36-00-012C Design Review - Reliability

PRODUCT SPECIFICATIONS
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DESIGN REVIEW TOOL FOR ELECTRONIC PARTS AND SYSTEM RELIABILITY << CIRCUIT PARTS MOUNTING CHECK LIST >>
Normalisation Renault Automobiles RE-DS / Service 65850
RENAULT
RENAULT 2008. No duplication permitted without the consent of the issuing department. No circulation permitted without the consent of RENAULT and NISSAN.
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This document is to be considered as a whole, the parts of which shall not be separated.
DATE OF ISSUE September 2002 --First edition in RENAULT S.A.S. Common specifications between RENAULT NISSAN.
REVISIONS October 2003 March 2005 - - A Complete re-edition Common specifications between RENAULT NISSAN. - - B Addition of items about Ag TH Modification of the item II-2-1 1 Common specifications between RENAULT NISSAN. - - C Foreword Paragraph : Special note added to mention the use of IPC-A-610 Class 3. Paragraph 1: Deletion of item related to EMC design review. EMC design rules will not be reviewed during this activity. Paragraph 4 : Addition of the figures number in the table. Changed paragraphs : Point I-1-1-2 : New check points are added. Point I-1-1-9 : Check point (2) is modified. Descriptions are corrected. Point I-1-1-11 : Indication "Perforated line" in the diagram is deleted. Point I-2-1-3 : Tapping screws item is added. Point II-1-2-1 : Reference values are changed. Point II-1-4-9 : Item name is changed. Additional diagram is added. Reference values of check point (2) are eliminated.
November 2008
Criteria to be consulted separately are specified. Point II-1-4-10 : Item name is changed. Reference values of check point (4) are eliminated.
Additional comments in diagram are added. Point II-1-4-11 : Item name is modified. Comments and criteria are corrected. Point II-1-6-9 : Comments are added to the diagram. Point II-1-8-8 : Item is moved from an old item II-2-3-1 to other items concerning BGA and CSP. Point II-2-3 : Paragraph renamed "Other" instead of "Finition < BGA, CSP >".
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Point II-2-3-1 : BGA underfill items is moved to be with other items concerning BGA and CSP (general BGA paragraph) and changed to II-1-8-8. Additional items : Point I-1-1-18 : New item is added : Prevention of core cable core wire dispersion. Point I-1-1-19 : New item is added : Condition of Cu plating on the inner wall of the via hole. Point II-1-3-11 : New item about lead-free is added : Whiskers. Point II-1-3-12 : New item about lead-free is added : Decrease in solder strength. Point II-1-3-13 : New item about lead-free is added : Deformation of solder. Point II-1-4-12 : New item about press fitting design : Damage of adjacent solder mounted parts. Point II-1-4-13 : New item about press fitting design : Electrical characteristics of press fitting (insulation resistance). Point II-1-4-14 : New item about press fitting design : Mechanical strength characteristics of press fitting (durability retention force). Point II-2-2-3 : New item about coating material design : Coating material that has intruded under the bottom of parts. Additional paragraphs : I-1-5 Paste jumper (7 items) I-1-6 Metallic core circuit board (2 items) I-1-7 Metal circuit board (2 items) Common specifications between RENAULT NISSAN. This issue originates from Draft NC 2008 0850 / - - -
REFERENCED DOCUMENTS External Document IPC-A-610 Class 3
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CONTENTS
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Page 1. 2. 3. 4. 5. PURPOSE SCOPE HOW TO USE CHECK LIST DETAILED CHECK ITEMS < I > CIRCUIT BOARD MOUNTING DESIGN CHECK ITEMS < I-1 > CIRCUIT BOARD DESIGN < I-1-1 > CIRCUIT BOARD DESIGN <COMMON> < I-1-2 > CIRCUIT BOARD DESIGN <CERAMICS> < I-1-3 > CIRCUIT BOARD DESIGN <FLEXIBLE> < I-1-4 > CIRCUIT BOARD DESIGN <Ag-TH CIRCUIT BOARD> < I-1-5 > CIRCUIT BOARD DESIGN <PASTE JUMPER> < I-1-6 > CIRCUIT BOARD DESIGN < METALLIC CORE CIRCUIT BOARD> < I-1-7 > CIRCUIT BOARD DESIGN <METAL CIRCUIT BOARD> < I-2 > CASING DESIGN < I-2-1 > CASING DESIGN <COMMON> < I-2-2 > CASING DESIGN CHECK ITEMS < I-2-3 > CASING DESIGN CHECK ITEMS < II > PRODUCT MOUNTING QUALITY CHECK ITEMS < II-1 > ELECTRICAL CONNECTION < II-1-1 > ELECTRICAL CONNECTION <COMMON> < II-1-2 > ELECTRICAL CONNECTION <SOLDERING COMMON> < II-1-3> ELECTRICAL CONNECTION <SOLDERING LEAD FREE> < II-1-4> ELECTRICAL CONNECTION <PRESS FITTING> < II-1-5> ELECTRICAL CONNECTION <DIE BONDING> < II-1-6 > ELECTRICAL CONNECTION <WIRE BONDING> < II-1-7 > ELECTRICAL CONNECTION <CONDUCTIVE ADHESIVE> < II-1-8 > ELECTRICAL CONNECTION <BGA, CSP> < II-2 > FINITION < II-2-1 > ASSEMBLY <COMMON> < II-2-2 > FINITION <COMMON> 5 5 5 6 31
I-1 (32) I-2 (33) I-2 (33) I-21 (52) I-61 (92) I-64 (95) I-67 (98) I-74 (105) I-76 (107) I-78 (109) I-78 (109)
TO BE COMPLETED TO BE COMPLETED
II-1 (119) II-1 (119)

TO BE COMPLETED
II-2 (120) II-10 (129) II-24 (142) II-38 (156) II-44 (162) II-54 (172) II-55 (173) II-63 (181) II-63 (181) II-64 (182)
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FOREWORD
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This document is identical to NISSAN document 28400NDS52 [11]. When it is altered a notice shall be given to RENAULT secretariat. It complies with the agreement reached between RENAULT and NISSAN in November 2008. SPECIAL NOTE : This standard shall be as per IPC-A-610 CLASS-3 in principle. 1. PURPOSE This is a Design Review Tool providing a guideline for electronic circuit parts mounting and for the design reviews of electronic parts and systems reliability. This tool should be used as a practical guide for design works (mounting layout, material selection for electronic parts) to best fit to reliability and environmental resistance requirements. This tool does not aim at establishing standard judgement criteria, but at identifying potential weaknesses and effective safety allowances and notify them to the designers. 2. SCOPE This standard is applicable for the design reviews of either electronic parts and systems. It should be mainly used for circuit board design, mounting, and exterior design (non-PCB related parts).
36-00-012
Check list of conform mounting - Circuit board design - Mounting design - Exterior design (non-PCB related parts) 3. HOW TO USE 1) Checks should be done using the following materials and samples : Actual unit, Prototype A, B, C, D Electrical diagram Layout diagram Circuit calculation form Technology test results (In the case of a new material or construction method introduction)
The review should be performed after confirming that the analyzed unit was designed and manufactured according to the specifications. 2) The review should be performed with the following method : For each item to check in the check list (4), judge the conformity with an actual unit. (Take into account the design tolerances and production variations when judging the conformity). If more accurate explanations are needed, refer to the Detailed Check Items section (5) Concerning the influence of current load and the heat generating elements, please refer to the circuit calculation sheet. Concerning the solder joints appearance and the effects of the material used, please refer to the technology test results. Fill the Conformity column of the check list (4) with the following items In case of dubious item : In case of OK : In case of NOK : CA (Caution) P (Pass) FA (Fail)
In the "Comments" column, explain or comment the results of the conformity check. Page 5
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4. CHECK LIST
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RENAULT I Circuit board design check items

I - 1 Circuit board design I - 1 - 1 Circuit board design < Common >
N Item Points to check
Check the mounting conditions of the parts that may move and enter in contact with other parts or structure. Check if there is any heat sensible part (electrolytic capacitors, etc..) near the heat generating parts. Check if the heat resistance of the casing is sufficient. If there are any heat generating parts/elements, confirm that adjacent heat generating parts/elements are extracted. Check if heat conduction and radiation heat from the extracted parts/elements besides self-heating dose not impair the function. Check that some securing has been provided for the large parts and the parts with a high center of gravity. Check if the distances between adjacent conductors are sufficient for good insulation. Check that the clinching operation does not damage the concerned part or the PCB.
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Fig. Status
(1) (2) (3) (1)
Comments
Page
I-2 33
1 Mounting direction of parts 2 Location of heat generating parts
(2) I-3 34
(3)
3 Mechanical securing of parts 4 Distance between lead and adjacent conductor 5 Clinching
(1) I-4 (2) (1) (2) (3) (1) I-6 (2) (1) 37 I-5 36 35
Check that the leads forming shape is adequate so the parts are not damaged during the forming process. (Check for cracks on the lead surface or damages on the parts body caused by mechanical stress). Check that the forming leads can absorb the stresses due to the materials heat expansion. 7 Clearance provided Check if the heat generating elements for heat radiation (power tr, etc...) and the heat radiation plate are secured properly. (Ensure the heat radiation requirements are met) Check if a heat radiation plate is provided for the heat generating elements. Check if the heat generation has any effect on the solder joints. Check that the length of the heat radiation passage is sufficient. 6 Leads forming shape 8 Pattern width Check the width and thickness of the circuit board pattern are adequate.
(2)
I-7
38
(3)
(1)
(2) (3) (4) (1)
I-8
39
Check if the number of via is adequate, and the diameter of via is sufficient. 9 Distance between Check that the distance between patterns conductive lines is sufficient to ensure insulation. Check that the distance between lands and circuit patterns is adequate for insulation resistance. 10 Location of test pad Check that the layout of the test pads is adequate. 11 Distance from the Check that measures to prevent pattern to the edge damages on the pattern are provided of the PCB during the singulation operation.
I-9 (2)
40
(1) I-10 (2) I-11 (1) I-12 (2) 43 42 41
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I - 1 Circuit board design I - 1 - 1 Circuit board design < Common >
N Item Points to check Fig. Status
(1)
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Comments
Page
12 Layout of via hole
13
14
15
16
Check that the insulation between components leads and adjacent VIA holes or empty plated through holes is maintained even if soldering rises up the hole. Check that the insulation between metal casing components (tuner, etc...) and empty plated through holes or VIA holes is provided. (A rise of soldering through the holes should be taken into account). Via hole Check that the solder resist and the coating application in the VIA holes is appropriate. Parts likely to Check that a vent passage is hinder the rising of provided under the through hole soldering in the components that may seal completely plated through hole the upper side of the plated through hole. (soldering would thus not be able to rise up the hole.) Cable layout Check that measures for insulation are taken. Check that measures to prevent disconnection are taken. Check that sufficient clearance is provided. Check that measures to prevent jamming when assembling are provided Check that there is no interference with adjacent parts when cables are moved. Check that the length of the cables Securing cable and the securing method of the cables are adequate Check that the diameter and the length of the cable are adequate. Check if the core wires are joined to the terminals while being dispersed. Confirm that the plating thickness of the via hale is appropriate. Confirm that the roughness of the inner wall of the via hole is appropriate.
I-13 (2)
44
I-14
45
I-15
46
ALL ALL ALL I-16 no fig (5) (1) I-17 (2) I-18 I-19 49 50 48 47
17 Diameter of the cable 18 Prevention of core cable core wire dispersion 19 Condition of Cu plating on the inner wall of the via hole
I-20
51
RENAULT 2008

I - 1 Circuit board design I - 1 - 2 Ceramics board
Check the minimum pattern width. Check the minimum pattern spacing. Check the pattern design. 2 Distance between the pattern and the edge of the circuit board 3 Distance between the connection points 4 Location of the connection points 5 Location of the connection points 6 Connection between the pads and the wires 7 Connection points dimension Check the distance between the edge of the circuit board and the pattern.
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Fig. Status
Comments
Page
I-21 52
1 Pattern width and intervals
I-22
53
Check the distance between the connection points of different conductors. Check the relative position of the connection points between different layers. Check the direction of the pattern where the connection points are located. Check the connection between the pads and the pattern.
I-23
54
I-24
55
I-25
56
I-26
57
Check the overlap between the pattern of the upper layer and the pattern of the lower layer. Check the distance between the edge of the connection point and the overlap of pattern. 8 Cross over pattern Check the minimum value of the dimensions overlap of pattern between upper and lower layers. Check the minimum distance between the edge of the pattern on the bottom layer and the edge of the insulation glass. Check the minimum distance between the edge of the insulation glass and the connection point. 9 Connection points Check the design measures that are available when a multi-layer pattern between different lay very close to another pattern. layers 10 Dimensions of the Check the distance between the die wire bonding pad bond pads and the W/B pads. Check the distance between adjacent W/B pads. Check the width of the W/B pads. Check the length of the W/B pads.
(1) I-27 (2) 58
(1)
(2)
I-28
59
(3)
I-29 (1) (2) (3) I-30
60
61
11
12
13 14
(4) Check the overlap between the W/B (5) pads and the wiring. Distance between Check the distance between the part the part land and lands and the edge of the circuit the board edge board. Part land and Check the distances between the pattern parts lands and the neighboring pattern. Distance between Check the distance between the parts lands lands. Distance between Check the distance between the the thick film insulation glass and the thick film resistances and the resistances. insulation glass
I-31
62
I-32 I-33
63 64
I-34
65
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(1) (2) (3) (4) (5) (6)
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Comments
Page
15 Dimensions of the Check the length of the resistance. thick film resistance Check the width of the resistance. Check the overlap of the thick film resistance and the pattern. Check the distance between the resistance and adjacent pattern. Check the distance from the overlap between the thick film resistance and the pattern, to the edge of the pattern. Check the width of the pattern that overlaps the thick film resistance. 16 Location of the thick Check the location of the thick film film resistances resistances 17 Dimensions of the overglass Check the range of the overglass
I-35
66
I-36
67
Check the distance between the edge of the overglass and the pattern. Check the distance between the overglass and the edge of the circuit board. Check the distance between pads and the edge of the overglass. Check the distance between the edge of the resistance and the edge of the overglass. Check the relative positions of the 18 Overglass and overglass and the insulation glass insulation glass 19 Location of the VIA Check the distance between the edge holes of the circuit board and the hole ( A) Check the hole intervals (B) Check the diameter (C) 20 Shape of the VIA holes
(1) (2) (3) (4) I-38 69
I-37
68
I-39
70
21 22 23 24
25 26
(1) Check the diameter of the VIA hole (1) (When inserting lead). Check the diameter of the VIA hole (2) land. Check the connection between the (3) VIA hole and the pattern. VIA holes and parts Check the relative position of VIA lands holes and parts lands. VIA hole and test Check the location of the test pads for pad continuity test VIA hole and Check the distance between VIA pattern holes and adjacent pattern. Flaws, cracks, Check for flaws, cracks, chipping or chipping or discoloration disconnection Camber Check the camber of the ceramic board. Trimming status Check for cracks Check that the resistor material is removed completely. Check the starting position of the trimming Check the contact area of the thick film resistance and the pattern. Check the trimming margin Check for chippings Check for pinholes
Check the diameter of the VIA hole.
I-40
71
I-41 I-42 I-43 I-44 I-45
72 73 74 75 76
I-46
77
27 Alignment 28 Trimming margin 29 Chipping and pinhole
I-47 I-48 I-49 I-50 I-51 I-52
78 79 80 81 82 83
30 Extrusion of resistor Check for extrusions of resistor 31 Impurities, blistering Check for impurities, blistering or foaming and foaming 32 Insulation Check the insulation resistance resistance
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Check for protrusions or recesses Check for flaws and traces of the test probes. Check for flaws and traces of the test probes. Check for flaws and traces of the test probes Check for flaws and traces of the test probes Check for extrusion of pattern. Check for voids
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Fig. Status
Comments
Page
I-53 I-54 I-55 I-56 I-57 I-58 I-59 I-60 84 85 86 87 88 89 90 91
33 Protrusions or recesses 34 Flaws and test probe traces (1) 35 Flaws and test probes traces (2) 36 Flaws and probe inspection (3) 37 Flaws and probe inspection (4) 38 Extrusion 39 Void
40 Corrosion, foaming Check for corrosion or defective or blistering adhesion
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I - 1 Circuit board design I - 1 - 3 Flexible Printed Circuit
Check if there are any corners in the pattern. Check that the lands and the VIA holes are designed to avoid any concentration of stress. 2 Shape of the solder Check that the parts lands are resist designed to avoid peeling. 3 Pattern layout Check that the pattern is designed to avoid stress concentration.
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Fig. Status
(1)
Comments
Page
1 Shape of the pattern
I-61 (2) (1) (2) (1) (2) (3) (4) (5) I-63
92
I-62
93
94
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I - 1 Circuit board design I - 1 - 4 Ag-TH circuit board
Confirm that sufficient spacing between the interior surface of the Via hole and the silver paste edge is provided. Confirm that sufficient spacing between the silver paste and the adjacent copper foil traces is provided. Confirm that the overcoat is formed properly. Check if there is no via hole under the surface mounted devices.
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Fig. Status
Comments
Page
1 Spacing between traces
I-64
95
2 Overcoat shape 3 SMD
I-65 I-66
96 97
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I - 1 Circuit board design I - 1 - 5 Paste jumper
N
2
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Item
Points to check
Fig. Status
Comments
Page
I-67 I-68 98 99
1 Overcoat width
Check that the overcoat fully covers the conductive paste. Undercoat width Check that the overlapping width of the undercoat and conductive paste is sufficient. Configuration of Check that the conductive layer is not insulation layer easily cut or easily thinned by the surface height difference. Check that the conductive layer is not Insulation layer easily cut or easily thinned by the structure of surface height difference. connecting land Check that the jumper width is Conductor width adequate. and clearance between conductors Check that the clearance between jumpers is adequate. (LINE/SPACE) Paste thickness Check that the thickness of the conductive paste is sufficient. Check that the connection of the Cu and paste is satisfactory. Check that the specified base material is adequate. Applicable circuit Check that the use of the conductive paste jumper is adequate.
I-69
100
I-70
101
I-71
102
I-72
103
I-73
104
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I - 1 Circuit board design I - 1 - 6 Metallic core circuit board
Check that there is no problem with the condition of the filling resin between the through hole and the metallic core of the metallic core circuit board and material selection. Check that the proper size is used for the surface mounted chip resistor of the metallic core circuit board.
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Fig. Status
Comments
Page
1 Circuit board through hole, via hole
I-74
105
2 Parts to be mounted
I-75
106
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I - 1 Circuit board design I - 1 - 7 Metal circuit board
N Item Points to check Fig. Status Comments
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Page
I-76 107
1 Circuit configuration Check that the circuit configuration at based on circuit the base metal area of the metal board circuit board can avoid any migration of the insulation layer. 2 Insulation There shall be no decrease or performance of deterioration in the insulation metal circuit board performance before and after part mounting.
I-77
108
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I - 2 Casing design I - 2 - 1 Casing design < Common >
Check that the specified clearance is provided.
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Fig. Status
(1) (2) (3) (4) (5)
Comments
Page
1 Part clearance short- circuiting
I-78
109
2 Interferences between parts
Check that the specified clearance is provided.
(1) (2) (3) I-79 110
3 Fastening of parts Check that measures to prevent loosening of the screws have been strength taken. Check that the clearances between the end of the circuit board and the internal surface of the holes are sufficient. 4 Fastening of parts Check that the fastening method is electrical appropriate. connection
(1) I-80 (2) 111
(1) (2) (3) I-81 112
5 Prevention of drosses when screws are tightened. 6 Direction of the connectors
Check that the holes into aluminium base materials are all passing through holes. Check that the mounting design of the (1) connectors is taking into account the ECUs mounting conditions aboard (2) the vehicle.
I-82
113
I-83
114
7 Position of the case Check if the relative position of the and the connectors case opening and the end of the connector is adequate. Check that the attaching and detaching operations are not too stressful for the connector (PCB side) and its solder joints. Check that the circuit board is not damaged when attaching and detaching the connector (vertical type). 8 Sealing of the case Check that the generation of dew inside the casing has been taken into consideration for the design of the case. 9 Case opening Check that static electricity from the circuit board is discharged into the opening of the case. 10 PCB support Check if the PCB is surely secured in arrangement the casing.
(1)
I-84
115
(2)
I-85
116
I-86 I-87
117 118
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RENAULT II Product confirmation check items

