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in a deep reactive-ion etching (DRIE) machine. The height
of the nanostructures was usually less than 1 µm. It should
also be noted that nanostructured surfaces similar to the
ones we use here have been shown to enhance pool boiling
heat transfer in [4, 15]. Then, to ensure the hydrophilic
wettability of the surface, the silicon structures were
oxidized by exposure to oxygen plasma in the RIE machine
for 30 minutes, resulting in a silicon dioxide layer
approximately 30 nm thick. A layer of Teflon®
fluoropolymer or Cytop® was then spin-coated at 2500 rpm
for 30 seconds and annealed at 250 °C or 125 °C,
respectively. The thickness of the polymer coating was less
than 100 nm. Zonyl FSN surfactant was added to AZ5214
photoresist to improve its wettability on the hydrophobic
surface and was subsequently spin-coated at 3000 rpm for
30 seconds. The photoresist was patterned by
photolithography into regular arrays of 50 µm diameter
hexagons, circles ranging from 25 µm to 100 µm in
diameter, or fractal arrays of circles ranging from 10 to 540
µm in diameter, shown in figures 2b and c.With the
photoresist as a mask, the hydrophobic layer was etched by
oxygen plasma for 3 minutes, thus defining hydrophobic
Figure 1. Process flow for the fabrication of the resistive islands amidst the hydrophilic network of oxide-covered
heater (backside) and the combination of superhydrophilic black silicon microstructures, shown in figure 2d. Finally,
and superhydrophobic patterns (front side). Not drawn to the photoresist etching mask was removed in acetone and
scale. the wafer was cleaved into chips.
SETUP
During the heat transfer experiments the chip was
placed in a polycarbonate chamber open to the atmosphere,
filled with degassed and deionized water as shown in figure
3. For more details see [11]. The resistive heater and
electrodes were encased in a 5-10 mm thick layer of PDMS
for electrical and thermal insulation. The water was
maintained at the saturation temperature of 100 °C with
submerged cartridge heaters. A data acquisition system
(OMEGA DAQ-55) was used to record the temperature
measured on the back of the wafer, Tmeas. From that
temperature, the temperature at the wafer-water interface
Tw= Tmeas-q”t/k was determined using Fourier’s law, where
q”, t and k are the respective heat flux, wafer thickness and
silicon thermal conductivity. For each data point the
temperature is obtained by averaging three hundred readings
over about three minutes. A 750 W power supply (Agilent
N5750A) was used to apply a given heat flux to the heater.
The CHF is determined as the heat flux corresponding to the
last observed stable temperature, beyond which a sudden
dramatic increase in temperature is observed.
The maximum combined uncertainty on the heat flux
was estimated as ±1.5 W/cm2, caused by the measurement
Figure 2. (a) SEM image of nanostructured black silicon of the heater area and the measurement of the electrical
surface, (b, c) chrome masks of the fractal and regular power. The maximum uncertainty on the superheat was
arrays of circles, and (d) the completed surface (fractal) estimated as ±1.5 K, due to the thermocouple uncertainty,
submerged in water; bubbles promptly form over the temperature acquisition and heater/wafer thickness
superhydrophobic spots making them visible to the naked measurement uncertainties. For superheat values less than 1
eye. The light green is (super)hydrophobic and the darker K the uncertainty on the HTC can be greater than 100 %.
green is superhydrophilic. This error decreases as the superheat increases and is less
than 20 % of the HTC at superheats above 5 K.
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Power Supply Thin film K-type
Submerged thermocouple
+- cartridge heaters
a
Silicon
Silicon dioxide
Copper
Teflon®
PDMS
Polycarbonate chamber
Figure 3. Pool boiling setup for heat transfer experiments.
1195
We would also like to note that that the surfaces with and Fluid Science, vol.16, pp. 332-341, 1998.
superhydrophobic islands (0º/150º) show a HTC 100% [4] Li, C., Z. Wang, P.I. Wang, Y. Peles, N. Koratkar, and
higher than the best state-of-the-art nanoengineered surfaces G.P. Peterson, "Nanostructured copper interfaces for
[4, 11, 15]. enhanced boiling", Small, vol.4, pp. 1084-1088, 2008.
All the surfaces tested in this work facilitated bubble [5] Chen, R., M.-C. Lu, V. Srinivasan, Z. Wang, H.H.
nucleation. For comparison the hydrophilic SiO2 (7º) Cho, and A. Majumdar, "Nanowires for enhanced
surface, tested in [11], required a superheat over 15 K boiling heat transfer", Nano Lett, vol.9, pp. 548-53,
before significant nucleation occurred and the surface was 2009.
not saturated with bubbles until the heat flux was close to [6] Kim, S., H.D. Kim, H. Kim, H.S. Ahn, H. Jo, J. Kim,
CHF. The (0º) and (0º/120º) surfaces showed significant and M.H. Kim, "Effects of nano-fluid and surfaces
nucleation with a superheat of 10 K and the surfaces with with nano structure on the increase of CHF",
superhydrophobic islands (0º/150º) promoted nucleation at Experimental Thermal and Fluid Science, vol.34, pp.
an even lower superheat and heat flux. For this surface 487-495, 2010.
(0º/150º) the entire heated area was saturated with bubbles [7] Dhir, V.K. and S.P. Liaw, "Framework for a unified
at heat flux q” = 25 W/cm2 and superheat ΔT = 3 K, which model for nucleate and transition pool boiling",
is consistent with the idea that an increase in hydrophobicity Journal of Heat Transfer, vol.111, pp. 739-746, 1989.
increases the number of nucleation sites. [8] Wang, C.H. and V.K. Dhir, "On the gas entrapment
Explaining the observed trends is complex because pool and nucleation site density during pool boiling of
boiling is a transient, multiphase phenomenon; visualization saturated water", Journal of Heat Transfer-
is difficult especially for the violent boiling near CHF, and Transactions of the ASME, vol.115, pp. 670-679,
the geometry and wettability of these enhanced surfaces is 1993.
complex. We conjecture that the enhancement in HTC is [9] Wang, C.H. and V.K. Dhir, "Effect of surface
due to an increase in the number of nucleation sites from the wettability on active nucleation site density during
superhydrophobic and hydrophobic islands as well as from pool boiling of water on a vertical surface", Journal of
cavities in the nanostructured surfaces. The HTC Heat Transfer-Transactions of the ASME, vol.115, pp.
enhancement could also be attributed to the increased 659-669, 1993.
surface area from the nanostructures. The increase in critical [10] Jones, B.J., J.P. McHale, and S.V. Garimella, "The
heat flux may be due to increased surface wettability or Influence of Surface Roughness on Nucleate Pool
wettability contrast, moderation of instabilities, or from Boiling Heat Transfer", Journal of Heat Transfer-
wicking in the nanostructures. More analysis with simpler Transactions of the Asme, vol.131, 2009.
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areas enhance heat transfer?",Applied Physics Letters,
CONCLUSIONS 2010.
In summary we have combined micro- and [12] Wang, C.H. and V.K. Dhir, "Effect of Surface
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Cho, and A. Majumdar, "Nanowires for enhanced
boiling heat transfer", Nano Letters, vol.9, pp. 548-
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