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IP Block Authoring: Clock Issues

T.Arslan
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Block Area Components

• Core Area

• Power Rails Width

• I/O Pins around the Block

T.Arslan
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1
Physical Block Attributes
Block
abstract
Power
rings
Block’s core
(cells 65%
routing 35%) Hierarchical
pin

H
P

L W

Area=(L+2W+2P) * (H+2W+2*P)
T.Arslan
Speed, Power ?
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Clocking Strategy
• Clock planning should be employed
early during the design process.
• Based on the analysis of constituent
blocks a global clock frequency need to
be chosen. +
• Selection of appropriate clocking
structure , and whether to
• Use PLLs, and how.

T.Arslan
All rights reserved 2008

2
Clock Parameters

• Jitter: uncertainty in clock


• Slew Rate: time from ~10% to ~70% of
clock. CAD tools indicate this as
transition time value. (V/ns)
• Period

T.Arslan
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Issues

• INSERTION DELAY (ID): Time


difference between clock edge at the
clock pin (origin) and the destination pin
at the end of the clock structure tree.

• SKEW (S): The difference between the


min and maximum IDs on a clock
structure/tree.
T.Arslan
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3
Clocking Structures


• …




H-tree
Balanced Grid
tree
T.Arslan
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Choice of Clocking Structure


Delay

HTree
Grid

BTree

Load

BT Best for Large Load


T.Arslan
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HT Best for

4
Clock Tree and Block Hardening
Skew Insertion_delay


Clock Tree Generation •


Clock Tree:
Buffers/Cells

Add cells to Core Cells Need Placement •

+
Optimisation

Block’s core
(cells 65%
routing 35%)

Full Layout
OR
{Accurate Model}

T.Arslan
All rights reserved 2008

Producing a Final GDSII

Hierarchical Verilog

DP

Routed DEF
Partitioning
Block 1 Block 2
Top level DEF Lib LEF

Size block + Place Pins SE


Output (DEF)

LEF

Lib LEF SE Place and Route


LEF
Routed DEF Abstracted Creation

DP
T.Arslan
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5
Parasitic Extraction

T.Arslan
All rights reserved 2008

(1) Extraction Models

PP
uses the Parallel Plate mode for
extraction. This mode gives you the most
control over the extraction, by using the
capacitance and edge capacitance values
from your LEF file in the following
formula:

Capacitance (wire) =
(L*W) + Capacitance + 2 * (L+W) *
EdgeCapacitance (where L=Length and
W=Width)
T.Arslan
All rights reserved 2008

6
Extraction Models cont.
VDMF
uses the Van Der Meijs Fokkema (VDMF)
formula mode for extraction. This mode
gives you less control over the extraction
because Report RC will just use the
following formula:

c=e*[(w/h) + 0.77 + 1.06*(w/h)**0.25 +


1.06 * (w/h)**0.5]

In this formula, "e" is the dielectric


constant, "w" is the width of the wire,
"t" is the thickness of the wire, and "h"
is the height of the wire.
T.Arslan
All rights reserved 2008

Extraction formats
RSPF
reports in the Reduced Standard Parasitic
Format. This is simply a reduced format, much
more simplified than the more detailed DSPF
report format.
DSPF
reports in the Detailed Standard Parasitic
Format. This format reports every resistor and
capacitor in your design, producing a very
large, detailed report.
GE/SE
reports in the old GE/SE format. This format
used to be called "Standard" and contains the
same information as the new RSPF format, but
presented in a different format.

T.Arslan
All rights reserved 2008

7
Hierarchical Parasitic Extraction:
RSPF
-Useful for accurate cross coupling parasitics for crosstalk analysis
-Performed for all routed full chip

For each load, a net is mapped →

For each driver, a net is mapped →

T.Arslan
All rights reserved 2008

Hierarchical Paracitic Extraction:


DSPF
•A net Model is

⇒More detailed resistance and capacitance values per wire


⇒Larger File, specifically for long nets

⇒Simulate using Spice

T.Arslan
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8
Sample File
*|RSPF 1.5
*|DESIGN "chip"
*|DATE "27 February 2000, 16:40:27"
*|VENDOR "Cadence Design Systems,
Inc."
*|PROGRAM "Silicon Ensemble"
*|VERSION "5.2.9"
*|DIVIDER /
*|DELIMITER :
*|BUSBIT []
*
* Resistance Units : 1 ohms
* Capacitance Units : 1 pico farads
*
*
.SUBCKT chip OUT IN
*
*|GROUND_NET VSS
*
* TIMING.CAPACITANCE.MODEL = PP
*
* rst_s2 is a one-pin net.
*
*|NET CRF/Mem\[10\]\[7\] .012641PF
*
*|DRIVER CRF/Mem\[10\]_reg_7:Q CRF/Mem
\[10\]_reg_7 Q
*|S (CRF/Mem\[10\]_reg_7:Q:OUTP1 0.0
0.0)
*
R2 CRF/Mem\[10\]_reg_7:Q CRF/Mem\[10\]
_reg_7:Q:OUTP1 2.473233
C1 CRF/Mem\[10\]_reg_7:Q:OUTP1 VSS
.012088PF
C2 CRF/Mem\[10\]_reg_7:Q VSS .000553PF
*|LOAD CRF/i_873:A CRF/i_873 A
*|S (CRF/i_873:A:INP1 0.0 0.0)
E1 CRF/i_873:A:INP1 VSS CRF/Mem\[10\]
_reg_7:Q VSS 1.0
R3 CRF/i_873:A:INP1 CRF/i_873:A .032478
C3 CRF/i_873:A VSS 1.0PF
*
*|NET CRF/Mem\[10\]\[6\] .015852PF
T.Arslan
All rights reserved 2008

IP Block Authoring: Analogue


and Mixed Block Issues

T.Arslan
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9
Floor plan considerations

• Critical analogue components must be placed


far from digital elements.
• Connections to critical nodes should be as
short as possible.
• Crossing between analogue bias lines and
digital buses should be avoided.
• Separate analogue and digital power
• Use guard rings to separate main groups of
certain type
T.Arslan
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Shielding and Separation Methods

Analog
Vss metal shielding Digital hndb lndb AB Power
Power rails

Analog hndb lndb lndb


block

hndb hndb hndb


Metal shielding
an
analog block
Separate power for
analog and digital
blocks
T.Arslan
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10
Guard Rings & Noise filtering

Analog Noisy signal input


from digital block
Clean signal
block C output after
RC filter

Low pass noise filter

Internal Peripheral
guard ring

T.Arslan
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Overall AMS Floorplan

Digital
guard Digital

resistor
capacitor
Resistor guard
Cap guard ring
ring

analog
Analog
guard
ring

T.Arslan
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11
AMS Virtual Component Packaging

Package an AMS Block as a VC includes the


generation of the proper views. This involves
generating :
• Layout Abstract view
• Netlist view
• Functional Model of digital interface.
• Static timing model
• Physical block description (GDSII).

AMS VC

T.Arslan
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Layout View Generation

• Involves the generation of an analogue abstract (LEF) block


from the actual layout block.
• This is important in order to do P&R at SYSTEM level.
• This procedure is tool-independent. E.g, AutoAbgen is an
example tool.
• Make sure info such as the following are generated, otherwise
P&R will not complete.
-prBoundry
Block Layout Technology file
-Pin/Connector + Metal type
-routing Track Tool

-.
LEF Block

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12
Netlist View Generation

• This is mainly used for back-end verification when the AMS is


• integrated within the SoC.
• An LVS (Layout Vs. Schematic) verification is usually
performed. This needs both netlist (Spice) and layout data.
• An Extractor Tool , such s Diva, can be used to extract a netlist
from a layout or a schematic.
• Make sure netlist format is correct. Check Transistor, resistor,
Capacitor parameters are consistent with layout.
Schematic /Layout Extractor Technology file

Tool

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Transistor netlist

Functional Model of Digital Interface


Generation

• This is required when a test vector simulation


is carried out at the SoC level of the complete
digital interface circuitry.
• For this a functional model of the digital
interface circuitry is required.
• No tool exists to convert analogue layout to
HDL. So this needs to be done manually.

T.Arslan
All rights reserved 2008

13
Static Timing Model Generation

• Generate Spice netlist from layout using


extractor (see earlier).
• Use netlist to generate static timing arcs,
k-factors etc. (Use Pspice,Hspice, or
Spectre).
• Build your Model in the required file
format (Manual Process).

T.Arslan
All rights reserved 2008

Generating GDSII Layout View

• GDSII is a layout format that is


universally understood by majority of
tools.
• Use a Layout Format Converter to
convert block layout to GDSII format
(e.g. CIF2GDS2).