Fig. II - 1 Electrical connection II - 1 - 1 Electrical connection < Common > N Item Points to check Fig. Status Comments
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Page
TO BE COMPLETED
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II - 1 Electrical connection II - 1 - 2 Soldering - Common
(1) (2) (3) (4) (5) (6) (7) (8) (1) (2) (3) (4) (5) (6) (7) (1) (2) (3) (4) (5) (1) (2) (3) (4) (1) (2) (3) (4) (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) (11)
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Comments
Page
1 Shape of the solder Check that the solder joints shape is fillet (plated through adequate. hole)
II-2
120
2 Shape of the solder Check that the solder joints shape is fillet (non plated adequate. through hole)
II-3
121
3 Shape of the solder Check that the solder joints shape is fillet (chip parts) adequate.
II-4
122
4 Shape of the solder Check that the solder joints shape is fillet (gull wing lead) adequate.
II-5
123
5 Shape of the solder Check that the solder joints shape is fillet (J shape lead) adequate.
II-6
124
6 Shape of the solder Check that the solder joints shape is fillet (cable and lead adequate. parts)
II-7
125
7 Shape of the solder Check that the wetting of the solder is fillet (empty through adequate. holes) 8 Solder ball Check that the materials, the process settings and the facilities (printing shape and the amount of soldering) make it hard to produce solder balls. 9 Insulation Check that the insulation (1) resistance characteristics are not affected by residual flux. Check that the residual flux cannot be responsible of short contact failure (2) between the contact patterns.
II-8
126
II-9
127
II-10
128
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II - 1 Electrical connection II - 1 - 3 Soldering - Lead free
Check for fillet lifting. Check for land lifting. Check for damages on the pattern due to land lifting. 3 Separation of the lead terminal 4 Shrinkage cavity 5 Separation of the SMD terminal 6 Separation of the SMD land 7 Separation of the SMD fillet 8 Check that the lead terminal does not separate. Check that there is no cavity. (1) (2)
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Fig. Status
Comments
Page
II-11 II-12 129 130
1 Fillet lifting 2 Land lifting
II-13 II-14 II-15 II-16 II-17
131 132 133 134 135
10
11
12 13
Check that the SMD terminals do not separate from the solder joint.. Check that the SMD land do not separate from the solder joint. Check if a local remelting of the solder joints during the flow process occurs. Separation of the Check if a local remelting of the BGA BGA ball balls solder joints during the flow process occurs. Plated through hole Check for any delamination of the damages through hole (separation between the (1) plating and the epoxy resin). Check that there is no damage on the (2) pattern of the inner layer and its connection with the plating. Copper erosion Check for any wane of copper (lands, plated through hole, via hole) due to erosion. Whiskers Check that no whiskers have formed (thin areas of parts plating and solder fillet). Decrease in solder Check that there is no decrease in the joint strength. strength Solder deformation Check that there is no solder deformation.
II-18
136
II-19
137
II-20
138
II-21 II-22 II-23
139 140 141
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II - 1 Electrical connection II - 1 - 4 Press fitting
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Page
II-24 142
1 Press fitting process 2 Land damages Check that the shape and the dimensions of the pin to be press fitted and the internal diameter of the plated through hole are adequate. (1) (2) (3)
II-25
143
3 Resin damages
(4) Check that the shape and dimensions (1) of the pin to be press fitted and the internal diameter of the plated (2) through hole are adequate.
II-26
144
4 Plated through hole Check that the shape and dimensions (1) damages of the pin to be press fitted and the (2) internal diameter of the plated (3) through hole are adequate.. (4) 5 Inner layer pattern Check that the shape and dimensions (1) damages of the pin to be press fitted and the internal diameter of the plated (2) through hole are adequate. 6 Peeling of the Check that the shape and dimensions (1) surface of the PTH of the pin to be press fitted and the or pin internal diameter of the plated (2) through hole are adequate. 7 Inclined press fitted Check that the shape and dimensions of the pin to be press fitted and the pins internal diameter of the plated through hole are adequate. Check that the accuracy of the pin location is adequate. There should be no buckling of the pin and no stress or deformation of the resin or land due to inclined insertion. 8 Extension of the Check that some measures have pattern been taken to avoid stress on the pattern due to press fitting. Check that the materials used for the 9 Electrical pin and the plated through hole are characteristics of adequate. press-fitting (connection Check that the finish tolerances of the resistance) plated through hole and the tolerances for the outside diameter of the pin are adequate. 10 Mechanical strength Check that the materials used for the pins and the plated through holes are characteristics of adequate. press-fitting Check that the finish tolerances of the (insertion force, plated through hole and the initial retention tolerances for the outside diameter of force) the pin are adequate. 11 Characteristics of mechanical pressfitting strength Check that the materials used for the pin and through hole are adequate.
II-27
145
II-28
146
II-29
147
II-30
148
II-31
149
(1) II-32 (2) 150
(1) (2) (3) (4) II-33 151
Check that the finish tolerances of the plated through hole and the tolerances for the outside diameter of the pin are adequate. 12 Damage of adjacent Check that the solder mounted parts solder mounted are arranged with enough clearance parts to avoid damage due to the pressfitting stress.
II-34
152
II-35
153
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II - 1 Electrical connection II - 1 - 4 Press fitting
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Page
II-36 154
13 Electrical Check that the shape and the characteristics of dimensions of the press fitting pin and press-fitting the finish diameter of the through hole (connection are adequate. resistance) 14 Mechanical strength Check that the materials used for the characteristics of pin and through hole are adequate. press-fitting Check that the finish tolerances of the (durability retention plated through hole and the force) tolerances for the outside diameter of the pin are adequate.
II-37
155
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II - 1 Electrical connection II - 1 - 5 Die bonding
Check the surface of the chip. Check the silver paste extrusions around the chip. Check the adherence of the silver paste on any other metal film. 2 Uncured silver paste status 3 Void Check the shape of the uncured silver paste. Check the dimensions of the soldered area Check for voids in the contacting surface Measure the die shear strength Check the inclination of the chip Check the deviation between the chip and the die pad.
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Fig. Status
(1) (2)
Comments
Page
1 Status of silver paste
II-38
156
II-39
157
II-40 II-41 II-42 II-43
158 159 160 161
4 Die shear strength 5 Inclination of the chip 6 Deviation of the chip
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23

II - 1 Electrical connection II - 1 - 6 Wire bonding
Check the diameter of the ball bond Check the location where the wire is rising from the all. 2 Position of the pad Check the deviation of the ball bond from the bonding pad. and the bond (1) Check the intermetallic compounds. 3 Bond shape (2) Check the bond width W. Check the bond length L. Check the trace of the bonding tool. 4 Location of pad and Check the deviation of the bond. bonding (2) Check the bond width. 5 Bond shape (3) Check the bond length. 6 Position of the pad Check the deviation of the bond. and the bond (3) Check the wire tail. 7 Wire shape (1) 8 Wire shape (2) 9 Tensile strength 10 Rupture mode Check the shape of the wire loop. Check the height of the wire loop. Check for damages on the wire. Check the course of the wires. Measure the tensile strength of the wires. Check the rupture mode.
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Fig. Status
(1) (2) (1) (2) (1) (2) (3)
Comments
Page
II-44 162
1 Bond shape (1)
II-45
163
II-46
164
II-47 (1) (2) (1) (2) (1) (2) (1,2) II-48 II-49 II-50 II-51 II-52 (1) (2) (3) (4) (5) II-53
165 166 167 168 169 170
171
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II - 1 Electrical connection II - 1 - 7 Conductive adhesive
Check that the contact angle (wetness) between the material of the electrodes, the filler and the base adhesive material (resin) are adequate. Check that the electrodes and the conductive adhesive are adequate.
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Fig. Status
Comments
Page
1 State of the joint between electrode and conductive adhesive
II-54
172
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II - 1 Electrical connection II - 1 - 8 BGA, CSP
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Page
II-55 173
1 BGA chip mounting process 2 Melting condition of Check that the melting of the BGA balls and the solder paste are the BGA balls sufficient. Check that no strong residual stress remains for the package and the BGA balls. 3 Shape of the solder Check if there is any design of the balls land or mounting that is likely to cause distortion, deformation or cracking on the BGA ball, and deteriorate the reliability. (1)
II-56 (2) (1) (2) (3) (4) (5) (6) (7) (8) II-57
174
175
4 Package side connection design 5
6 7
Check for any design which may affect reliability or likely to cause cracks. Extension of pattern Check that materials, process from land settings and facilities likely to reduce solder balls are provided. Extension of pattern Check that the extension pattern from land design is not easy to disconnect. Underfill Underfill is mandatory for BGAs to ensure reliability. Check that material selection for the underfill is adequate. Filling condition of Check the conditions of the filling of the underfill the underfill.
(1) (2)
II-58
176
II-59 II-60
177 178
II-61
179
II-62
180
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II - 1 Electrical connection II - 1 - 9 Weld
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II - 2 ASSEMBLY II - 2 - 1 Assembly < common >
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Page
- Regardless of the check results, conduct the corrosive gas resistance test (28401NDS01, 36-00012 CH12) to prove that no sign of corrosion is identified. - If sign of corrosion is identified, estimate remaining longevity to determine through individual consultation. - Regarding 25% of the initial coating thickness as longevity, determine remaining longevity in reference to the corrosion rate at 0.5 m/year. - The 4th check point shall be verified subject to gas emission from an actual device.
1 Corrosion on Ag electrode by sulfurated gas Check if the structure is designed so that the Ag electrode is not exposed. Confirm that the exposed Ag electrode is protected by circuit board Confirm that the overcoat glass prevents the Ag electrode from being exposed. Check if there are materials that emit sulfurous gas near the ECU in the same closed space.
II-63
181
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II - 2 ASSEMBLY II - 2 - 2 Resin, Coating, Potting
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II-64 182
1 Defective conductivity of contact 2 Potting using hard resin
Check that the type of adhesive, sealant, sealing agent and grease are adequate. Check that the potting of the solder joints is adequate. Check that the material for potting is appropriate. Check that the material 3 Coating material characteristics are according to the that has intruded under the bottom of design. Check that coating material that has parts intruded into the space between the part and circuit board does not apply stress to the soldered joints.
II-65
183
II-66
184
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II - 2 ASSEMBLY II - 2 - 3 Other
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5. DETAILED CHECK ITEMS
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<I> Circuit board mounting DESIGN check items
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1
Items
Circuit board design < Common > All parts
Items to check
Mounting direction of parts
Concerned parts
(1)
(2) Short-circuits because of contact between parts leads. NOK OK
NOK
Interference
(3) NOK OK
Cases that are not concerned by this specification Adhesive
Parts not able to move
Parts with hard leads
Parts glued with adhesive
Points to check the parts that may move and enter in contact with other parts or structure.
Conformity status possible in the concerned parts movement free area.
Alternate if not reachable mounting direction because of the layout, enough clearance or insulation material should be provided so no short circuit could occur even if the parts body falls down.
! Check the mounting conditions of " There should be no contact # If it is not possible to change the
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2
Items
Circuit board design < Common > Heat generating parts
Items to check
Location of heat generating parts
Concerned parts
(1) NOK
Temperature increase Heat generation Heat generation
1.0
Heat Radiation
2.2 F
Heat Radiation
Example of heat generating elements: Shunt resistances, Power transistors, power source ICs, etc (2) NOK Plastic case Heat generating element (Tr, etc)
(3) NOK
Example of heating elements : shunt resistor, power transitor, power source IC, bulbs, etc.
Points to check
Conformity status
Alternate if not reachable
Check if there are any low heat resistant elements such as an electrolytic capacitor near the heating elements. (1)
"
Enough clearance shall be provided, taking into account the heat source temperature, the heat resistant
There should be no functional failure after the durability test.
temperature of adjacent parts and the heat conduction rate of pattern. (1)
! !
Confirm that the heat resistance of the case, circuit board, etc. is sufficient. (2) If there are any heat generating
" "
There shall be no breakage due to heat. (2) There shall be no breakage of the part's body and the joints due to heat. (3)
There shall be no functional failures after the durability test. (Verification shall be performed under which temperature rise is the most significant.)
parts/elements, confirm that adjacent heat generating parts/elements are extracted.
Check if heat conduction and radiation heat from the extracted parts/elements besides self-heating dose not impair the function. (3)
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3
Items
Circuit board design < Common > Large parts
Items to check
Mechanical securing of parts
Concerned parts
(1)
OK Block condenser with claw seat
NOK
X'tal
Claw Securing
Crack
(2)
OK
Ex : Si potting PCB Ex : Si potting
* If the reinforcement on the left could not be applied, a plated through-hole should be used (if a single side PCB is not enough)
Points to check been provided for the large parts and the parts with a high center of gravity.
Conformity status should be provided.
Alternate if not reachable failure and no damage on both lead and soldering after vibration resistance test.
! Check that some securing has " Securing or reinforcing material # There should be no functional
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4 Distance between lead and adjacent conductor
Items
Circuit board design < Common > Through hole components
Items to check
Concerned parts
(1) Clinched lead to clinched lead
Clinched leads may be too close
(2)
Lead to Pattern
(3)
Clinched lead to pattern
a a
Watch for shorts
Points to check
Conformity status clearance between conductors with different voltage should be: a > 1.0 mm
! Check if the distances between " The

adjacent conductors are sufficient for good insulation.
# Insulation test, high temperature

and high humidity bias test should be performed to check if there is any functional failure possible due to poor insulation resistance or electromigration.
" The
clearance between conductors with equal voltage should be : a > 0.5 mm.
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5
Items
Items to check
Clinching
Concerned parts
(1)
NOK
Case Lead
Sealing resin
Crack
Cracks appear because of the clinching operation stress Silicone gas may enter the case, adhere the contact pins inside the relay and cause defects.
(2)
NOK
Damages on the part (cracks) Deformation of the circuit board
OK
D D
PCB
If a thick or hard lead part is used, the PCB may be deformed because of the clinching.
No clinching
Points to check does not damage the concerned part or the PCB.
Conformity status the base of the leads or the molding. (1)
Alternate if not reachable It is acceptable to use a top hat for flow soldering instead of clinching.
! Check that the clinching operation " There should be no damage on #
" There should be no deformation

of the PCB and no damage of the pattern. (2)
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6
Items
Items to check
Leads forming shape
Concerned parts
(1)
NOK
Cracks on the molding
(2)
NOK
R b
b
(3)
NOK
OK
Cracks
Suppression of the stresses due to the materials heat expansion with the use of a formed lead
Points to check ! Check that the leads forming

