarm
identifies and temperature is temperature pin? SOP, controls, products, PIN
ASSIGNMENT PIN DESCRIPTION GND - Ground DQ - Data In / Out VDD - Power
Supply Voltage NC - No Connect DS18B20Programmable Resolution1-Wire Digital
Thermometerwww.Pin 150mil SO (DS18B20Z) TO-92 (DS18B20) 1 (BOTTOM VIEW)
2 3 DALLAS18B20 1 GND DQVDD 2 3 NCNCNC NC GND DQVDDNC68753 1 2 4
DALLAS18B20NCVDD NC NC NC GNDNCDQ68753 1 2 4 18B208- Pin?
SOP (DS18B20U)
- 28 -
(2) below the top view of the two photo HS0038B and I / O distribution, the left foot for
the first chip. HS0038B development board in the floor. The infrared receiver has
three pins, from the figure direction, from left to right is OUT, GND, VCC.
User IO 111 expansion interface
User IO pin expansion port with 10X2, contains 8 AD inputs, all the way DA output,
one spi bus, all the way to GND, the other for the common IO port.
IO expansion port design schematics are as follows:
POWERUSER IO 1HOME:
2D2BAT1BATTERYD1R174.7KC340.1uR494._OUT1SPIMOSI0SPICS0HSYNCVD20
VD19VD17VD7VD2EINT15EINT11KEYINT5KEYINT1VD12OM4PWRRGTONOM0O
M2DBGSELOTGIDOTGDPOTGDMEINT12TRSTNDAC_ROW1KP_ROW2KP_ROW3
KP_ROW4KP_ROW5KP_ROW6KP_ROW7KP_COL1KP_COL2KP_COL3KP_COL4
KP_COL5KP_COL6KP_COL7GPP1GPP8GPP9GPP12GPP13GPK5TXD1RXD1RTS
N1CTSN1RXD2TXD2RXD3TXD3KP_ROW0KP_COL0VDD5VGNDVDD5VI2CSDA0I
2CSCL0I2CSCL0I2CSDA0VBUS
The figure below shows the user I / O Block, top view. PCB silkscreen triangle
pointing to the pin for the user I / O Block, a pin, all pins according to the diagram to
see the connection. User I / O development board seat in the bottom. User I / O to
provide a better expansion interface.
- 29 -
Description of the crystal and the Fifth Power
OK6410 provides a crystal source and power management unit, we summarize and
learning in order to facilitate, in particular summed up as a chapter.
(A) of the crystal source
OK6410 provides six crystal source.
The core board has four crystal source, are passive crystal:
1, the master clock, 12MHZ
RTC ClockHOME: OTG clockGraphics clockRTCSYSTEM
clock12R8144.2RD20XURXD0/5pfC525pfC625pfR91MR101MR111MC1813pfC5213
pf12X532.768KHzR125MR132kR142k12X112MhzRXD0TXD0CTSN0RTSN0RXD1T
XD1CTSN1RTSN1RXD2TXD2RXDRSTVDD_IOVDD_2, Graphics clock signal 27HZ,
for the display module, such as the MFC LCD TV module provides the clock signal
OTG clockGraphics clockRTCSYSTEM RSTVDD_IOVDD_3, USB clock, 48MHZ,
USB SD Card SDIO used to provide the clock signal
OTG clockGraphics clockRTCSYSTEM
clock12R8144.2RD20XURXD0/RSTVDD_IOVDD_4, RTC clock, 32.768KHZ, for real-
time clock module provides the clock signal. Please refer to the RTC section.
- 30 -
The base has two crystal Source:
1. 24.576MHz crystal. Supply to WM9714 MCLKA. Then the WM9713 on the internal
supply AC97 CLK: 24.576MHz. The crystal oscillator is active.
IN5SDATA_OUT11RESTB14NC115NC216NC317NC424LINER23LINEL20MONO_I
N38SPKVDD25AVDD143HPVDD49GNDPADDLE42AGND226AGND140HPGND18A