T.Arslan
All rights reserved 2008

14
IP Block Authoring: Signal
Integrity Issues in
Block Authoring

T.Arslan
All rights reserved 2008

Signal and design Integrity in DSM


Block Design

• Timing and Reliability problems at .25 and


.18 micro technologies.
• These effect chip functionality and need to
tackled as early as possible during the design
flow.

• Main Strategy: detection and prevention early
at the design stage.
• Must be built in to design tools.
T.Arslan
All rights reserved 2008

15
Signal and design Integrity in DSM
Block Design

• Signal
-Crosstalk: errors+ Timing
-IR drop: power supplies
• Design
• Electromigration on power wires
• Hot Electron effects on devices
• Wire Self Heat on clocks and signals
T.Arslan
All rights reserved 2008

Crosstalk Effects - Errors

If VW (Victim Wire) is 0, a 0 to 1 transition on AW


(Aggressor Wire) will cause A GLITCH ON VW if voltage
change is beyond Threshold Voltage.
Effects:
Failure of dynamic logic AW

static logic will have timing problems

Wire R

Driver R
Grounded C
VW
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16
Crosstalk Effects - Timing Delays

Condition: VW and AW switching at the same time.


Timing on VW depends on: gate + interconnect delay,
behavior of adjacent wires.
Symptom: Inaccurate timing: 3-1diference VW

Result: Design constraints not satisfied.


Wire R

Driver
R Grounded Coupling C
C

AW

T.Arslan
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Crosstalk and Delay

• Helpful Glitch: AW and VW switching


at the same time in same direction.
• Unhelpful Glitch: AW and VW
switching at the same time in opposite
direction.

Sketch the profile of the waveforms!

T.Arslan
All rights reserved 2008

17
Cross talk Modeling
in TLF and LEF Files

• Crosstalk effect on timing is modeled by


plots of relative delay vs. relative rise
time for different coupling percentages.

• Valid model files:


TLF 4.1
LEF 5.3

T.Arslan
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Supply Voltage Drop

Timing depends
on power pin
Voltage Drop
Pad limits
Components with high activity have poor supply hence act slower.

T.Arslan
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18
Supply Electromigration

Current limit
related to
Wire width
Pad

High current causes degradation of the wire. This causes failure during the
lifetime of the product.
T.Arslan
All rights reserved 2008

Hot Electron Effect on devices

• Electron mobility in the channel will


damage the oxide above.
⇒effects device parameters/size

⇒ device operates out-of


spec,timing changes

T.Arslan
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19
Wire Self Heat
•Typically occurs at clock nets and other with high switching frequency.
•A wire (metal) expands and contracts due to switching activity, but oxide
does not.
⇒Wire will break or pass signal with reduced efficiency.

Oxide Metal
T.Arslan
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Dealing with Crosstalk within Block

Analysis: Compare slew with that of adjacent cells if not close, then
either:
-insert buffer (with better s-characteristics)
-upsize Rsource

Rwire

Rsource
Cwire

T.Arslan
All rights reserved 2008

20
Dealing with Wire Self Heat within Block

Analysis performed during placement:


Average, Peak , and RMS current calculations are compared to AC
current density limits for layers and vias in LEF.
Buffer insertion.
Wide wire routing.

Rwire

Rsource
Cwire

T.Arslan
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Post Routing Crosstalk Fix


Wide Space Routing

Shielded
Buffer
Routing
Insertion
Rsource

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21
Hot Electron: Slow input + Large Load

Fixes:
•Downsize effected driver, or
•Upsize driver on upstream logic to speed up input transition time
•insert driver on driver et to reduce output
Sketch the waveform profile !

T.Arslan
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Hot Electron: Fast input, Small Load

delete

Fixes:
•Upsize effected driver to reduce input transition rate,
•Remove intermediate buffer on driver net to increase load
capacitance

Sketch the waveform profile !


T.Arslan
All rights reserved 2008

22
Conclusions

• There are number of clocking schemes


which could be employed in the SoC
and an individual IP. Balanced Clock
Tree is the most commonly used.
Parameters such as skew are crucial in
designing a clock tree.

T.Arslan
All rights reserved 2008

Conclusions

• AMS IP Blocks require special design


features/guidelines.
• IP Blocks targeting smaller DSM
technologies may require special design
features in order to overcome problems
due to SI. Some of these could be solved
with IPO or post-layout modifications.

T.Arslan
All rights reserved 2008

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