shape is adequate so the parts are not damaged during the forming process. (Check for cracks on the lead surface or damages on the parts body caused by mechanical stress). (1,2) absorb the stresses due to the materials heat expansion. (3)
Lead diameter Bending radius
Conformity status
0.8 mm 0.8 - 1.2 mm 1.2 mm or or less more 0.8 mm 1.5 times or 2.0 times or or more more of lead more of lead diameter diameter Bending The bending point should be at least point b 0.8 mm away from the base of the part and away by at least 2 times the lead diameter.
Alternate if not reachable # Check if there is any deterioration

of the electrical characteristics after the durability tests (thermal cycle and power cycle)
! Check that the forming leads can " Measures should be taken to
increase the resistance against the stresses due to the materials heat expansion.
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7
Items
Circuit board design < Common > Heat radiation plate
Items to check
Clearance provided for heat radiation
Concerned parts
(1)
NOK
Power transistor Insulation board Screw Heat sink
(2) OK
PCB No measures to prevent screws from loosening No measures to prevent rotation of the heat sink Locking paint Stopper
(3)
NOK
(4)
OK
Too short
Too short
Power transistor Void Soldering
Cracks
Relay
Cracks
Open circuits due to the repetitive application of mechanical stress on the solder joints (because of the materials expansion variation due to heating and cooling cycles)
Points to check elements (power tr, etc...) and the heat radiation plate are secured properly (1). (Ensure the heat radiation requirements are met)
Conformity status rivets, clips, etc. from loosening should be taken.
! Check if the heat generating " Measures to prevent screws,
" Measures to prevent rotation of

the parts should be taken. electrical characteristics of the concerned parts. variations of the materials should not deteriorate the reliability of the solder joints. electrical characteristics of the concerned parts.
! Check if a heat radiation plate is " Heat should not deteriorate the
provided for the heat generating elements. (2) any effect on the solder joints. (3)
! Check if the heat generation has " Expansion
! Check that the length of the heat " Heat should not deteriorate the
radiation passage is sufficient. (4)
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8
Items
Circuit board design < Common > PCB pattern
Items to check
Pattern width
Concerned parts (1)
(2)
Width of the copper pattern
Thickness of the copper
C ro ss-se ction a l a re a o f con d ucto r

pattern
Substrate
Points to check Check if the design is adequate, and that sufficient current load capacity is ensured.
Conformity status
" The current load capacity of the

copper pattern and the vias holes should exceed the maximum specified current. See below.
! Check
that the width and thickness of the copper pattern is adequate. (1)
! Check if the diameter and the

amount of via holes is adequate. (2)
Increase in temperature
Increase in temperature
Current (A)
Current (A)
mil2 -3 96.77 161.29 258.06 387.10 0.64 6.45 19.35 45.16 10 322.58 451.61 mm2 129.03 193.55 3.23 12.90 32.26 64.51
mil2 -3 96.77 161.29 387.10 258.06 0.64 6.45 19.35 45.16 10 322.58 451.61 mm2 129.03 193.55 3.23 12.90 32.26 64.51
Cross-sectional surface of the copper

Relationship between the cross sectional area of the conductor and the allowable current capacity (External layer)
Cross-sectional surface of the copper foil

Relationship between the cross sectional area of the conductor and the allowable current capacity (Internal layer)
Note) Above values are applicable for copper plated circuit board and flexible printed circuits.
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9
Items
Circuit board design < Common > PCB pattern
Items to check
Distance between patterns
Concerned parts
(1)
Measure the shortest distance.

Cross section A A A A
(2)
Line Land Plated through hole
Points to check conductive lines is sufficient to ensure insulation. (1) lands and circuit patterns is adequate for insulation resistance. (2)
Conformity status resistance is provided between conductors. below should be maintained depending on the voltage.
Alternate if not reachable durability (humid resistance) test to check if there is any functional failure due to poor insulation resistance and electromigration.
! Check that the distance between " Check that the required insulation # Perform
! Check that the distance between " The minimum distance as shown
DC or AC peak voltage 0-15 16-30 31-50 51-100 101-150 151-170 171-250 251-300 301-500
Minimum conductor to conductor distance Minimum distance between parts leads, lands or external conductive pattern (With coating) 0.13 mm 0.13 mm 0.13 mm 0.13 mm 0.4 mm 0.4 mm 0.4 mm 0.4 mm 0.8 mm Minimum distance between parts leads, lands or external conductive pattern (Without coating) 0.13 mm 0.25 mm 0.4 mm 0.5 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 1.5 mm
> 500 (V-500)(V) 0.00305 (mm/V) + 0.8 (mm) (V-500)(V) 0.00305(mm/V) + 1.5(mm) Note) Above values are applicable for copper plated circuit board and flexible printed circuits.
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10
Items
Circuit board design < Common > Test pad
Items to check
Location of test pad
Concerned parts
Not branched off from the pattern
Branched off from pattern
Not soldered NOK
Soldered OK OK
Points to check pads is adequate.
Conformity status off from the pattern or soldered.
Alternate if not reachable the pattern if the lands are located on the pattern and not soldered.
! Check that the layout of the test " The test pads should be branched # Check the corrosion resistance of
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11 Distance from the pattern to the edge of the PCB
Items
Circuit board design < Common > Edge of the PCB
Items to check
Concerned parts (1)
Pattern a Excessive section
Ground Pattern
(2)
Via hole or plated through hole
Land
Edge of the PCB
Points to check damages on the pattern are provided during the singulation operation.
Conformity status surface pattern. (1) b > 0.3 mm for ground internal and surface pattern. (1)
! Check that measures to prevent " a > 1.25 mm for internal and
" There should be no damage to

the pattern when a circuit board is divided. (2)
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12
Items
Circuit board design < Common > Via holes
Items to check
Layout of via hole
Concerned parts
NOK (1) Via holes (2)
Metal casing (GND)
Short circuit
Via holes
Via hole filled with soldering
Points to check components leads and adjacent VIA holes or empty plated through holes is maintained even if soldering rises up the hole. (1)
Conformity status provided between the VIA holes and the adjacent conductors.
Alternate if not reachable inserting an insulation sheet or providing resist, etc to prevent the rising of soldering
! Check that the insulation between " Necessary insulation should be # Insulation should be ensured by
! Check that the insulation between

metal casing components (tuner, etc...) and empty plated through holes or VIA holes is provided. (2) (A rise of soldering through the holes should be taken into account)
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13
Items
Circuit board design < Common > Via holes
Items to check
Via hole
Concerned parts
NOK
Solder resist The holes is open only on one side of the board
Land
OK
Land Resist
Circuit board
Points to check
Conformity status structure that prevents accumulation of corrosive solution in the VIA holes should be provided.
! Check that the solder resist and " A

the coating application in the VIA holes is appropriate.
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14 Parts likely to hinder the rising of soldering in the plated through hole
Items
Items to check
Concerned parts
NOK Part Stick on to PCB
OK Part Vent
PCB
Land pattern on the bottom of PCB
Points to check
Conformity status vent passage under the component should be provided.
! Check that a vent passage is " A

provided under the through hole components that may seal completely the upper side of the plated through hole. (soldering would thus not be able to rise up the hole.)
# The solder joints durability should

be determined by thermal cycling test, using a part with an worst case elevation of soldering.
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15
Items
Circuit board design < Common > Inside case cables
Items to check
Cable layout
Concerned parts
NOK (1)
Tensile force
Lead (2) Circuit board Contact
(3) Soldering iron Shrinks
(4) Soldering Coating is softened by heat
(5) Circuit board
Circuit board
Case Metal case There are interferences between the cable and the case when the case moves
Points to check
Conformity status for appropriate. order to prevent any interference.
Alternate if not reachable when there are interferences.
! Check
that measures insulation are taken. disconnection are taken.
" The layout of the cable should be # Protections should be provided
! Check that measures to prevent " The cables should be fixed in ! Check that sufficient clearance is
provided.
! Check that measures to prevent

jamming when assembling are provided
! Check
that there is no interference with adjacent parts when cables are moved.
" There should be no interference.
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16
Items
Items to check
Securing cable
Concerned parts
(1)
(2)
Clamp cable (Note) Check if there is any damage caused by the clamp (ex: if excessively tightened, the cable resistor may break and the conductor wires get exposed to contacts with case, parts electrodes, circuit board pattern, etc, and make short circuits)
Secured by applying adhesive
Points to check cables and the securing method of the cables are adequate.
Conformity status the cable or the soldered area could not be disconnected.
! Check that the length of the " Measures should be taken so that
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17
Items
Items to check
Diameter of the cable
Concerned parts
Length
Diameter
Points to check length of the cable are adequate.
Conformity status appropriate considering current and impedance.
! Check that the diameter and the " Wire diameter and length shall be
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18 Prevention of core cable core wire dispersion
Items
Circuit board design < Common >
Items to check
Concerned parts
Cables inside the case and connector
NOK
Ultrasonic welding
OK
Prevention of core wire dispersion
Cable Core wire Metal terminal The prevention of core wire dispersion shall be processed before joining to the metal terminals.
If core wires are left dispersed, sufficient welding will not be provided, which results in poor contact due to separation.
Points to check to the terminals dispersed. while being
Conformity status metal terminals, prevention of core wire dispersion shall be processed.
Index for individual consultation the core wires by ultrasonic welding or resistance welding, study the required strength (tensile strength, detaching strength, etc.) and the requirements shall be met.
! Check if the core wires are joined " When welding the core wires and When joining the metal terminals and
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19 Condition of Cu plating on the inner wall of the via hole
Items
Circuit board design < Common >
Items to check
Concerned parts
Via hole other than that for mounting the part
NOK
(1) Cu plating thickness does not meet the standard. Circuit board
(2) Thickness of the via hole inner wall is not even.
Barrel crack occurs due to temperature stress, which results in disconnection of the signal. The main cause for this concern is production quality of the circuit board; however, the objective is to identify this concern at an early stage by reviewing the design requirements.
OK
(1)
Shall be 15 m or more.
(2) Difference in inner wall thickness between the top and bottom of an area adjacent each other plating thickness Plating thickness 15 m The difference in inner wall thickness between the top and bottom of the through hole shall not exceed plating thickness.
Points to check
Conformity status
Index for individual consultation
! Confirm that the plating " Plating thickness: 15 m or Perform the cross-sectional thickness of the via hole is more. analysis using a circuit board appropriate. equivalent to the mass production ! Confirm that the roughness of " Roughness: The difference in part after the thermal cycle test, the inner wall of the via hole is inner wall thickness between and confirm that there is no appropriate. the top and bottom of an area harmful cracking. adjacent each other shall not exceed the plating thickness.
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1 Pattern width and intervals
Items
Circuit board design < Ceramics > Film conductors
Items to check
Applicable parts
Type of circuit board Conductor application process Items Film thickness Resistance Minimum conductor width Minimum conductor spacing (m) (m / ) (mm) (mm)
Circuit board design < Ceramics > Thick film printing Sintered Green tape circuit board 10 ~ 20 2 ~ 100 0.2 0.2 10 ~ 20 2 ~ 100 0.1 0.1 Thin film
Printed circuit board Etching copper foil
~1 100 0.05 0.05
35 ~1 0.1 0.1
Points to check
Conformity status
! Check the minimum pattern width ! Check

spacing the minimum pattern
" 0.2 mm or more " 0.2 mm or more " Pattern should be vertical or
parallel to the outer edge of the circuit board. Pattern with an angle of 45 is allowed.
! Check the pattern design.
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2 Distance between the pattern and the edge of the circuit board
Items
Circuit board design < Ceramics >
Items to check
Applicable parts
Pattern located near the edge of the circuit board
0.3 mm or more Lead pad
0.3 mm or more
Not relevant
Points to check edge of the circuit board and the pattern
Conformity status 0.3 mm (excluding lead pad)
! Check the distance between the " The distance should be at least
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3
Items
Items to check
Distance between the connection points
Applicable parts
Connection points between layers
0.3 mm or more
Points to check connection points conductors. of different
Conformity status 0.3 mm.
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4
Items
Items to check
Location of the connection points
Applicable parts
Connection points between different layers
NOK NOK
OK OK
Points to check connection points different layers between
Conformity status same direction, try not to put the connection points in an aligned position
! Check the relative position of the " When the pattern is going the
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5
Items
Items to check
Location of the connection points
Applicable parts
NOK NOK
OK OK
Points to check where the connection points are located.
Conformity status located on conductor lines perpendicular or parallel to the main line direction..
! Check the direction of the pattern " The connection points should be
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6 Connection between the pads and the wires
Items
Items to check
Applicable parts
Lead pad, W/B pad and part land
OR
NOK NOK
OK OK
OK OK
Points to check the pads and the pattern.
Conformity status between different layers should not be done over a pad.
! Check the connection between " Connection
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7
Items
Items to check
Connection points dimension
Applicable parts
Pattern on the lower layer
(1) 0.3 mm or more
Open area of the Mask
Pattern on the upper layer
(1) 0.3 mm or more (2) 0.1 mm or more (2) 0.1 mm or more
Points to check pattern of the upper layer and the pattern of the lower layer. (1) edge of the connection point and the overlap of pattern. (2)
Conformity status mm square.
! Check the overlap between the " The overlap should be at least 0.3
0.1 mm.
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8
Items
Circuit board design < Ceramics > Cross over pattern
Items to check
Cross over pattern dimensions
Applicable parts
(1) 0.3 mm
(3) 0.1 mm
(2) 0.3 mm (2) 0.3 mm
Points to check overlap of pattern between upper and lower layers. (1) between the edge of the pattern on the bottom layer and the edge of the insulation glass. (2) between the edge of the insulation glass and the connection point. (3)
! Check the minimum value of the " Minimum value should be at least
! Check the minimum distance " Minimum distance should be at

least 0.3 mm.
! Check the minimum distance " Minimum distance should be at

least 0.1 mm.
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9 Connection points between different layers
Items
Items to check
Applicable parts
Multi-layer pattern with adjacent pattern
Dam
0.2 mm or more
0.5 mm or more
Points to check are available when a multi-layer pattern lay very close to another pattern.
Conformity status conductor should be provided.
! Check the design measures that " A dam to prevent exudation of
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10
Items
Items to check
Dimensions of the wire bonding pad
Applicable parts
Die bond pads and W/B pads
(1)
Die bond pad
W/B pad
Wiring
(1) 0.3 or more
(3) 0.3 or more
(2) 0.3 or more
(4) 0.4 or more (5) 0.3 or more Unit: mm
Overlap between W/B pad and wiring
Points to check die bond pads and the W/B pads. (1)
Conformity status 0.3 mm and 3.0 mm.
! Check the distance between the " The distance should be between
! Check
the distance adjacent W/B pads. (2)
between
" The distance should be at least

0.3 mm. mm. mm. mm.
! Check the width of the W/B pads. " The width should be at least 0.3
(3) (4)
! Check the length of the W/B pads. " The length should be at least 0.4 ! Check the overlap between the " The overlap should be at least 0.3
W/B pads and the wiring. (5)
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11 Distance between the part land and the board edge
Items
Circuit board design < Ceramics > Part land
Items to check
Applicable parts
Edge of the circuit board
Edge of the circuit board
0.5 mm or more Land of SMD part
SMD
Points to check part lands and the edge of the circuit board
0.5 mm or more
RENAULT 2008
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12
Items
Items to check
Part land and pattern
Applicable parts
a 0.3 mm
Points to check parts lands and the neighboring pattern.
! Check the distances between the " The distances should be at least
RENAULT 2008
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13
Items
Items to check
Distance between lands
Applicable parts
0.5 mm or more
Points to check parts lands
RENAULT 2008
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14 Distance between the thick film resistances and the insulation glass
Items
Circuit board design < Ceramics > Thick film resistances
Items to check
Applicable parts
Thick film resistance
Pattern of the upper layer Insulation glass