GND348GPIO5/PCMADC47GPIO4/PCMDAC46GPIO3/PCMFS45GPIO2/RQ44GPIO
1/PCMCLK39HPOUTL41HPOUTR31MONO35SPKL36SPKR21MIC122MICCM19PC
BEEP29MIC2A/AUX128MICBIAS33OUT437OUT32MCLKA3MBCLKB30MIC2B/AUX
212AUX413AVDD227VREF32CAP234SPKGNDU2WM9714LGEFL4VDD1OE3OUT2
GNDU11Y705024.576MHzR600R6110KR620C351uC361uC371uC391uC411uC421u
+ C4647u +
C4447uR63100K12354J6R6947KC49220pfC48220pfR6847K12354J7R7047KR710R
73680R1VIN2GND3EN5VOUT4NCU8XC6219B33AMRR27100KC100.1uR280RC11
C6810uR390C150.1uC591uC600.1uC611uC620.1uC651u12354J14VDD33VVDD33
VMICVDD_AC97HPLHPRMICBIASAC97_BITCLKAC97_SYNCAC97_SDIAC97_SD
OAC97_RSTNGND_2. 25M crystal. Provide DM9000AE crystal source. The crystal is
a passive crystal.
ETHERNETETHERNET 38LED239LED140PWRST #
41TEST42VDD043X244X145GND046SD47RXGND048BGGND24SD1423VDD122S
D1521EECS20EECK19EEDIO18SD017SD116SD215GND14SD313SD425SD1326S
D1227S1128SD1029SD930VDD231SD832CMD33GND134INT35IOR36IOW12SD51
1SD610SD79TXVDD258TX-7TX +6 TXGND5RXGND4RX-3RX +2
RXVDD251BGRESU7DM9000AR426.8k 1% 12X125.0Mhz12C2022pf12C6922pf1RX
+ C75100nfR474.7KR484.7K12C76100nfR9022R +0:15]
DATA0DATA1DATA2DATA3DATA4DATA5DATA6DATA7DATA8DATA9DATA10DAT
A11DATA12DATA13DATA14DATA15VDD33VVDD33VADDR2IRQ_RXD-TXD +
TXD-AVDD25RXD +
- 31 -
(B) Power Management Unit
The following is a S3C6410 I / O voltage, and feature descriptions.
6410_UMPRODUCT OVERVIEW1-33The table below shows I / O types and
descriptions. Input (I) / Output (O) Type Descriptionsdih (vddivh), si (vssipvh) Vdd /
Vss for internal logic with internal pad power ring dich (vddicvh) Vdd for only internal
logic dth (vddtvh), sth (vsstvh) 1.8 ~ 3.3V Vdd / Vss for external logic dtm (vddtvm) 1.8
~ 2.5V Vdd for external logic dtlh (vddtvlh), stlh (vsstvlh) 1.2V Vdd / Vss for external
and internal logicdrtc (vddrtcvh) 1.8 ~ 3.0V Vdd for RTC power dih_u (vddivh_usb)
Vdd for usb phy core si_u (vssipvh_usb) Vss for usb phy core hag (pvhbsudtartg)
1.8V ~ 3.3V Wide Range Bi-directional Buffer with Schmitt Trigger Input, Controllable
Pull-up/down Resistor and A type Output driver hag_a (pvhbsudtag_alv) 1.8V ~ 3.3V
Wide Range Bi-directional Alive Buffer with Schmitt Trigger Input, Controllable Pull-
up/down Resistor and A type Output driver hbg (pvhbsudtbrtg ) 1.8V ~ 3.3V Wide
Range Bi-directional Buffer with Schmitt Trigger Input, Controllable Pull-up/down
Resistor and B type Output driver hb_c (pvhbsudtbrt_ckds) 1.8V ~ 3.3V Wide Range
Bi-directional Buffer with clock driver input for pulse clock or small amplitude clock,
Schmitt Trigger Input, Controllable Pull-up/down Resistor and B type Output driver
mbg (pvmbsudtbrtg) 1.8V ~ 2.5V Wide Range Bi-directional Buffer with Schmitt
Trigger Input, Controllable Pull-up/down Resistor and B type Output driver sca
(pvhsosca) 1.8V ~ 3.3V wide range oscillator for RTC Interface scb (pvhsoscbrt) 1.8V
~ 3.3V wide range oscillator for Wide Frequency usb1 (usb6002x1) USB 1.1 pad hr