0.5 mm or more
Points to check insulation glass and the thick film resistances
Conformity status 0.5 mm
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15
Items
Circuit board design < Ceramics > Thick film resistance
Items to check
Dimensions of the thick film resistance
Applicable parts
(4) 0.5 mm or more (5) 0.2 mm or more Thick film resistance (2) 0.7 mm or more
(3) 0.2 mm or more (6) 0.3 mm or more
(1) 0.7 mm or more
Points to check
Conformity status of the
! Check
the length resistance. (1)
" The length should be at least 0.7

mm. mm. mm. 0.5 mm.
! Check the width of the resistance. " The width should be at least 0.7
(2)
! Check the overlap of the thick film " The overlap should be at least 0.2
resistance and the pattern. (3) resistance and adjacent pattern. (4) overlap between the thick film resistance and the pattern, to the edge of the pattern (5) overlaps the thick film resistance. (6)
! Check the distance from the " The distance should be at least
0.2 mm.
! Check the width of the pattern that " The width should be at least 0.3
mm.
RENAULT 2008
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16
Items
Circuit board design < Ceramics > Thick film resistances
Items to check
Location of the thick film resistances
Applicable parts
NOK NOK
Thick film resistance Thick film resistance
OK OK
OK OK
Points to check resistances
Conformity status be perpendicular or parallel to the outer edges
! Check the location of the thick film " The thick film resistances should
RENAULT 2008
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17
Items
Circuit board design < Ceramics > Overglass
Items to check
Dimensions of the overglass
Applicable parts
(4) 0.15 mm or more (1) 0.15 mm or more (2) 0.15 mm or more (3) 0.2 mm or more
Points to check
Conformity status
! Check the range of the overglass
" The pattern should be completely

covered except the pads and the lands.
edge of the overglass and the pattern. (1) overglass and the edge of the circuit board. (2) and the edge of the overglass. (3) edge of the resistance and the edge of the overglass. (4) 0.15 mm.
0.15 mm.
! Check the distance between pads " The distance should be at least
0.2 mm. 0.15 mm.
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18
Items
Items to check
Overglass and insulation glass
Applicable parts
Overglass and insulation glass
Insulation glass
Failed: Insulation glass not completely covered by the overglass
Points to check overglass and the insulation glass
Conformity status insulation glass completely
! Check the relative positions of the " The overglass should cover the
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19
Items
Circuit board design < Ceramics > VIA hole
Items to check
Location of the VIA holes
Applicable parts
Edge of the circuit board T = Circuit board thickness A 0.8 t & A 0.5 mm B 0.8 t & A 0.5 mm C 0.4 t & A 0.25 mm
Points to check edge of the circuit board and the hole ( A)
Conformity status and A 0.5 mm
! Check the distance between the " A Thickness of the board 0.8
! Check the hole intervals (B) ! Check the diameter (C)
" B Thickness of the board 0.8

and B 0.5 mm
" CThickness of the board 0.4

and C 0.25 mm
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20
Items
Items to check
Shape of the VIA holes
Applicable parts
(3) The connection to the pattern should be smooth. (2)
(1) 0.4 mm to 1.0 mm (2) (1) + 0.8 mm or more 0.4 mm or more (1)
Points to check hole. (1)
Conformity status should be between 0.4 mm and 1.0 mm should be at least equal to the diameter of the lead + 0.15 mm. should be at least equal to the holes diameter + 0.8 mm. connection smooth. should be
! Check the diameter of the VIA " The diameter of the VIA hole
! Check the diameter of the VIA " The diameter of the VIA hole
hole (When inserting lead). (1)
! Check the diameter of the VIA " The diameter of the VIA hole land
hole land. (2)
! Check the connection between " The

the VIA hole and the pattern. (3)
RENAULT 2008
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21
Items
Items to check
VIA holes and parts lands
Applicable parts
NOK
OK
Points to check holes and parts lands.
Conformity status located on the parts land. Overglass should be coated over the VIA hole.
! Check the relative position of VIA " The VIA holes should not be
RENAULT 2008
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22
Items
Items to check
VIA hole and test pad
Applicable parts
Test pad (0.5 mm
Points to check pads for continuity test
Conformity status as test pads.
! Check the location of the test " The VIA holes should not be used
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23
Items
Items to check
VIA hole and pattern
Applicable parts
0.3 mm or more
Points to check
Conformity status
! Check the distance between " The distance should be at least VIA holes and adjacent 0.3 mm. pattern.
RENAULT 2008
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24 Flaws, cracks, chipping or disconnection
Items
Circuit board design < Ceramics > Circuit board
Items to check
Applicable parts
Chipping
OK : a < 0.25 mm
Points to check or discoloration
Conformity status should be met, and there should be no flaw, crack or discoloration that may affect appearance.
! Check for flaws, cracks, chipping " The requirements in the drawing
" Chipping with a size smaller than

0.25 0.25 mm are acceptable.
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25
Items
Circuit board design < Ceramics > Circuit board
Items to check
Camber
Applicable parts
Circuit board
The specification is for ceramic boards before mounting of components OK : a < 0.1 mm
Points to check board.
Conformity status 0.1 mm per 30 mm.
! Check the camber of the ceramic " The camber should be less than
RENAULT 2008
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26
Items
Items to check
Trimming status
Applicable parts
NOK NOK
Excessive cracking
Cracks are only at the end of cut area of the trim
Points to check
Conformity status
! Check for cracks
" Cracks should stop at the edge of

the trimming.
! Check that the resistor material is " It is recommended to cut the

removed completely. ceramic board by approximately 5m. (Cut both the resistor layer and the alumina circuit board) of the resistance.
! Check the starting position of the " The trimming should start outside
trimming
RENAULT 2008
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27
Items
Items to check
Alignment
Applicable parts
Overlap between pattern and thick film resistance
Thick film resistance x0 y 0.2 mm Pattern
Points to check thick film pattern. resistance and the
Conformity status least 0.2 mm. Entire width of the resistance should be overlapped.
Alternate if not reachable in inspection after sintering. Margin should be provided for design. (Refer to Section II-1-2-15.)
! Check the contact area of the " There should be an overlap of at # x 0 is the reference value used
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28
Items
Items to check
Trimming margin
Applicable parts
Points to check
Conformity status
! Check the trimming margin
" Remaining width of resistor after

trimming should be at least 1/3 of the total width.
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29
Items
Items to check
Chipping and pinhole
Applicable parts
Chipping
Pinhole
NOK NOK
Points to check
Conformity status
Alternate if not reachable are
! Check for chippings
" The chippings exceeding 1/2 of

the resistance unacceptable. around the chipping. width
" Check also if there are any cracks ! Check for pinholes " The pinholes exceeding 1/2 of the
resistance unacceptable. unacceptable. width are
" Pinholes longer than 0.5 mm are " Check also if there are any cracks
around the pinhole.
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30
Items
Items to check
Extrusion of resistor
Applicable parts
NOK : W > 1/2 Wo NOK : a 0.4 mm
Pattern
Points to check
Conformity status
Alternate if not reachable are
! Check for extrusions of resistor
" Extrusions exceeding 1/2 of the

resistance unacceptable. the adjacent unacceptable. width
" Extrusions coming 0.4mm close to

pattern are
RENAULT 2008
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31
Items
Items to check
Impurities, blistering and foaming
Applicable parts
Impurities
Blistering and foaming
NOK : W < 1/2 Wo NOK : L > 0.5 mm
Points to check
Conformity status
! Check for impurities, blistering or

foaming
" Impurities, blistering and foaming

that exceed 1/2 of the resistance width are unacceptable.
" Those with a length of 0.5 mm or

more are unacceptable. * Composition and origin of impurities must be studied.
RENAULT 2008
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32
Items
Circuit board design < Ceramics > Insulation glass
Items to check
Insulation resistance
Applicable parts
Pattern
Overglass
When the insulation resistance lowers below 109, it is relatively relevant of the electric circuit and shows a substantial reduction in its characteristics.
Insulation glass
Points to check
Conformity status
! Check the insulation resistance
" The resistance should be at least

109 Ohms at normal temperature and under DC 50V.
RENAULT 2008
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33
Items
Items to check
Protrusions or recesses
Applicable parts
Lower layer pattern in cross over wiring
Protrusions or recesses of the conductive line going out from the lower layer through the upper layer are unacceptable.
Protrusions or recesses of the conductive line not coming out from the lower through the upper layer are acceptable.
Points to check
Conformity status
! Check for protrusions or recesses
" Protrusions or recesses going out

from the lower layer through the upper layer are unacceptable.
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34
Items
Items to check
Flaws and test probe traces (1)
Applicable parts
Upper layer pattern in cross over pattern
Insulation glass Upper layer pattern
Lower layer pattern
Flaws in the pattern through which the insulation glass is exposed are unacceptable.
Points to check
Conformity status
! Check for flaws and traces of the " Flaws in the conductive line through which the insulation test probes. glass is exposed are unacceptable.
RENAULT 2008
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35
Items
Circuit board design < Ceramics > All metallic films
Items to check
Flaws and test probes traces (2)
Applicable parts
NOK : x 3/4 d OK
Circuit board
NOK NOK : x < 3/4 d
Points to check test probes.
Conformity status the ceramic board or the insulation layer appearant by more than 25% of the metallic film width are unacceptable.
! Check for flaws and traces of the " Flaws on the metal film that make
RENAULT 2008
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36
Items
Circuit board design < Ceramics > Multilayer metallic films
Items to check
Flaws and probe inspection (3)
Applicable parts
Acceptable : x 1/2d and x 25 m Metal from the lower layer (multilayer metal film)
Unacceptable : x < 3/4d or x < 25 m
Points to check test probes
Conformity status the lower layer metal exposed, as well as those uncovering more than 25% of the metallic film are unacceptable.
RENAULT 2008
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37
Items
Items to check
Flaws and probe inspection (4)
Applicable parts
Overlap between pad and pattern
Exposed ceramic
Pattern
Pad Land NOK NOK
Points to check test probes
Conformity status the ceramic board exposed, and uncovering more than 25% of the patterns are unacceptable.
RENAULT 2008
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38
Items
Circuit board design < Ceramics > Pattern
Items to check
Extrusion
Applicable parts
L 1.0 mm W W/2 and w 0.5 mm
Points to check
Conformity status
! Check for extrusion of pattern.
" The width of the extrusion should

be less than1/2 of the distance between patterns, or less than 0.5 mm.
" The length of the extrusion should

be less than 1.0 mm
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39
Items
Items to check
Void
Applicable parts
OK : x 3/4 d
Dielectric, metal or ceramic board of the lower layer Voids refer to a flow of metal film with exposed underneath dielectric, metal or circuit. NOK : x < 3/4 d
Points to check
Conformity status
! Check for voids
" The
maximum width of the allowed voids is 25% of the pattern.
RENAULT 2008
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40
Items
Items to check
Corrosion, foaming or blistering
Applicable parts
Corrosion
Foaming and blistering
Points to check
Conformity status
! Check for corrosion or defective

adhesion
" No corrosion, no foaming and no

blistering are acceptable.
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1
Items
Circuit board design < Flexible > Lands and pattern
Items to check
Shape of the pattern
Applicable parts
NOK (1) (2)
OK
R
2R
The corner of patterns even without a 90 degrees angle should also be round
NOK
OK The corner of the land should be round
VIA hole
Land
Tear drop shape
Points to check the pattern. (1) holes are designed to avoid any concentration of stress. (2)
Conformity Status corner. tear drop shape.
Alternate if not reachable performed on the flexible printed circuit for confirmation.
! Check if there are any corners in " Radius should be provided to the # The thermal cycle test should be ! Check that the lands and the VIA " All the wires should end up in a
RENAULT 2008
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2
Items
Circuit board design < Flexible > Lands
Items to check
Shape of the solder resist
Applicable parts
NOK 1SOP, QFP Land pattern
OK
Lands
Resist Recommendation: Apply solder resist between the lands : Land covered with resist : PCB with no resist
Round shape
: Resist
: Land
NOK Other land patterns
OK
Land
Resist Round shape : Resist : Land : Land covered with resist : PCB with no resist
Points to check designed to avoid peeling.
Conformity Status lands edges.
! Check that the parts lands are " Solder resist should cover all the # The thermal cycle test should be " When some borders of the lands
could not be covered by solder resist, at least the short edges should be covered.
RENAULT 2008
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3
Items
Circuit board design < Flexible >
Items to check
Pattern layout
Applicable parts
Bending area of the flexible printed circuit

(1) Pattern on both sides.
NOK
(1) Pattern not parallel to the bending direction
(2) VIA holes and part land in the bending area.
OK (3) Pattern thickness = 18 50m
(5) R 1mm (4) Pattern width 0.25 mm
Points to check
Conformity Status only one side and be parallel to the FPC bending direction. (1) There should not be any part land nor VIA hole in the bending area. (2) The thickness of the pattern should be from 18 to 50 m. (3) The width of the pattern should be at least 0.25 mm. (4) The bending radius should be at least 1 mm. (5)
! Check
that the pattern is designed to avoid stress concentration.
" The pattern should be printed on # The thermal cycle test should be
"
" " "
RENAULT 2008
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1
Items
Circuit board design < Ag-TH circuit board > PCB pattern
Items to check
Spacing between traces
Applicable parts
a = Distance between the Cu PTH edge and the Ag paste edge b = Distance between the Cu PTH land edge and the Ag paste edge (1) The distance between the interior surface of PTH and silver paste edge shall be 0.20 mm MIN.
OK Unacceptable
Silver paste
a > 0.20 mm
a < 0.20 mm
Copper foil land
Ag paste does not bias over the Cu PTH land.

OK
b > 0.30 mm
ACCEPTABLE
b < 0.20 mm
Unacceptable
(2) Silver paste shall not protrude from the copper foil land.
Points to check between the interior surface of the via hole and the silver paste edge is provided. ! Confirm that sufficient spacing between the silver paste and the adjacent copper foil traces is provided.
Conformity Status be provided between the interior surface of the via hole and silver paste edge. " Silver paste shall not protrude from the copper foil land. Note: 0.30 mm or greater spacing shall be provided between the copper foil traces extended from the adjacent through hole lands.
! Confirm that sufficient spacing " 0.20 mm or greater spacing shall
# Let the distance between the

adjacent edges of the silver paste and copper foil pattern be "b" b < 0.20 mm ........ Unacceptable 0.20 mm b < 0.30 mm Conduct the humidity durability test (LT/02 in 28401NDS01 and 36-00-802) to confirm that improper distance could not lead to failure in function due to insulation resistance or migration. 0.30 mm b ........OK
RENAULT 2008
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2
Items
Circuit board design < Ag-TH circuit board > Via hole
Items to check
Overcoat shape
Applicable parts
Unacceptable
The hole is clogged.
OK
Through hole
Overcoat
Through hole land
Silver paste
solder resist
Check point ! Confirm that the overcoat is formed properly.
Reference value " The overcoat shall not clog up the via hole.
Index for individual consultation
RENAULT 2008
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3
Items
Circuit board design < Ag-TH circuit board > Via hole, SMD
Items to check
Via hole location
Applicable parts
Unacceptable
Separation of SMT terminal
Overcoat Via hole
OK
SMD
Ag-TH PCB
Check point Reference value Index for individual consultation ! Check if there is no via hole " Via holes shall be located # It shall be guaranteed that the overcoat over the Via holes under the surface-mounted away from the has been designed so that devices. surface-mounted devices by a overcoat does not come in distance equal to or greater contact with the than the overcoat diameter. surface-mounted device.
RENAULT 2008
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I15
1
Items
Circuit board design <Paste jumper> Overcoat
Items to check
Overcoat width
Applicable parts NOK
OK B B
Conductive paste
C a A
Conductive paste
a A
Overcoat
Overcoat
The overcoat width is less than +1.20 mm, relative to the paste width. A < a + 1.20 mm or B < b + 1.20 mm
The overcoat width is +1.20 mm or more, relative to the paste width. A a + 1.20 mm and B b + 1.20 mm
Check point Reference value Criteria to be consulted separately ! Check that the overcoat fully " The design value for the overcoat # The width of overcoat overlap in the printing inspection covers the conductive paste. width shall be +1.20 mm or more, pattern for each circuit board: relative to the paste width. Carry out the inspection with A a + 1.20 mm C=(A-a)/2 and (B-b)/2 0.20 B b + 1.20 mm mm. Or guarantee with C 0.10 mm on the entire surface of the circuit board.
RENAULT 2008
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2
Items
Circuit board design <Paste jumper> Insulation layer
Items to check
Undercoat width
Applicable parts
NOK
When there is displacement in the printing, there is a possibility that the insulation layer will not cover 3 layers.
A B C Relative to the paste width, undercoat 1 layer or 2 layers is less than +1.00 mm. B < A + 1.00 mm or C < A + 1.00 mm
OK
Even when there is displacement in the printing, the insulation layer, including the resist layer, shall cover 3 layers. Conductive paste A B C Insulation layer (3) (e.g., undercoat (2)) Insulation layer (2) (e.g., undercoat (1)) Insulation layer (1) (e.g., solder resist) The width of each undercoat layer shall be +1.00 mm or more, relative to the paste width. B A + 1.00 mm and C A + 1.00 mm
Check point
the undercoat and conductive paste is sufficient.
Reference value
either undercoat shall be +1.00 mm or more, relative to the paste width.
! Check that the overlap width of " The design value for the width of
B A + 1.00 mm and C A + 1.00 mm
Criteria to be consulted separately # With B A+1.00 mm or C A+1.00 mm, shall ensure the insulation resistance value between the conductive paste and the copper foil of the circuit board, for the resist layer and undercoat 1 layer alone, is 1 x 10E +8 .
RENAULT 2008
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3
Items
Items to check
Composition of insulation layer
Applicable parts
NOK
Conductive paste Copper foil Insulation layer (2) (e.g., undercoat (1)) Insulation layer (1) (e.g., solder resist)
Circuit board There are less then 3 insulation layers. OK Structure of insulation layer of point which crosses the copper foil pattern
Copper foil pattern
Insulation layer (2)
Conductive paste
Conductive paste Insulation layer (3) (e.g., undercoat (2)) Insulation layer (2) (e.g., undercoat (1)) Copper foil Insulation layer (1) (e.g., solder resist)
Circuit board
The insulation layer is composed of a 3 layer structure.
Check point
not easily cut or easily thinned by the surface height difference.
Reference value
resist and undercoat layers, shall be comprised of 3 layers or more, and shall be confirmed through a cross-section to be a structure that is not easily severed.
! Check that the conductive layer is " The insulation layer, consisting of
Criteria to be consulted separately # In a worst case scenario for the design tolerances, carry out a test assuming the insulation layer is severed (guaranteed by the circuit board supplier). The resistance value shall not increase.
RENAULT 2008
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4 Insulation layer structure of connected land part
Items
Items to check
Applicable parts
NOK
Builds up regardless of insulation layer displacement
The copper foil shall not be covered by any of the insulation layer.
A thin point has been generated in the conductive paste, according to the insulation thickness and the land edge.
OK
Insulation layer structure of connected land part Copper foil land Conductive paste
Undercoat II
Undercoat I Circuit board Solder resist
It is an insulation structure with good difference following capability and the conductive paste has not thinned too much locally.
Check point Reference value ! Check that the conductive layer is " Shall confirm through
a cross-section observation that the paste is an insulation structure with good difference following capability and that there are no points where the electro conductive paste has thinned locally on the insulation layer and copper land edge.
Criteria to be consulted separately # The thickness of the conductive paste shall satisfy the circuit board specifications in the specified resistance stress test.
RENAULT 2008
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5 Conductor width and clearance between conductors (LINE/SPACE)
Items
Circuit board design <Paste jumper>
Items to check
Applicable parts
Conductive paste
OK
1000 m Conductive paste jumper width (LINE)
1000 m
Clearance between conductive paste jumpers (SPACE)
Conductive paste jumper
Conductive paste jumper LINE/SPACE shall be 1000/1000 m or more.
Check point
Reference value
m or more.
! Check that the conductive layer is " The jumper width shall be 1000
Criteria to be consulted separately # Carry out resistance evaluation and the rate of conversion rate of the connected resistance of the pattern shall be within 100%. # Further, non-conductivity of 10E8 ohms or more shall be ensured between patterns.
! Check that the width of the " The jumper width shall be 1000
jumper width is adequate. m or more.
RENAULT 2008
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(102)
RENAULT
Check No.
36 - 00 - 012 / - - C
I15
6
Items
Circuit board design <Paste jumper> Conductive paste
Items to check
Paste thickness
Applicable parts
OK Conductive paste Copper foil pattern Undercoat Resist Copper foil land
Circuit board Cross-section Method of measuring resistance value Flat section I Edge section
Conductive paste
Cu
Cu V
Cu
Check that the structure is capable of passing a specified resistance test.
Check point
conductive paste is sufficient.
Reference value
paste shall be 15 m or more over the entire jumper. (The flat and edge sections on the copper foil pattern are essential measurement points.) and the paste shall have no effect on system functions. shall be the same grade as FR4 or CEM3, or higher.
! Check that the thickness of the " The thickness of the conductive
Criteria to be consulted separately # The conversion rate for the thickness of the conductive paste and the base material being used etc., shall be within 100% in the specified resistance stress test.
! Check that the connection of the " The connection resistance of Cu