(pvhbr) 1.8V ~ 3.3V wide range analog bi-direction path-through PAD with 3 different
paths which have no resistor, 50ohm or 100ohm resistorhtr (pvhtbr) 1.8V ~ 3.3V wide
range analog tolerant bi-direction path-through PAD with 3 different paths which have
no resistor , 50ohm or 100ohm resistorhtr00 (pvhtbr00_efuse) 1.8V ~ 3.3V wide range
analog bi-direction path-through PAD without resistor for efuse memoryr_h (pvbr_h)
1.2V bi-direction path-through PAD with 3 different paths which have no resistor,
50ohm or 100ohm resistor
Above table shows that CPU is not only needed a power supply. OK6410 provides
multiple power management unit. OK6410 core board each way power supply input
from the power chips alone, more stable and more secure.
1.S3C6410 ARM core power supply
Signal Description Voltage
VDDARM Internal power for ARM1176 core and cache 1.2
- 32 -
Core Power 1.1V (533M/1.1V, 667M/1.2V) VDD INT Power 1.3VInternal blockMobile
DDR Power 1.8vVDD Alive Powr 1.2VPLL
91uC800.1u1VIN2GND3EN5VOUT4NCU9XC6219B12AMRR27100KR280RC830.1u
C840.1uC850.1u1VIN2GND3EN5VOUT4NCU10XC6219B33AMRR29100KC860.1uR
30uR460RC1070.1uC1081uC1090.1uC1100.1u + C11110uC1120.1u +
C10010uC1010.1uR480RC924.7u1VIN2GND3EN5LX4VOUTU15XC9216A13CMRC1
024.7uB63.3uH + C10310uC1040.1uB73.3uH +
C11510uC1160.1uR47100KC1174.7u1M1MHOLE_IOVDD_ALIVEVDD_5VVBUSVD
D_ARMVDD_IOPWRRGTONVDD_IOVDD_INTVDD_INTVDD_MDDRVDD_MDDRVD
D_IO
2.S3C6410 ALIVE power
Signal Description Voltage
VDDALIVE Internal power for alive block 1.2
DDR Power 1.8vVDD Alive Powr 1.2VPLL
91uC800.1u1VIN2GND3EN5VOUT4NCU9XC6219B12AMRR27100KR280RC830.1u
C840.1uC850.1u1VIN2GND3EN5VOUT4NCU10XC6219B33AMRR29100KC860.1uR
30C11110uC1120.1u + C10310uC1040.1uB73.3uH +
C11510uC1160.1uR47100KC1174.7u1M1MHOLE_IOVDD_ALIVEVDD_5VVBUSVD
D_IOVDD_INTVDD_MDDRVDD_MDDRVDD_IO
- 33 -
3.S3C6410 VDD internal power supply
Signal Description Voltage
VDDINT Internal power for logic 1.2
VDD INT Power 1.3VInternal blockMobile DDR Power 1.8vVDD Alive Powr 1.2VPLL
91uC800.1u1VIN2GND3EN5VOUT4NCU9XC6219B12AMRR27100KR280RC830.1u
C840.1uC850.1u1VIN2GND3EN5VOUT4NCU10XC6219B33AMRR29100KC860.1uR
30C11110uC1120.1u +
C10010uC1010.1uR480RC924.7u1VIN2GND3EN5LX4VOUTU15XC9216A13CMRC1
024.7uB63.3uH + C10310uC1040.1uB73.3uH +
C11510uC1160.1uR47100KC1174.7u1M1MHOLE_IOVDD_ALIVEVDD_5VVBUSVD
D_IOVDD_INTVDD_INTVDD_MDDRVDD_MDDRVDD_IO
4.S3C6410 Mobile DDR Power Supply
Signal Description Voltage
VDDM1 IO power for Memory Port 1 1.8
Core Power 1.1V (533M/1.1V, 667M/1.2V) VDD INT Power 1.3VInternal blockMobile
DDR Power 1.8vVDD Alive Powr 1.2VPLL
C10010uC1010.1uR480RC924.7u1VIN2GND3EN5LX4VOUTU15XC9216A13CMRC1
024.7uB63.3uH + C10310uC1040.1uB73.3uH +
C11510uC1160.1uR47100KC1174.7u1M1MHOLE_IOVDD_5VVBUSVDD_ARMVDD
_IOPWRRGTONVDD_IOVDD_INTVDD_INTVDD_MDDRVDD_MDDRVDD_IO
- 34 -
5.S3C6410 PLL power supply
PLL power supply part MPLL, APLL, EPLL same power supply.