Cu and paste is satisfactory.
! Check that the base material to " The base material to be used
be used is adequate.
RENAULT 2008
Page I - 72
(103)
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Check No.
36 - 00 - 012 / - - C
I15
7
Items
Circuit board design <Paste jumper> Conductive paste
Items to check
Applied circuit
Applicable parts
NOK Used for GND and power supply line.
Conductive paste
GND or power supply line OK Used for signal line.
Copper foil pattern
Conductive paste
Check point
conductive adequate. paste jumper is
Reference value
signal line. (Shall not be used on the GND and power supply line.) " The wiring resistance of paste jumper shall have no effect on system functions. " Shall be used on circuits where a resistance conversion rate of 100% is permissible.
Criteria to be consulted separately
! Check that the use of the " The jumper is only used for the
RENAULT 2008
Page I - 73
(104)
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Check No. Items
36 - 00 - 012 / - - C
I16
1 Items to check Circuit board through hole, via hole
Metallic core circuit board
Applicable parts
Resin filling section between the through hole and metallic core
NOK
OK
Glass cloth
Glass cloth
There are voids and cracks in the resin filling section between the through hole and metallic core.
The space between the through hole and metal core is completely covered by the resin.
Criteria to be consulted separately ! Check that there are no problems " After increasing the mounting # Carry out the migration test. There Check point
with the state and material selection of the resin filling section for the space between the metallic core circuit board through hole and the metallic core. stress, there shall be no decrease in non-conductivity due to the advancement of voids and cracks, etc., in the resin filling section (1). " There shall be no decrease in the connection resistance of the through hole and via hole due to the advancement of voids and cracks, etc., in the resin filling section (2).
Reference value
shall be no concerns with insulation resistance leakage, etc. Carry out the heat cycle test. There shall be no increase in the connection resistance of the through hole and via hole
RENAULT 2008
Page I - 74
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Check No. Items
36 - 00 - 012 / - - C
I16
2 Items to check Mounting parts
Metallic core circuit board
Applicable parts
Surface mounting parts (chip resistor)
Number of stress cycles until abnormalities appear in the solder connection resistance: Nf
Durability within general FR4 resin circuit board material (Image) Acceptable: Example using stress releasing material such as low , high Tg material
X
Not acceptable: Example using 2-layer aluminum
1608
2012
3216
5025
For the size of the resistance chip (example)
Criteria to be consulted separately ! Check that no inappropriately " Shall not use surface mounted # Carry out the heat cycle test.
sized parts are used in the metallic core circuit board surface mounted chip resistors parts with inferior durability when compared to the deterioration of solder joints on general FR4 resin circuit boards. There shall be no problems in the reliability (connection resistance, solder connection strength) of parts due to breaks in the solder.
Check point
Reference value
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I17
1 Circuit configuration based on circuit board
Items
Metal circuit board
Items to check
Applicable parts
Base metal of metal circuit board
NOK
OK
NOK Base metal of metal circuit board shall have floating which does not conduct electrically.
Criteria to be consulted separately # Carry out the migration test. ! Check that the circuit composition " The base metal of the metal
of the base metal of the metal circuit board is capable of avoiding migration of the insulation layer. circuit board shall not be connected to circuits (GND, etc.). There shall be no concerns with insulation resistance leakage, etc.
Check point
Reference value
RENAULT 2008
Page I - 76
(107)
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36 - 00 - 012 / - - C
I17
2 Insulation performance of metal circuit board
Items
Metal circuit board
Items to check
Applicable parts
Insulation layer
NOK
Based on an insulation resistance value of less than 1.0E8 in an indoor environment or a bare circuit board (un-mounted circuit board), the insulation resistance value of 1.0E1 or more of a mounted circuit board decreases.
Insulation resistance value []
Insulation resistance value []
1.0E1 or more 1.0E8
1.0E1 or less 1.0E8
Before mounting
After mounting Insulation resistance value []
Before mounting
After mounting 1.0E1 or less
OK
Based on an insulation resistance value of 1.0E8 or more in an indoor environment and a bare circuit board (un-mounted circuit board), the insulation resistance value of 1.0E1 or more of a mounted board does not decrease.
1.0E8
Before mounting
Example of measurement method Bare circuit board (un-mounted circuit board)
After mounting
Insulation resistance meter
On the bare circuit board, measure the insulation resistance between the land of the largest sized part (not covered with a resist layer) and the base metal. After mounting parts, measure the insulation resistance between the land of the above-mentioned part and the base metal.
Mounted circuit board

Insulation resistance meter
Check point ! The
insulation before and after mounting parts shall not decrease nor deteriorate.
Criteria to be consulted separately # There shall be no deterioration in performance " There shall be no decrease in the
insulation resistance value of 1.0E8 or more and the resistance of 1.0E1 or more after mounting parts. (1) " There shall be no deterioration in insulation performance due to migration, etc. (2). insulation performance due to migration, etc. (2).
Reference value
RENAULT 2008
Page I - 77
(108)
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Check No.
36 - 00 - 012 / - - C
I21
1
Items
Casing design < Common > All parts
Items to check
Part clearance - short-circuiting
Applicable parts
(1) Circuit
(2)
board
Pattern
Clearance Screw
Pattern PCB
Casing
Casing
(3) Washer
Short
Contact between the washer and solder
Washer Pattern
(4) Clearance PCB
Short
Pattern
(5) PCB Clearance
* The maximum guaranteed bending load for the

PCB should be the applied to measure the clearance.
Casing
Points to check
Conformity Status electrical potential, the clearance should be at least 2.0 mm. " Between parts at a same electrical potential the clearance should be at least 1.0 mm.
Alternate if not reachable not maintained, there should be no functional failure during the vibration resistance test.
! Check
that the specified clearances are provided.
" Between parts at a different # Even if the specified clearance is
RENAULT 2008
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2
Items
Casing design < Common > All parts
Items to check
Interferences between parts
Applicable parts
(1) Casing
(2) Clearance PCB
Parts contact
Clearance
PCB (3) Clearance
PCB
Clearance
PCB
Points to check
Conformity Status specified
! Check
that the clearance is provided.
" There should be no interferences. # If there is any interference, there " The guaranteed maximum should be no noise during the
deflection load for the PCB should be the applied to confirm the clearance. vibration resistance test. Attenuators may also be used between parts.
RENAULT 2008
Page I - 79
(110)
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I21
3
Items
Casing design < Common > Screws
Items to check
Fastening of parts strength
Applicable parts
(1)
(2)
NOK
OK
LOCTITE
Tapping screw
Separated with spring washer Heat sink Pattern PCB Stud
Check that the bearing surface for the screw tightening is provided.
Cracks
casing
Points to check
Reference value by the use of Loctite, etc... or spring washer equipped screws. of the circuit board and the internal surface of the hole shall be 1 mm or more and the washer (or the screws head if washer is not provided) shall not protrude from circuit board.
Criteria to be consulted separately screws (check the torque) or deterioration of the function of the equipment or the performance of EMC before and after the compound thermal cycle test (thermal cycle and vibration tests). (Contact resistance may deteriorate without rotation of the screw. Pay particular attention to situations when electric contact with the fastening section is possible, which could affect the function of the equipment or the performance of EMC.)
! Check
that measures to prevent loosening of the screws have been taken. (1) between the end of the circuit board and the internal surface of the holes are sufficient. (2)
" Loosening should be prevented # There shall be no loosening of the
! Check that the clearances " The clearance between the end
RENAULT 2008
Page I - 80
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I21
4 Fastening of parts electrical connection
Items
Casing design < Common > Screws
Items to check
Applicable parts
(1)
NOK Casing
Vehicle body GND (2)
Screw Screw with Loctite Heat sink Pattern PCB Stud
OK
Loctite should be used after screwing
PCB
*Loctite generates function errors at electrical contact.
NOK
OK
(3) NOK
Rivet Pattern
OK (When short circuiting is not necessary)
PCB Casing
Contraction (small)
Contraction (large)
Rivet used only to fix mechanically
(Poor electrical contact due to the differences of thermal expansion coefficient)
Points to check
Conformity Status loosening, no Loctite should interfere the electrical contact. Loctite should thus be applied after fastening. (1)
Alternate if not reachable the screws (check the torque) or deterioration of the function or the EMC performances before and after the combined thermal cycle test (thermal cycle and vibration tests). (Contact resistance may deteriorate without rotation of the screw. Pay particular attention to situations when electric contact with the fastening section is possible, which could affect the function of equipment or the EMC performances)
! Check
that the fastening method is appropriate.
" When Loctite is used to prevent # There should be no loosening of
" Spring washer, bolt or screw and

washer assembly (separate spring washer) could be used. (2)
" Rivets should not be used for

electrical connection. (3)
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Check No.
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I21
5 Prevention of drosses when screws are tightened.
Items
Casing design < Common >
Items to check
Applicable parts
Aluminum casings and heat sinks
NOK Case cover Aluminum material (case base or heat sink) When screwing into a soft metal, drosses are produced and fastened into the casing, and lead to short circuits
OK
Casing cover
Aluminum material
Nut press fitted into the aluminum plate

Stud (brass, etc.)
Casing base
Points to check
Conformity Status should no be tap holes.
Alternate if not reachable should not be metallic drosses. polluted with
! Check
that the holes into aluminium base materials are all passing through holes.
" Holes in aluminum base materials # The internal area of the case
RENAULT 2008
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6
Items
Casing design < Common > Connectors
Items to check
Direction of the connectors
Applicable parts
Direction of connector
TOP
CAUTION An inclination of 1 or more with the horizontal direction is unacceptable. (1)
In the case of a horizontal connector NOK (2) (3) Horizon OK
OK Horizontal and downward directions are acceptable.
(4)
C/U
GROUND
Connector Harness
Points to check of the connectors is taking into account the ECUs mounting conditions aboard the vehicle.
Conformity Status upward. " Check that the harness connected to the connector is directed to prevent any intrusion of water
Alternate if not reachable water into the ECU (structure, etc.) should be taken.
! Check that the mounting design " Connector should not be directed # Measures to prevent intrusion of
RENAULT 2008
Page I - 83
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7
Items
Casing design < Common >
Items to check
Position of the case and the connectors
Applicable parts
(1) NOK
Connectors housing and case openings

(2)
Unit case
Protrusion
NOK
Connection and disconnection of the connector on the vehicle body harness side
Connector on vehicle body harness side

Cracks in the solder joints caused by stress OK OK
Connector on PCB side out of the case

When the connector is mounted vertically to the circuit board, stress is applied to the circuit board during the connection and disconnection operations. Points to check Conformity Status circuit board connector should not be inside the case.. Alternate if not reachable
! Check if the relative position of " The

the case opening and the end of the connector is adequate. ! Check that the attaching and detaching operations are not too stressful for the connector (PCB side) and its solder joints. (1)
" The mechanical support of the

connector (PCB side) should not be ensured by the only solder joints. " Measures should be taken to prevent the board bending.
! Check that the circuit board is not

damaged when attaching and detaching the connector (vertical type). (2)
RENAULT 2008
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8
Items
Casing design < Common > Cases
Items to check
Sealing of the case
Applicable parts
OK
Vent hole Completely sealed Air
Based on an insulation resistance value of less than 1.0E8 in an indoor i t b
OK Completely sealed Dry air or N2 etc.
OK Completely sealed Air Potting material
* Dry air Atmospheric air under which the dew point is lower than the guaranteed minimum restoration temperature
Points to check inside the casing has been taken into consideration for the design of the case.
Conformity Status taken.
Alternate if not reachable failure after the durability test (condensation test).
! Check that the generation of dew " Measures for dewing should be # There should be no functional
RENAULT 2008
Page I - 85
(116)
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9
Items
Casing design < Common > Cases
Items to check
Case opening
Applicable parts
NOK
Circuit board
Points to check the circuit board is discharged into the opening of the case.
Conformity Status discharged on the circuit board or on the parts.
Alternate if not reachable failure after the static discharge test.
! Check that static electricity from " Check that static electricity is not # There should be no functional
RENAULT 2008
Page I - 86
(117)
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Check No.
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10
Items
Casing design < Common > PCB
Items to check
PCB support arrangement
Applicable parts
[PCB support arrangements]

Connector
If some components package

PCB
are outside of the red area, there

Support points (Screws) Components layout area
is
possibility
of
component-dropping because of the vibration stresses.
Supported by screws NOK

Connector PCB High vibration stress line Support points (Screws)
OK
Connector
PCB
Connector
PCB
Support points (Screws) Supress
OR
Support points (Screws)

Addition of support points
High vibration stresses on components
Supported by the case tabs

OK
case PCB supports(tab)
Slide in
Slide in
Connector PCB
Points to check
Conformity Status
! Check if the PCB is surely " The PCB should be supported on # Any support method that can surely reduce the vibration supported in the case. three edges at least. stress is acceptable under an " The components should be wired agreed council. within the area that is enclosed by
the support points.
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< II > Product mounting QUALITY check items
RENAULT 2008
Page II - 1
(119)
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Check No.
36 - 00 - 012 / - - C
II 1 2
1
Items
Electrical connection < Soldering - common >
Items to check
Shape of the solder fillet
Applicable parts
(1) Amount of solder
Through hole components (in plated through holes)
NOK
OK
W S : Diameter of wetted surface D : Hole diameter D
W S < D + 0.6 mm
Amount of soldering inside the hole: Less than 100%
WS
W s D + 0.6 mm
Amount of soldering filled inside the hole: 100%
(2) Wetting
NOK
OK
A A
Max
A < 90
Others (undesired shape) (4) Lead not (3) Icicle discernible
(5) Excessive rise
(6) Blowhole
(7) Cold joint
(8) Disturbed joint
NOK
NOK
NOK
NOK
NOK
NOK
Icicle
Solder surface
Solder contacting components body
Blowhole
Poor wetting due to insufficient heating. The surface of the solder is not shiny.
Abnormalities in the fillet due to the vibration at solder solidification. Soldering surface is not smooth and t luster on the surface is insufficient.
Points to check
Conformity status
! Check
that the solder joints shape is adequate.
" Refer to the chart

below.
Alternate if not reachable # There should be no functional failure after the durability test (thermal cycle test) when using the soldered parts under the worst conditions. # In the case of a non-HASL finished PCB, there should be no deterioration of insulation and corrosion resistance after the humidity resistance test. Others (3) - (7) - For parts with bent leads, soldering should not contact the components body. - There should be no disturbed joints nor cold joints - There should be no blowholes. - There should be no disturbed joints nor cold joints 100% of the land has to be covered - Lead should be discernable. with soldering, the total - There should be no icicle circumference of the lead has to be - There should be no disturbed joints nor cold joints. covered and A < 90. Wetting (2) - At least 75% of the land and the hole diameter + at least 0.6 mm should be covered. - The total circumference of the lead has to be covered and A < 90.
Amount of solder (1) Part surface
Plated through hole Soldering surface
The holes should be filled at 100% with solder
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2
Items
Items to check
Applicable parts
(1) Amount of solder NOK
Through hole components (in non-plated through hole)
OK
WS < D + 0.8 mm
D Ws
WS : Diameter of expansion of soldering surface D : Hole diameter Ws D + 0.8 mm or more
(2) Wetting NOK
Soldering Copper foil of land exposed
OK
A A
Soldering not covering the land
Soldering not covering the lead
M ax
A < 90
Others (undesired shape) (4) Lead not (3) Icicle discernable NOK NOK
(5) Blowhole NOK
(6) Cold joint NOK

Poor wetting due to insufficient heating. The surface of the solder is not shiny.
(7) Disturbed joint NOK