Signal Description Voltage
VDDPLL Power for PLL core 1.2
Power 1.2VUSB uR460RC1070.1uC1081uC1090.1uC1100.1u +
IOVDD_PLLVDD_6.S3C6410 OTG power
Signal Description Voltage
VDDOTG Power for USB OTG PHY 3.3
OTG POWER 3.3vUSB OTGI Power
1.2VUSB_RC880.1uC890.1uC900.1uR310RR32110KC820.1uC870.1uR33180KR343
30KR350RC910.1u1VIN2GND3EN5VOUT4NCU12XC6219B12AMRR45100KC1050.
1uC1065VVDD_OTGIVDD_5VVDD_OTGGPF13VDD_
- 35 -
7.S3C6410 OTGI power
Signal Description Voltage
VDDOTGI Internal power for USB OTG PHY 1.2
FL6410 Core Board COMPANY: Power 1.2VUSB OTGI Power 1.2VUSB_OTG
interruptNC3.3V1VIN2GND3EN5VOUT4NCU5XC6219B12AMR1SKIP2SHDN3IN4G
ND8OUT7CXP6CXN5PGNDU7MAX682ESAR24100KC760.1uC771u12R260RC780.
1uCRC880.1uC890.1uC900.1uR310RR32110KC820.1uC870.1uR33180KR34330KR
350RC910.1u1VIN2GND3EN5VOUT4NCU12XC6219B12AMRR45100KC1050.1uC1
06C11310uC810.1uR430R1VIN2GND3EN5LX4VOUTU2XC9216A12CMR1VIN2GND
3EN5LX4VOUTU14XC9216A18CMRR44100KB53.3uH +5
VVDD_OTGIVDD_OTGGPF13VDD_5VOTGDRV_VBUSVBUSEINT8VDD_IOVDD_P
LLVDD_
- 36 -
Development Board precautions when using sixty-six
If the development board are not familiar with or do not understand some of the basic
operation of electronic products, we recommend looking for some information from the
network to learn. Here we briefly about the development board in the learning and
operational considerations in the process.
1. Development board hot-plug interface. Development board with multiple interfaces,
some are hot-swappable, such as: USB HOST, USB OTG, audio input and output,
network card, Block, SD card; some are not hot-swappable: LCD, serial port, VGA,
camera the first module interface, WIFI interfaces, GPS Interface, TV OUT, etc..
So pay attention to the use of these interfaces to prevent misuse human damage
caused by the development board.
2. Core board and backplane connectors. Feiling connectors used have been
introduced in the previous, here explain the operation of plug. Of course, this is not
supported by live hot-swappable. In the development board power, the release of the
body's static electricity, and then forced evenly pry the core board right hand. When
installing the connectors, power development board also needs to release the body's
static electricity, according to the direction of the corresponding link.
Adjourned.
- 37 -
OK6410 development board dimensions seventy-seven
Core board dimensions are as follows: 11
Definition of the core board 38 feet PIN: 22
- 19 -
- 19 - �� � �� � �� �� � 





  
    
 
   
 



    
    
- 39 -
- 20 - � �� � 
   
      
    
   
     
   
     
     
     
       
  

- 40 -
- 21 - - 21 - �� � �     
        
  
       
   

 
    

  
  
       
  
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      
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Google แปลภาษาสาหรับ:การค้นหาวิดีโออีเมลโทรศัพท์แชทธุ รกิจ
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