Soldering surface is not smooth and the luster on the surface is insufficient
Blowholes
Points to check
Conformity status below.
Alternate if not reachable (thermal cycle test) when using the soldered parts under the worst conditions. # In the case of a non-HASL finished PCB, there should be no deterioration of insulation and corrosion resistance after the humidity resistance test. Others (3) - (6) - There should be no blowholes. - Lead should be discernable. - There should be no icicle. - There should be no disturbed joints nor cold joints
! Check
that solder joints shape is adequate.
the " Refer to the chart # There should be no functional failure after the durability test
Amount of solder (1) Soldered surface
Wetting (2) - 100% of the land and the hole diameter + at least 0.6 mm should be covered with soldering. - The total circumference of the lead has to be covered and A < 90.
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II 1 2
3
Items
Items to check
Applicable parts
Surface mounted parts (Chip form)
OK
h w
ts
b : Length of connection on edge surface side of electrode h : Fillet height w : Land width ts : Soldering thickness H : Thickness of part electrode
Fillet height is 25% or less of thickness of part electrode. (2) Wetting NOK
h (ts + 25% of H) or 0.5 mm b 75% or more of electrode width
<Arrows> Soldering does not OK

completely cover parts causing insufficient mechanical and electric connection.
A A
Max A < 90
(3) Part deviation NOK
(Top view)
Lateral deviation Deviation in the direction of edge surface Land
Side: Deviation of 25% or more of electrode width End overhang: Land and edge side of the electrodes do not overlap
Electrode width
Others (4) Solder fillet extends onto the parts body NOK (5) Leaching of electrode NOK Corrosion of electrode
Residual part of electrode
Solder extends onto parts body

Corrosion of more than 25% of the thickness or width of a components electrode. Points to check Conformity status below. Alternate if not reachable (thermal cycle test) when using the soldered parts under the worst conditions. # In the case of a non-HASL finished PCB, there should be no deterioration of insulation and corrosion resistance after the humidity resistance test. Part deviation (3) Lateral deviation: At least 75% of the width of the components electrode should stay over the land. End overhang: The edge surfaces of the electrodes should stay over the land. Others (4) (5) - Solder should no extend onto
the parts body. - There should be no corrosion extending onto more than 25% of the thickness of a part electrode or the electrode width. (Consider the combination of materials for electrodes and soldering making corrosion unlikely to happen)
! Check
Amount of solder (1) Fillet height (h): h (ts + 25% of H) or 0.5 mm Length of connection on the side of electrode (b): b 75% of the electrodes width
Wetting (2) Contact angle (A): A<90 Coverage of the bottom side of the electrodes: The bottom side must be completely covered with solder
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4
Items
Items to check
Applicable parts
Surface mounting part (gull wing lead)
OK
h : Height of part side fillet b : Length of connection on edge surface side of electrode t : Lead thickness ts : Soldering thickness w : Lead width
t ts w
h < t + ts (2) Wetting NOK
b < 75% of b
h t + ts NOK
b 75% of w OK
A
The side of the lead is not covered.
The edge of the lead is not covered.
A A
A < 90
(3) Deviation NOK Deviation equal to the smallest between 25% of lead width and 0.5mm
Lateral deviation
NOK
Bottom surface of the lead Deviation in the direction of edge surface Lead bottom surface protrudes from the land
(4) Others NOK Solder contacts parts body
Points to check
Alternate if not reachable (thermal cycle test) when using the soldered parts under the worst conditions. # In the case of a non-HASL finished PCB, there should be no deterioration of insulation and corrosion resistance after the humidity resistance test. Deviation (3) Side: Less than the smallest between 25% of lead and 0.5 mm. Direction of edge surface: Lead bottom surface should stay on land. Others (4) Soldering should not contact the parts body.
! Check
Amount of solder (1) h: Height of the back fillet: (Solder thickness + lead thickness) or more b: Length of connection on edge side of lead: At least 75% of the lead width
Wetting (2) Land should be completely covered (100%) and the contact angle be < 90.
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5
Items
Items to check
Shape of the solder filet
Applicable parts
Surface mounting part (J-shaped lead)
OK t
t + ts
ts h
b : Length of connection on edge side of lead l : Length of connection on lateral side of lead h : Height of fillet w : Lead width t : Lead thickness ts : Soldering thickness
b w I
h < t + ts (2) Wetting NOK
I < 200% of w
b < 75% of b
h t + ts
1 200% of w
b 75% of w
NOK
Lead is not covered.
A
A A
OK
A < 90
Side of lead is not covered.
(3) Deviation NOK Deviation which is equal to 25% or more of lead width Lateral deviation (4) Others NOK Excessive solder Lead protrudes from land
Deviation in the direction of edge surface
Solder contacts the parts body
Points to check
! Check
that the solder joints shape is adequate.
Conformity status " Refer to the chart below.
# There should be no functional failure after the durability test

(thermal cycle test) when using the soldered parts under the worst conditions. # In the case of a non-HASL finished PCB, there should be no deterioration of insulation and corrosion resistance after the humidity resistance test. Deviation (3) Side: Less than 25% of lead width Direction of edge surface: Lead bottom surface should stay on the land. Others (4) Solder should not contact the parts body
Amount of solder (1) h: Height of fillet: (Solder thickness + lead thickness) or more Length of connection on edge surface side of lead: 75% or more of lead width Length of connection on lateral side of lead: 200% or more of lead width
Wetting (2) The land should be completely covered (100%) and the contact angle be < 90.
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6
Items
Electrical connection < Soldering - common > Cable and lead parts
Items to check
Applicable parts
(1) Amount of solder
NOK
OK
Soldering
Amount of overlapping 5 wire diameter Overlapping
Overlapping is insufficient (2) Wetting
NOK
A > 90 (Cable and lead not covered by solder )
OK
Solder
Cable or lead
A A A < 90
Others (3) (4) Rosin flux
(5) Loose contact

NOK
NOK
Flux Soldering
Cable
Covered by solder but no intermetallic is formed
Solder is absorbed under the coating of the lead, making the lead unable to fall over
(6) Fractured joint

NOK
(7) Disturbed joint and overheat

NOK
Crack
Cracks can occur if the wire is moved while cooling (8)
NOK (9) NOK
- It looks white due to overheating. - Due to insufficient temperature for solder and lack of time, soldered surface is grained resulting in insufficient smoothness and luster.
(10) NOK (11) NOK
Damage to the wire (due to melting) Points to check
Excessive removal of coating
Damage on core cable while removing coating
Core cable spread apart
Alternate if not reachable (thermal cycle test) using soldered part under the worst conditions. # In the case of a land not covered with soldering (not a leveler circuit plate, there shall be no deterioration in insulation and corrosion resistance after the humidity resistance test. Others (3) - (12)
(3) The base of the wire should be soldered so it would not fall over. (4) There should be no bonding by flux. (5) There should be no loose contact. (6) There should be no fractured joint. (7) There should be no disturbed joint or overheating. (8) There should be no damage on coating. (9) There should be no excessive removal of coating. (10) There should be no damage on the copper cable. (11) The copper cable should not spread apart.
! Check
that the solder shape is appropriate.
" Refer to the chart # There shall be no functional failure after the durability test
Amount of solder (1) Overlap between the wire and the connected material (land): Joint length should be more than 5 times the wire diameter.
Wetting (2) 100% of the land should be covered and A < 90.
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7
Items
Items to check
Applicable parts
Empty plated through hole not covered by resist (only flow soldering process)
NOK
OK
Points to check solder is adequate.
Conformity status through hole should be entirely covered with solder. The surface angle A should be less than 90.
Alternate if not reachable reachable, the durability test (thermal cycle and humidity resistance tests) should be performed with soldered product and there should be no functional failure.
! Check that the wetting of the " The inner surface of the plated # If the conformity status is not
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Check No.
36 - 00 - 012 / - - C
II 1 2
8
Items
Items to check
Solder ball
Applicable parts
Surface of the circuit board

Gull wind lead element J lead element
Corner chip part
Element main unit
Points to check process settings and the facilities (printing shape and the amount of soldering) make it hard to produce solder balls.
Conformity status ball with a diameter bigger than 0.13 mm, or 50% of the minimum pitch.
Alternate if not reachable prevent any functional failure caused by the movement of a solder ball. (Ex: Coating, etc... to prevent movement of the solder balls)
! Check that the materials, the " There should not be any solder # Measures should be taken to
RENAULT 2008
Page II - 9
(127)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 2
9
Items
Electrical connection < Soldering - common > Residual flux
Items to check
Insulation resistance
Applicable parts (1)
Insulation resistance lowered by absorption of humidity or migration of residual flux
(2)
NOK Push SW Dial SW
ON/OFF
Residual flux
R432
Circuit board
Pattern of contact point
Circuit board
Insulation resistance lowered by absorption of humidity or migration of residual flux between the patterns
Points to check
Conformity status 100m or more. (Measurement should be performed under predetermined test conditions.) flux residue should be removed by washing. (by air blow or flux removal solution and drying)
Alternate if not reachable under humid condition is acceptable if there is no functional failure at high temperature.
! Check
that the insulation characteristics are not affected by residual flux.
" Insulation resistance should be # An insulation resistance of 10M
! Check that the residual flux " The

cannot be responsible of short contact failure between the contact patterns.
RENAULT 2008
Page II - 10
(128)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 3
1
Items
Electrical connection < Soldering lead free> Through hole components
Items to check
Fillet lifting
Applicable parts
NOK Solder Separation
Land
Points to check
Conformity status
! Check for fillet lifting.
" There should be no fillet lifting.
# When there are fillet liftings,

perform the durability tests to check that the lifting does not lead to a functional failure.
RENAULT 2008
Page II - 11
(129)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 3
2
Items
Electrical connection < Soldering lead free > Through hole components
Items to check
Separation of the lead
Applicable parts
NOK Separation of the lead Solder
Land
Points to check not separate.
Conformity status
! Check that the lead terminal does " There should be no separation.
# When
there are separations, perform durability test to check that the separation does not lead to a functional failure.
RENAULT 2008
Page II - 12
(130)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 3
3
Items
Items to check
Land lifting
Applicable parts
NOK (1) Land lifting Solder (2) Damage on the pattern
Land / pattern
Points to check
Conformity status
! Check for land lifting.
" There should be no land lifting.
# When there is some land lifting or

damages on the pattern, perform the durability tests to check that the damages do not lead to a functional failure
! Check for damages on the pattern " There should be no damages.

due to land lifting.
RENAULT 2008
Page II - 13
(131)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 3
4
Items
Electrical connection < Soldering lead free >
Items to check
Shrinkage cavity
Applicable parts
Through hole components and SMD parts
NOK Land Shrinkage cavity
Solder Shrinkage cavity
Soldering Land
Points to check
Conformity status shrinkage.
Alternate if not reachable the durability tests to check that the cavities do not lead to a functional failure.
! Check that there is no cavity.
" There should be no cavity due to # When there are cavities, perform
RENAULT 2008
Page II - 14
(132)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 3
5
Items
Electrical connection < Soldering lead free > Surface mounted parts
Items to check
Separation of the SMD terminal
Applicable parts
NOK Separation of the SMT terminals
Separation of the SMT terminals
Lead Land
Points to check not separate from the solder joint..
Conformity status
! Check that the SMD terminals do " There should be no separation.
# When
there are separations, perform the durability tests to check that the separations do not lead to a functional failure
RENAULT 2008
Page II - 15
(133)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 3
6
Items
Electrical connection < Soldering lead free > Surface mounted part
Items to check
Separation of the SMD land
Applicable parts
NOK
Separation of the SMT land interface (cracks)
Lead Land
Points to check separate from the solder joint.
Conformity status
! Check that the SMD land do not " There should be no separation.
# When
there are separations, perform the durability tests to check that the separations do not lead to a functional failure
RENAULT 2008
Page II - 16
(134)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 3
7
Items
Items to check
Separation of the SMD fillet
Applicable parts
Surface mounted parts (Reflow plus flow process)
NOK Cracks and voids in the solder joint appear after flow because of remelting of a portion of the reflow solder
Crack Void Separation
Crack Void Separation
Points to check solder joints during process occurs. the flow
Conformity status voids and no separation due to remelting.
Alternate if not reachable voids due to remelting, perform the durability tests to check that the separation does not lead to a functional failure
! Check if a local remelting of the " There should be no cracks, no # When there is some cracks, or
RENAULT 2008
Page II - 17
(135)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 3
8
Items
Electrical connection < Soldering lead free > BGA, CSP
Items to check
Separation of the BGA ball
Applicable parts
NOK
Cracks and voids in the solder joint appear after flow because of remelting of a portion of the reflow solder
Separation
Points to check BGA balls solder joints during the flow process occurs.
Conformity status voids and no separation due to remelting.
Alternate if not reachable voids due to remelting, perform the durability tests to check that the separation does not lead to a functional failure
! Check if a local remelting of the " There should be no cracks, no # When there are some cracks, or
RENAULT 2008
Page II - 18
(136)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 3
9
Items
Items to check
Plated through hole damages
Applicable parts
NOK (1) Delamination of the plated through hole (2) Damages on the internal layer pattern
Points to check through hole (separation between the plating and the epoxy resin). (1)
Conformity status any delamination of the plated through hole.
Alternate if not reachable plated through hole and the inner layer pattern, perform the durability tests to check that the damages do not lead to a functional failure.
! Check for any delamination of the " There should be no damage, no # If there are damages on the
! Check that there is no damage on

the pattern of the inner layer and its connection with the plating. (2)
RENAULT 2008
Page II - 19
(137)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 3
10
Items
Electrical connection < Soldering lead free > Circuit board
Items to check
Copper erosion
Applicable parts
NOK Erosion of the copper Land
Damage of the plated through hole
Solder
Points to check (lands, plated through hole, via hole) due to erosion.
Conformity status
! Check for any wane of copper " There should be no wane.
RENAULT 2008
Page II - 20
(138)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 3
11
Items
Items to check
Whiskers
Applicable parts
Inserted parts and surface mounted parts
NOK
Whiskers (Plating surface of part electrode)
Whiskers (Plating surface of part electrode)
Points to check formed (thin areas of parts plating and solder fillet).
Conformity status
! Check that no whiskers have " Whiskers shall not form.
# In high temperature and high humidity exposure tests (85C/85% RH, 1000 h), whiskers shall not form in 1/2 or more of the smallest electrode space. However, when the time specified in the indicated specifications document (36-00-802_LT02) is longer, the specifications test time requirement shall be adopted.
RENAULT 2008
Page II - 21
(139)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 3
12
Items
Items to check
Decrease in solder strength
Applicable parts
NOK
Lead (121) Circuit board
Decrease in joint strength on the joint interface occurs.
Joint strength
Strength
OK
30%
NOK
Before testing
1000 h
High temperature and high humidity exposure tests (85C/85% RH, 1000 h)
Points to check
Reference value
! Check that there is no decrease " There shall be no decrease in # In high temperature and high solder strength. humidity exposure tests in the joint strength. (85 C/85% RH, 1000 h), strength shall not decrease by 30% or more.
RENAULT 2008
Page II - 22
(140)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 3
13
Items
Items to check
Deformation of solder
Applicable parts
NOK
OK
Solder protrudes from land.
Solder protrudes from land.
Part electrode
Part electrode Part body
Part body
Points to check
Reference value
! Check that there is no solder " Shall be free from deformation # Confirm that there is no such as solder protruding from deformation in a heat cycle deformation. the land.. longevity test. If there is deformation, judgment shall be made after consultation.
RENAULT 2008
Page II - 23
(141)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 4
1
Items
Electrical connection < Press fitting > PCB land
Items to check
Press fitting process
Applicable parts
Pin to be press fitted
Press fitting direction
Land
Circuit board
Through hole Construction method to ensure electric conductivity by contact between press fitted pin and through hole land
Points to check
Conformity status fitting
Alternate if unreachable
! Check
that the press process is adequate
" The press fitting process should

be the same as the one described over.
RENAULT 2008
Page II - 24 (142)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 4
2
Items
Electrical connection < Press fitting > Press fitted pins land
Items to check
Land damages
Applicable parts
NOK
View of the land on OUT side
Length of the deformation
<75%
Pressing direction Press fitted pin
Land width
(1) Deformation (lifting) Land OUT side Plated through hole Land IN side
(2) Deformation (blistering)
(3) Cracks Pressing direction
View of the land on IN side
Pressing direction
(1) Deformation (lifting)
(4) Scratches, recesses, chipping, etc
Points to check dimensions of the pin to be press fitted and the internal diameter of the plated through hole are adequate.
Conformity status or separation of the land. (1)
! Check that the shape and the " There should be no deformation " The length of the deformation and
the blistering should be 75% Max of the total width of the land. (2) " There should be no cracking. (3) " There should be no scratch on the land and the plated through hole. (4)
RENAULT 2008
Page II - 25 (143)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 4
3
Items
Electrical connection < Press fitting > PCBs resin
Items to check
Resin damages
Applicable parts
Cross section view NOK
Pin
Resin
Press fitted pin
(1) Whitening and separation of the resin
Cu plated through hole
Land OUT side Plated through hole Land IN side Solder resist Upper view of the surface OUT side Press fitted pin (1) Whitening of the resin Pressing direction
(2) Cracks in the solder resist
Land
Points to check
Conformity status
! Check
that the shape and dimensions of the pin to be press fitted and the internal diameter of the plated through hole are adequate.
" There should be no blushing or

separation of the circuit board resin. (1) " There should be no cracks in the solder resist. (2)
RENAULT 2008
Page II - 26 (144)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 4
4
Items
Electrical connection < Press fitting > Plated through hole
Items to check
Plated through hole damages
Applicable parts
NOK Cross section view
Press fitted pin
Resin
(1) Peeling of the copper plating (2) Cracks in the copper plating
Peeling of the copper plating (chip peeled off)
Surface section view Pin
(3) Deformation of the copper plating
Resin
Cu plated through hole
(4) Residual thickness of the copper plating
! Check
Points to check that the shape and dimensions of the pin to be press fitted and the internal diameter of the plated through hole are adequate..
Conformity status
" There should be no peeling of the

copper plating. (1)
" There should be no cracking in the

copper plating. (2)
" The deformation of the copper
plating should be less than 25 m. (3) " The residual thickness of the copper plating should be at least 8 m. (4)
RENAULT 2008
Page II - 27 (145)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 4
5
Items
Electrical connection < Press fitting > PCBs inner layer pattern
Items to check
Inner layer pattern damages
Applicable parts
NOK
Cross section view
a b
a: (1) Amount of deformation of the inner layer pattern b: Thickness of the inner layer pattern (2) Cracks or disconnection of the inner layer pattern
! Check
Points to check that the shape and dimensions of the pin to be press fitted and the internal diameter of the plated through hole are adequate.
Conformity status
" Deformation a of the inner layer

pattern should be smaller than its thickness b. (a < b). (1) " There should be no cracking or disconnection of the inner layer pattern connection point. (2)
RENAULT 2008
Page II - 28 (146)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 4
6
Items
Electrical connection < Press fitting >
Items to check
Peeling of the surface of the PTH or pin
Applicable parts
Plated through hole press fitted pin
NOK
(2) Scraping or peeling of the pin surface
(1) Peeling or protrusion of the plated and soldered section of the PTH (ex: tin silver)
Points to check
Conformity status
! Check
that the shape and dimensions of the pin to be press fitted and the internal diameter of the plated through hole are adequate.
" There should be no peeling of the

plating and the soldering finition of the plated through hole and no protrusion (ex: tin silver) on the board surface. (1) " There should be no chipping and peeling of the pin surface. (2)
RENAULT 2008
Page II - 29 (147)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 4
7
Items
Electrical connection < Press fitting > Press fitted pin
Items to check
Inclined press fitted pins
Applicable parts
NOK
Deformation of the resin and the land caused by inclined press fitted pin
Inclined press fitted pin (deviated)
Points to check
Conformity status
! Check
that the shape and dimensions of the pin to be press fitted and the internal diameter of the plated through hole are adequate. ! Check that the accuracy of the pin location is adequate. ! There should be no buckling of the pin and no stress or deformation of the resin or land due to inclined insertion.
" There should be no inclined press

fitted pin.
RENAULT 2008
Page II - 30 (148)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 4
8
Items
Items to check
Extension of the pattern
Applicable parts
Press fitting land and pattern
Pin
Pressing direction
OUT side Land
IN side
Pattern (surface layer and internal layer)
Surface view Area where highest stress is likely to be applied during press fitting OK Extension in a direction where concentrated stress is avoided Pin
NOK Extension in a direction where strong stress is applied
Land
Points to check been taken to avoid stress on the pattern due to press fitting.
Conformity status press fitting holes in the direction where the stress would be the lowest.
! Check that some measures have " The pattern should extend from
RENAULT 2008
Page II - 31 (149)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 4
9 Electrical characteristics of press fitting (connection resistance)
Items
Electrical connection < Press fitting > Press fitted joint
Items to check
Applicable parts
mA
Measure the low current and voltage by the range of mA and V.
Electrical connection resistance
Use range
Electrical connection resistance
Minimum outside diameter of the pin
Maximum diameter of through hole Minimum diameter of through hole
1 m
Maximum outside diameter of the pin
1 m
Minimum
Through hole diameter
Maximum
100
500 Number of cycles or time
1000
Initial characteristic graph
Durability graph
Points to check the pin and the plated through hole are adequate. ! Check that the internal diameter of the plated through hole and the tolerances for the outside diameter of the pin are adequate.
Reference value diameter and the dimensional tolerances for the pin hole internal diameter within the entire range (minimum to maximum tightening margin of pin) should be decided so: " Contact resistance should be less than 1m.
! Check that the materials used for The requirements for the outside
# Resistance fluctuation shall be

1 m or less after the durability evaluation test.
RENAULT 2008
Page II - 32 (150)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 4
10
Mechanical strength characteristics of the press fitting pin (insertion force, initial retention force)
Items
Electrical connection < Press fitting > Press fitting joint
Items to check
Applicable parts
Pressing fitting insertion force Pin Pressing direction
Retention force (push-out) Tool for pushing out
Push-out direction
*1 The test speed of the insertion force shall be 25 to 50 mm/min. *2 The test speed of the retention force shall be 12 mm/min or less. *3 The retention force measurement shall be made for 24h or more after press-fitting pin insertion.
NOK
(1) 200N
OK
Insertion force Retention force (3) (2) 20N Minimum Use range Maximum
OK NOK
Through hole diameter
Points to check the pins and the plated through holes are adequate. ! Check that the internal diameter of the plated through hole and the tolerance for the outside diameter of the pin are adequate.
Conformity status met for the entire range of the tolerances of the outside diameter of the pin and the through hole diameter (minimum to maximum tightening section of the pin): " The insertion force should be less than 200N. (1) " The retention force should not be less than 20N. (2) " There should be no reduction of the retention force even if the diameter of the through hole is reduced. (3)
! Check that the materials used for The following requirements shall be
RENAULT 2008
Page II - 33 (151)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 4
11 Mechanical strength characteristics of the press fitting pin
Items
Electrical connection < Press fitting > Press fitted pin
Items to check
Applicable parts
Load Compression tool - (Compress using a semicircular cylinder tool designed in accordance with the diameter tolerance of the through hole)
Press fitting pin compliant area (flat area in the deformed section)
Minimum displacement Range of use

Deformation and elasticity recovery characteristics in accordance with the maximum diameter of the through hole Deformation and elasticity recovery characteristics in accordance with the minimum diameter of the through hole
Maximum displacement
OK
Load
Amount of elasticity recovery
Deformation Press fitting pin compression characteristics
OK
The elasticity recovery is stable for the entire operated range
Points to check the pin and through hole are adequate. ! Check that the internal diameter of the plated through hole and the tolerance for the outside diameter of the pin are adequate.
Conformity status in the entire deformation range of the pin. (There shall be no reduction of elasticity recovery.)
! Check that the materials used for " The elasticity recovery shall be stable
RENAULT 2008
Page II - 34 (152)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 4
12 Damage of adjacent solder mounted parts
Items
Items to check
Applicable parts
Solder mounted parts adjacent to the press fitting pin (including land)
Press fitting pin Solder mounted part
OUT side Press fitting direction
IN side
a: Distance from the through hole center Press fitting pin Distance from the through hole center: 2.5 mm
OK
NOK Electrical part or land is located within 2.5 mm from the through hole center.
Kept away 2.5 mm or more from the through hole center
Points to check parts are arranged with enough clearance to avoid damage due to the press fitting stress.
Reference value adjacent to the press fitting pin shall be kept away 2.5 mm or more from the press fitting pin center. (1) " When press fitting, the strain gauge shall read 1500 S or less at the area where solder mounted parts are located. (2)
Criteria to be consulted separately solder mounted parts originating from the press fitting before or after the durability testing.
! Check that the solder mounted " Solder mounted parts or lands # There shall be no cracks of the
RENAULT 2008
Page II - 35 (153)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 4
13 Electrical characteristics of press fitting (insulation resistance)
Items
Items to check
Applicable parts
Press fitting connection part

I A
V
P attern
M igration or C A F due to resistance dam age on the outer layer, etc.
Testing m ethod: high tem perature-hum idity bias test +85C /85% R H V = 14 V 1000 h V = 50 V 1000 h Insulation resistance value V /1 Insulation resistanc e value V /1
OK
NOK
10
10
Tim e
Tim e
Points to check dimensions of the press fitting pin and the finish diameter of the through hole are adequate.
Reference value the maximum outside diameter of the pin and the minimum diameter of the through hole in the tolerance ranges at the following areas, including decrease in insulation performance, " There shall be no decrease in insulation performance between through holes due to press fitting damage. (1) " There shall be no decrease in insulation performance between through hole and pattern due to press fitting damage. (2)
Criteria to be consulted separately test. The insulation resistance (at normal humidity) shall be 10E+6 or more.
! Check that the shape and the Insulating property shall be satisfied with # Conduct the migration and CAF
RENAULT 2008
Page II - 36 (154)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 4
14 Mechanical strength characteristics of press fitting (durability retention force)
Items
Items to check
Applicable parts
Press fitting connection part
Retention force (pushing out)
*1 The test speed of the retention force shall be 12 mm/min or less. Tool for pushing out *2 The retention force measurement shall be made for 24h or more after the press fitting pin insertion. *3 Sampling time and number of cycles for durability test: Specify the time within which the lower limit value of decrease in retention force due to stress relief after press fitting and the afterward transition Pushing out direction shall be sampled. Press fitting pin
OK
Retention force is increased from the early stage. NOK
Deterioration of 20% or more is observed with age.
20% 20N
0 10 50 100 500 1000
20% 20N
0 10 50 100
500
1000
OK
Retention force decreases within 20% but increases afterward in comparison with the one at the early stage.
NOK
Deterioration of 20% or more is observed during the durability test.
20% 20N
20% 20N
0 10 50 100 500 1000 0 10 50 100 500 1000
OK
The retention force remains stable after decrease of within 20%.
NOK
The retention force becomes 20N or less during the durability test.
20% 20% 20N 20N
0 10 50 100
500
1000
0 10 50 100
500
1000
Points to check pins and through holes are adequate. ! Check that the finish tolerances for the diameter of the through hole and the outside diameter of the pin are adequate.
Reference value contact load between the pin and the wall side of the through hole is secured adequately in the through hole for stabilization of electrical durability. (1) " The lowest retention force 20N in the preceding clause shall ensure the lowest limit value of the contact load of (1). (2)
Criteria to be consulted separately the entire range of the tolerances of the outside diameter of the pin and the diameter of the through hole (minimum to maximum tightening section of the pin): # Through the total range of deterioration with age due to durability stress, the retention force shall remain 20N or more. # Through the total range of deterioration with age due to durability stress, the decrease in retention force shall be within 20%.
! Check that the materials used for " Check that the minimum The following requirements shall be met for
RENAULT 2008
Page II - 37 (155)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 5
1
Items
Electrical connection < Die bonding > Die bonding (silver paste)
Items to check
Status of silver paste
Applicable parts
(1) Unacceptable silver paste on the chip surface

(2) Unacceptable silver paste exceeding chip height Chip Silver paste
Die bond pad
Points to check
Conformity status
Alternate if unreachable chip is
! Check the surface of the chip. (1)
" Adherence of silver paste on the

surface of unacceptable. the
! Check the silver paste extrusions " Silver pastes height exceeding
around the chip. (2) the height of unacceptable. the chip is
! Check the adherence of the silver " Adherence on an area other than
paste on any other metal film. the metal film is unacceptable.
RENAULT 2008
Page II - 38 (156)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 5
2
Items
Items to check
Uncured silver paste status
Applicable parts
Chip
0.05t < H < 0.5t (For the four sides)
Silver paste
Points to check
Conformity status
! Check the shape of the uncured

silver paste.
" Silver paste extrusions should be

from 10% to 50% of the height of the chip.
RENAULT 2008
Page II - 39 (157)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 5
3
Items
Items to check
Void
Applicable parts
In the case of a device such as a power transistor for which heat radiation is required Circumference of chip
Silver paste 0.1 mm or less Void
Points to check
Die bonding
Element requiring heat radiation Other dies
! Check the dimensions of

the soldered area
95% or more of the entire area of the chip. Entire outer circumference of the chip should be surrounded with silver paste. contacting surface exceeding 0.1 mm should be allowed
50% or more of entire area of the chip. 75% of outer circumference of the chip should be surrounded with silver paste. 10% of the area under the chip should be allowed
! Check for voids in the No void with a diameter No void covering more than
RENAULT 2008
Page II - 40 (158)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 5
4
Items
Electrical connection < Die bonding > Die bonding
Items to check
Die shear strength
Applicable parts
Minimum strength [kgf]
Die Measurement jig
Area of die [mm2]
Points to check
Conformity status
Alternate if unreachable the
! Measure the die shear strength
" The measured strength should be

in accordance with requirements stated above.
RENAULT 2008
Page II - 41 (159)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 5
5
Items
Items to check
Inclination of the chip
Applicable parts
10 or less Chip
Points to check
Conformity status
! Check the inclination of the chip
" Any inclination over 10 should

not be allowed.
RENAULT 2008
Page II - 42 (160)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 5
6
Items
Items to check
Deviation of the chip
Applicable parts
Die pad 10 or less
Chip
Points to check chip and the die pad.
Conformity status be allowed
! Check the deviation between the " Any deviation over 10 should not
RENAULT 2008
Page II - 43 (161)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 6
1
Items
Electrical connection < Wire bonding > Ball bond
Items to check
Bond shape (1)
(2)
D: Wire diameter W: Ball bond diameter

2D W 5D OK NOK
Points to check bond W (1)
Conformity status between 200% to 500% of the wire diameter covered by the ball bound (top view).
! Check the diameter of the ball " The ball bond diameter should be
! Check the location where the wire " The wire should be completely
is rising from the ball. (2)
RENAULT 2008
Page II - 44 (162)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 6
2
Items
Electrical connection < Wire bonding > Ball bond
Items to check
Position of the pad and the ball bond (1)
(2)
Intermetallic compound
OK OK
NOK
NOK
Points to check bond from the bonding pad. (1)
Conformity status than half of the bond surface is not over the pad. " Any bond closer than 0.3mm from a metallic part is unacceptable.
! Check the deviation of the ball " It should not be allowed that more
! Check
the compounds. (2)
intermetallic
" Any
intermetallic compound extending radially from the circumference of a ball bond is unacceptable.
RENAULT 2008
Page II - 45 (163)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 6
3
Items
Electrical connection < Wire bonding >
Items to check
Bond shape (2)
Applicable parts
Tails bond (semi lunar bond)

Top view D: Wire diameter W: Bond width L : Bond length
(2)
(3)
1.2 D W 5.0 D 0.5 D L 3.0 D
(1)
Points to check
Conformity status
! Check the bond width W. (1)
" The
bond width should be between 120% to 500% of the wire diameter. between 50% to 300% of the wire diameter.
! Check the bond length L. (2)
" The bond length should be
! Check the trace of the bonding " The trace of the bonding tool
tool (3) should cover entirely the width of the wire.
RENAULT 2008
Page II - 46 (164)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 6
4
Items
Electrical connection < Wire bonding >
Items to check
Position of the pad and the bond (2)
Applicable parts
Tails bond (semi lunar bond)
0.3 mm or more Dimensions of application area S
Points to check
Conformity status
! Check the deviation of the bond.
" It should not be allowed that more

than half of the bond surface is not over the pad. " Any bond closer than 0.3 mm from a metallic part is unacceptable.
RENAULT 2008
Page II - 47 (165)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 6
5
Items
Electrical connection < Wire bonding > Wedge bond
Items to check
Bond shape (3)
Applicable parts
D : Wire diameter W : Bond width L : Bond length (2) Wire tail (1) 1.5 D W 3.0 D 1.5 D L 5.0 D
Points to check
Conformity status
! Check the bond width (1)
" The width of the bond should be

between 150% to 300% of the wire diameter
! Check the bond length (2)
" The length of the bond should be

between 150% to 500% of the wire diameter
RENAULT 2008
Page II - 48 (166)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 6
6
Items
Electrical connection < Wire bonding > Wedge bond
Items to check
Position of the pad and the bond (3)
(2)
D: Wire diameter W: Bond width L: Bond length Tail length 2D Wire tail
Dimensions of the bond area S
Points to check
(1)
Conformity status than half of the bond surface is not over the pad. " Any bond closer than 0.3 mm from a metallic part is unacceptable.
! Check the deviation of the bond. " It should not be allowed that more
! Check the wire tail. (2)
" It should not be allowed for the wire

tail to contact any metallic film not connected to the relevant wire neither to extend above a metal film. " The length of the tail should not be more than 200% of the wire diameter or 250 m.
RENAULT 2008
Page II - 49 (167)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 6
7
Items
Electrical connection < Wire bonding > All wires

(2)
Items to check
Wire shape (1)
Applicable parts
(1)
h 0.1 mm a2D (D: Wire diameter)
NOK
NOK
Points to check
(1)
Conformity status deflection, kinks, twisting or loosening of the wire are unacceptable. the chip surface should be at least 0.1 mm. The wire should stay at least twice the wire diameter away from the chip surface.
! Check the shape of the wire loop. " Excessive
! Check the height of the wire loop. " The height of the wire loop above
(2)
RENAULT 2008
Page II - 50 (168)
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Check No.
36 - 00 - 012 / - - C
II 1 6
8
Items

(2)
Items to check
Wire shape (2)
Applicable parts
(1)
Flaw Depth
1 D 4
Recess
D: Wire diameter
Points to check
Conformity status
! Check for damages on the wire.

(1,2)
" Dent, cut, shrinkage, cracking or

recess bigger than 25% of the wire diameter are unacceptable. Flaws on the bond connection should not be accepted regardless of the depth.
! Check the course of the wires
" Wires
with different electrical potential should not cross.
RENAULT 2008
Page II - 51 (169)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 6
9
Items
Electrical connection < Wire bonding > Wire bonding
Items to check
Tensile strength
Applicable parts
Minimum bonding strength [g.m.s-2]
Au wire
Wire diameter [m] Minimum bonding strength [g.m.s-2]
Al wire
*The tensile strength is the minimum bonding strength which is determined by the breakage load solely used for lines AI and Au. The actual W/B strength is determined by the wire length, bonding location and test method, and in actual use, is higher than the values in the graph above.
Wire diameter [m]
Points to check
Conformity status
! Tensile strength of the wires.
" Au and Al wires should meet the

tensile strength requirements specified in the above diagram.
RENAULT 2008
Page II - 52 (170)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 6
10
Items
Items to check
Rupture mode
Applicable parts
Points to check (1)
Conformity status There should be no peeling.
Mode name: Peeling of the 1st bond (2) The standard strength requirements should be met and occurrence rate should not be more than 50%.
Mode name: Breakage of the neck on 1st bond side (3) The standard strength requirements should be met.
Mode name: Midstream rupture of wire (4) The standard strength requirements should be met and occurrence rate should not be more than 50%.
Mode name: Breakage of the neck on the 2nd bond side (5) There should be no peeling.
Mode name: Peeling of the 2nd bond
RENAULT 2008
Page II - 53 (171)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 7
1 State of the joint between electrode and conductive adhesive
Items
Electrical connection < Conductive adhesive>
Items to check
Applicable parts
Part electrode and circuit board land

Binder (Filler is removed from conductive adhesive) * When there is a difference of wetness, binders will concentrate on the material with the highest wetness and will lower the conductivity because of contact between the electrode and the filler.
Measured using contact angle gauge b a
b
Electrode
Binder a << b
a >> b
Electrode material
Filler material
Filler
Points to check (wetness) between the material of the electrodes, the filler and the base adhesive material (resin) are adequate. conductive adhesive are adequate.
Conformity status angle (wetness) between the materials of electrode / binder and material of filler / binder should be met. 50 m before and after the durability tests.
! Check that the contact angle " The requirements for the contact
! Check that the electrodes and the " The resistance should be less than
Do not apply a probe to this area. (It may damage the insulation film.) Part electrode Apply probe to this area Circuit board electrode Circuit board electrode Gauge: Milli-ohm gauge (HP 4338B, etc.) Use a 4 wires measurement probe (Kelvin type). For measurement, 1A is recommended to keep the insulation film from being damaged.
Conductive adhesive Circuit board
RENAULT 2008
Page II - 54 (172)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 8
1
Items
Electrical connection < BGA, CSP > BGA balls and packages
Items to check
BGA chip mounting process
Applicable parts
BGA/CSP BGA ball
Printed circuit board
Interposer
Cu land
Printed solder paste [Mount]
Curing to melt [Reflow heating]
[Solder printing]
Points to check of the BGAs is adequate
Conformity status as described above
! Check that the assembly process " The assembly process should be
RENAULT 2008
Page II - 55 (173)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 8
2
Items
Items to check
Melting condition of the BGA balls
Applicable parts
NOK Size of package L Height a Height b
Height d Inclination
Height c
Height b
Height a
Height c
Height d
Camber (The height of BGA balls at the side is greater)
Height a
Height b
Height d
Height c
Camber (Vertical diameter of the BGA ball at the center is greater.)
(1) Inclination and camber : W = (b a)/L 5/1000 (2) Difference in height of the BGA ball : h = (c - d)/d 5/100
Points to check ! Check that the melting of the BGA balls and the solder paste are sufficient. ! Check that no strong residual stress remains for the package and the BGA balls.
Conformity status " Inclination and camber of the package should be less than 0.5%. (1) " The maximum difference of height between the BGA balls under a component package should be less than 5%. (2)
RENAULT 2008
Page II - 56 (174)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 8
3
Items
Electrical connection < BGA, CSP > BGA balls
Items to check
Shape of the solder balls
Applicable parts
NOK
(1) BGA ball deformed

d
(2) Offset of the land (mounting displacement)

d
Joint diameter c
Land (package side) BGA ball Pattern (3) BGA ball is too large
Not completely melted solder Distance to adjacent land D Land diameter L
(4) BGA ball is too small
Voids (5) Incomplete melting of BGA ball and solder paste (6) Voids in the BGA ball
Land (PCB side)
deformation d
Crack
Stress lines (7) Stress lines (8) Cracking
Points to check the land or mounting that is likely to cause distortion, deformation or cracking on the BGA ball, and deteriorate the reliability.
Conformity status than 25% of the land diameter (L) and less than 25% of the distance to adjacent land (D). (1) The deformation of the BGA balls caused by an offset of the land and by the displacement of mounting should be less than 5% of the land diameter (L). (2) The protrusion from the land (d) should not exceed 25% of land diameter L and should not exceed 25% of the distance to adjacent land (D). (3) The deformation d between the ball edge and the exterior of the land should not be less than 5% of land diameter (L) and the BGA ball should not be smaller than 25% of the distance to adjacent land (D). (4) There should not be any poor melting of BGA ball or solder paste. (5) There shall be less than 10% void in the BGA balls. (6) No stress line or wrinkling should be seen on the surface of the BGA ball. (7) There should be no cracking on the BGA ball. (8)
! Check if there is any design of " The deformation d of the BGA balls (overhang from the land) should be less " " " " " " " RENAULT 2008
Page II - 57 (175)
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Check No.
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II 1 8
4
Items
Items to check
Package side connection design
Applicable parts
OK
a
BGA side land
Stress concentration id avoided by use of two lands with the same diameter.
PCB side land
NOK Solderi
NOK
a
(1) Cracks in the solder constricted section
(2) Cracks caused by a difference in the land diameter
BGA side land
BGA interposer (substrate) PCB
PCB side land
Points to check affect reliability or likely to cause cracks.
Conformity status should be avoided, because it may cause cracks in the joint between the BGA ball and the BGAs land. " The specified requirements for the diameter of the land on the BGA (a) and the diameter of the land on the PCB (b) should be met. (Maximum 10% of difference between the two lands).
! Check for any design which may " Constrictions
RENAULT 2008
Page II - 58 (176)
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Check No.
36 - 00 - 012 / - - C
II 1 8
5
Items
Items to check
Solder ball under the BGA
Applicable parts
Size of the conductive foreign substance (ex :solder ball, etc...)
conductive foreign substance (ex :solder ball, etc...)
Distance between adjacent lands D
Points to check settings and facilities likely to reduce solder balls are provided.
Conformity status foreign material (soldering ball, etc) with a size greater than 10% of the distance between adjacent lands D.
! Check that materials, process " There should be no conductive
RENAULT 2008
Page II - 59 (177)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 8
6
Items
Electrical connection < BGA, CSP >
Items to check
Extension of pattern from land
Applicable parts
BGA ball land and wiring pattern
PCB land Extension pattern
PCB top view NOK
Resist opening Without tear drop
Wiring width W
Tear drop-shaped OK
Wiring width at the border of resist opening L
Points to check design is not easy to disconnect.
Conformity status should be tear-drop shaped and the width of the pattern L at the border of resist opening should be twice the extension pattern width W and at least 200 m.
! Check that the extension pattern " The extension pattern design
RENAULT 2008
Page II - 60 (178)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 8
7
Items
Environmental protection < BGA, CSP > Underfill
Items to check
Underfill
Applicable parts
Filling nozzle of under-fill material
BGA package BGA ball
Fillet
PCB Under-fill material
[Filling of underfill]
[Filling of underfill completed and hardening]
Points to check ensure reliability
Conformity status
! Underfill is mandatory for BGAs to " Underfill should be provided. ! Check that material selection for " Glass transition point of the
the underfill is adequate. material used for under-fill (Tg) should be much higher than the temperature to which underfill is exposed (Tg>>Tf) peripheral temperature and self-heating).
RENAULT 2008
Page II - 61 (179)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 1 8
8
Items
Environmental protection < BGA, CSP > Underfill
Items to check
Filling condition of the underfill
Applicable parts
Fillet length d OK Without void Appropriate fillet
NOK
(1) Void
OK
NOK (2) Excessive filling (3) Insufficient filling
Points to check components. ! Check if the conditions of filling of the underfill.
Conformity status void making the ball uncovered. There should be no void bigger than 10% or more of the package area (total area of void). (1) " There should be no excessive filling over the surface of the package. (2) " There should be no insufficient filling (Length of fillet d should be at least 0.2 mm). (3)
! Underfill is mandatory for BGA " There should be no void between balls or no
RENAULT 2008
Page II - 62 (180)
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Check No.
36 - 00 - 012 / - - C
II 2 1
1 Corrosion on Ag electrode by sulfurated gas
Items
Assembly < Common >
Items to check
Applicable parts
Corrosion-prone electrode (Ag electrode etc.)

Adverse effect of corrosion gas on the Ag electrode may cause disconnection and increase in resistance, resulting in functional failure.
Electrode Soldering
Circuit board
Land
Cross sectional view of electrode structure
Growth of silver sulfide
Gas
Ag paste
Corrosion on electrode
Sn plating
Ni plating Overcoat glass Registor
[Mechanism of electrode disconnection] Corrosive gas reacts with the Ag electrode to form silver sulfide. Diffuse migration of Ag occurs while silver sulfide is growing outwards. The amount of the migration will result in void that could lead to disconnection. [Sources of gas generation] Consider not only atmospheric and exhaust gases but also gases emitted from the materials as corrosive gases. Cardboard and vulcanized rubbers are commonly-known materials.
Inside Ag electrode
* H2S and SO2 are among the representative corrosive gases, and the following are reaction formulas for each of them. [Oxygen is required for H2S reaction.] 4Ag + 2H2S + O2 2Ag2S + 2H2O [Water is required for SO2 reaction.] SO2 + H2O H2SO3 2Ag + H2SO3 Ag2S + H2O + O2
Check point
* * * *
Reference value
Index for individual consultation/Remarks
Regardless of the check results, conduct the corrosive gas resistance test (36-00-802, CH12) to prove that no sign of corrosion is identified. If any sign of corrosion is identified, estimate the remaining longevity to determine through individual consultation. Determine the remaining longevity considering the corrosion rate to 0.5 m/year and 25% of the initial thickness as longevity limit. The 4th check point shall be verified subject to gas emission from an actual device. Check if the structure is designed so that the Ag electrode is not exposed.
" " "
The structure shall be designed so that the Ag electrode is not exposed. If exposure is inevitable, conduct the corrosive gas resistance test (36-00-802, CH12, method 4) to prove that no sign of corrosion is identified. If any sign of corrosion is identified, estimate the remaining longevity to determine through individual consultation. Protect the Ag electrode with coating agent such as acrylic and rubber-based ones which gas permeability resistance is high. Coating agents with low gas permeability resistance such as silicon-based ones shall not be used. Prevention of Ag exposure shall be ensured in the resistor fabrication process.
Considering the corrosion rate to 0.5m/year and 25% of the initial thickness as the longevity limit, determine the remaining longevity.
Confirm that the exposed Ag electrode is protected by circuit board coating.
"
! !
Confirm that the overcoat glass prevents the Ag electrode from being exposed. Check if there are materials that emit sulfurous gas near the ECU in the same closed space.
" " "
# # #
Determine whether there is no problem or not based on the actual results (installation position, destination etc) of the equivalent ECUs. If any sign of corrosion is identified, determine the remaining longevity. The test conditions shall conform for the duration, temperature and humidity settings to the conditions of the corrosive gas resistance test (36-00-802, CH12, Method 4). Gas to which the ECU will be subject in real condition shall be emitted by the material.
The ECU shall not be mounted in a closed space with materials that will emit sulfurous gas. If it is inevitable to mount the ECU under the above conditions, perform a corrosion test in a realistic mounting condition - with the ECU and the sulfurous gas emitting materials together in the test chamber. Check for any sign of corrosion on the Ag electrode.
RENAULT 2008
Page II - 63 (181)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 2 2
1
Items
Assembly <Coating, Potting, Gel, Grease>
Items to check
Defective conductivity of contact
Applicable parts
Adhesive, sealant, sealing agent and grease
Relay contact
If silicone material is used, low molecular siloxane contained in the silicone evaporates and re-adheres to the joint of electronic parts such as relay, switch, etc. Silicone dioxide decomposed during the re-adherence is activated as an electrical insulating agent, and creates bad connection problems. * Low molecular siloxane Silicone rubber including a high molecular material is low molecular siloxane (material of silicone rubber) prior to polymerization. For silicone rubber, non-polymerized low molecular siloxane remains and causes poor connection failures.
Area where conductivity is poor due to the adhesion of gas
Points to check sealant, sealing agent and grease are adequate.
Conformity status contact avoided. failures should be
Alternate if unreachable an electrical and electronic material after removing the low molecular siloxane.
! Check that the type of adhesive, " Any material that could create bad # When using silicone material, use
RENAULT 2008
Page II - 64 (182)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 2 2
2
Items
Assembly <Coating, Potting, Gel, Grease> Potted parts
Items to check
Potting using hard resin
Applicable parts
NOK
Potting material (hard) Lead Soldering Void and residual flux (soft) Land Circuit board
Short may occur

Due to thermal expansion variation of the potting material, the solder joints are deformed and collapse in the areas where the potting material is not filled, like voids or the soft residual flux area, and makes shorts between the terminals. Points to check solder joints is adequate. Reference value around the solder joints. There should be no void or flux residue. should be selected, taking into consideration the expansion variation properties. Alternate if unreachable with the thermal cycle tests.
! Check that the potting of the " Potting material shall be filled # The potting should be validated
! Check that the material for potting " An appropriate potting material
is appropriate.
RENAULT 2008
Page II - 65 (183)
RENAULT
Check No.
36 - 00 - 012 / - - C
II 2 2
3
Items
Assembly <Coating, Potting, Gel, Grease> Coating material
Items to check
Coating material that has intruded under the bottom of parts
Applicable parts
NOK (1) Incompatible manufacturing conditions

IC package body Terminal Coating material Soldering Circuit board
Excessive stress
Generation of stress that causes terminals to peel (2) Inadequate design

IC package body Terminal Coating material
(1) There shall be no problem when the mechanical characteristics of the coating material satisfies the design values. However, when the design values are not met due to the manufacturing requirements, stress is generated in the terminal detaching direction, resulting in peeling of the terminal. * In particular, it is necessary to pay special attention to the hardening conditions of silicon rubber bases. (2) When the mechanical characteristics of the coating material has not been designed for longevity, cracks are generated before the end of the guarantee period, resulting in it either being electrically open or highly resistant.
Repeated stress
Generation of cracks in soldered sections OK
IC package body Terminal
Soldering Circuit board
Coating material Soldering Circuit board
When coating material, that has been designed for longevity in consideration of mechanical characteristics, has been made under appropriate manufacturing conditions, it will not affect the soldered section of the terminals.
Repeated stress Example: Deformation of mechanical characteristics due to insufficient curing of the coating material
IC package body Terminal Coating material Soldering Circuit board Soldering Terminal
Generation of stress that causes terminals to peel
Points to check
Reference value
Individual consultation indices
Check that the material characteristics are according to the design.
"
The conditions recommended by the material manufacturer shall be incorporated into the processing design.
Confirm that there are no abnormalities in the soldered joints with the thermal cycle
Check that the material characteristics are according to the design.
"
Material selected.
that
has
been
designed
for
longevity
in
tests.
consideration of the mechanical characteristics shall be
"
The sample test conditions used in the bench quality check shall be identical to the mass production manufacturing conditions. The bench quality check shall be identical to the mass production manufacturing conditions.
RENAULT 2008
Page II - 66 (184)

36-00-012C Design Review - Reliability

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36-00-012C Design Review - Reliability

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PRODUCT SPECIFICATIONS

Normalisation Renault Automobiles RE-DS / Service 65850

REFERENCED DOCUMENTS External Document IPC-A-610 Class 3

II-1 (119) II-1 (119)

RENAULT I Circuit board design check items

1 Mounting direction of parts 2 Location of heat generating parts

(2) (3) (4) (1)

(1) I-10 (2) I-11 (1) I-12 (2) 43 42 41

RENAULT I Circuit board design check items

12 Layout of via hole

RENAULT I Circuit board design check items

1 Pattern width and intervals

(1) I-27 (2) 58

I-29 (1) (2) (3) I-30

RENAULT I Circuit board design check items

(1) (2) (3) (4) I-38 69

Check the diameter of the VIA hole.

I-41 I-42 I-43 I-44 I-45

27 Alignment 28 Trimming margin 29 Chipping and pinhole

I-47 I-48 I-49 I-50 I-51 I-52

RENAULT I Circuit board design check items

40 Corrosion, foaming Check for corrosion or defective or blistering adhesion

RENAULT I Circuit board design check items

1 Shape of the pattern

RENAULT I Circuit board design check items

1 Spacing between traces

2 Overcoat shape 3 SMD

RENAULT I Circuit board design check items

RENAULT I Circuit board design check items

1 Circuit board through hole, via hole

RENAULT I Circuit board design check items

RENAULT I Circuit board design check items

1 Part clearance short- circuiting

2 Interferences between parts

Check that the specified clearance is provided.

(1) (2) (3) I-79 110

(1) I-80 (2) 111

(1) (2) (3) I-81 112

5 Prevention of drosses when screws are tightened. 6 Direction of the connectors

RENAULT II Product confirmation check items

RENAULT II Product confirmation check items

RENAULT II Product confirmation check items

1 Fillet lifting 2 Land lifting

II-13 II-14 II-15 II-16 II-17

131 132 133 134 135

II-21 II-22 II-23

139 140 141

RENAULT II Product confirmation check items

(1) II-32 (2) 150

(1) (2) (3) (4) II-33 151

RENAULT II Product confirmation check items

RENAULT II Product confirmation check items

1 Status of silver paste

II-40 II-41 II-42 II-43

158 159 160 161

4 Die shear strength 5 Inclination of the chip 6 Deviation of the chip

RENAULT II Product confirmation check items

1 Bond shape (1)

165 166 167 168 169 170

RENAULT II Product confirmation check items

1 State of the joint between electrode and conductive adhesive

RENAULT II Product confirmation check items

4 Package side connection design 5