BGA T i i Training

Vivian
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Contents
Chapter 1 Chapter 2 Chapter 3 Chapter 4 Chapter 5 Chapter Ch t 6 Chapter 7 Flow overview BGA machine introduction Desolder BGA detail Clear BGA detail Soldering BGA detail Solder paste detail S ld t d t il Profile measurement standards

C ap e Chapter 1 . Flow overview

Flow
Desolder D ld BGA
Choose the suitable profile parameter. When the program goes to the auto-pickup p phase, rotate the knob to lower the vacuum pad until it touches BGA chip then raise top , p p p heater and remove BGA chip automatically.

Clear BGA Cl

Before cleaning the residue, check the pads of PCB if intact or not.

Soldering BGA

Put the PCB without BGA chip onto the support table then lay a new BGA chip onto the PCB. Choose the suitable profile parameter

Chapter 2. BGA machine introd ction introduction

Overview

Bottom Heater

1. 2. 3.

Bottom heater bracket Bottom heater safety mesh Heater 7

Cooling System

Control Panel

Control Panel Button Introduction

c. Button
1. CCD pull out

2. CCD retract

3. Act movement

4. Move cursor left

5. Move cursor right,

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Control Panel Button Introduction

6. 6 Move cursor up up

7. 7 Move cursor down

8. Confirmation 8 C fi ti

9. Switch display

10. Maitain the step currently executing

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Control Panel Button Introduction

11. Switch 11 S it h vacuum pump status t t

12. Adjust the LED

13. Run

14. Stop run

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Screen of BGA running

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Chapter 3 . BGA desoldering g

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Preparation Before Rework

Before operating the BGA Rework Machine carry out the temperature profile measuring process.

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Prepare Your Board

Remove the heatsink which covers your BGA

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Desoldering
CPU fan frame must be taken off when mounting Northbridge f f tb t k ff h ti N thb id chipset, or the BGA chipset would be raised up.

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Desoldering
Preparation P ti Before reworking, adhere the heat-resistant tape to avoid component damage.

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Fix PCB
Put the PCB onto X-Y axis support table and fix the board by i b d b using clamp l

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Set PC Board on the V type fixture

Check PCB flat or not.

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Set PC Board on the V type fixture

Fixing the PCB using the clamp , then check if the four corners of PCB is flat or not ,which means PCB is on the same horizon , Otherwise rework

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Support Pin Position

Adjust the support p appressed with the PC Board. Combine the j pp pin pp support pin and profile to raise the soldering quality.

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Select Proper Nozzle

Choose Suitable Vacuum Pad Size: 1 Si 15mm, 10 10mm, 5mm, 2 2mm Choose Suitable Nozzle

Rotate counterclockwise for tight. Clockwise rotate for loose

360Rotation
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Desoldering
Nozzle Cover: Nozzle must cover the whole BGA component, the gap of the margin must be the same.

1mm

BGA

Nozzle

1mm

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Soldering Practice
Nozzle Selection: Pay attention to NOZZLE size, it must be bigger than the BGA chip size. Suitable size is adding 2mm according to the Chipset size.

*For Example: BGA Size: 27x27mm. Nozzle Size must be 29x29mm (BGA-N020)

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Alignment Parts

adjust the X,Y axis.

X Y Axis Adjustment knob

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Alignment Parts
The gap between nozzle and PCB is 3mm, maximum is 5mm.

Gap

Adjust the limit Switch, according to PCB and BGA thickness.

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Press run key or start key

Choose suitable profile

START KEY

RUN KEY
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Desoldering
Wait till alarm , use your tweezers to touch the BGA ,when it is moved ,press up button to rise the upper heater then use your press heater, tweezers to move the chip from the board , then press the cooler button of the fan

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Chapter4. Chapter4 Clear BGA detail

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Clear BGA Detail

A. A Brush flux appropriately not too thick Make sure to brush each pad appropriately, thick. pad.

Brush flux in the same direction.

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Clear BGA Detail

B. Use iron to make sure every tin point of the BGA gets tin tin.

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Clear BGA Detail

C. Clean pads residue to smooth with solder-wick

Clean the residue from left to right side and be attention to avoid scraping the green paint until the pad surface showing the sheen of metal.
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False

PCB circuit OPEN

PAD Broken

Cover with G C ith Green P i t Paint

PAD Displacement
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False

PAD Peel off

PCB Copper exposed

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Chapter5 . Soldering BGA detail

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1. 1 Add flux and locates components

A. Fix the fixture on the board, point to point.

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Brush Solder Paste

B. Brush solder paste in one direction using small steel so that each hole has p g uniform solder paste

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Brush Solder Paste

C. Make sure each hole have uniform solder paste , Scratch superfluous p p solder paste on the plate, then remove the upper belt at last the left .( gently untill they have been pulled up).

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For NB or SB or VRAM

Add flux on the board ,and locates the chip and

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2. 2 Fix Pcb

Same as desoldering

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3. 3 Alignment Procedure and Soldering

Alignment is same with desoldering

Choose a right profile to run

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3. 3 Alignment Procedure and Soldering

Run the program, wait till end.

After heating , the cooling fan will start up automatically. The soldering is OK when fan stops
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3. 3 Alignment Procedure and Soldering

Wait for the temperature go down , then get the board off , p p the machine ,and clean it , put up the heatsink .

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After Operation
1. Do the next PCB after the upper heater temp. down below 80C 80 C 2. Turn off the power after the temperature of upper and bottom heater down to environment temp. or below 50C , otherwise it will influence the life and function of the machine

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BGABGA 936USB

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Turn on Power
Just need 220V AC, no other extra device

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Attention
PCB warp curve: Strictly check the PCB warp degree degree. For example, the expansivity of Pad and PCB Epoxy is different and the radiation is also different after heating. If layout and density are uneven, the PCB warps or twists easily.

Solution: Fix the PCB flatly, Just run the program profile with bottom heaters to flat the PCB.

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Attention
Pay attention to the holes around the chipset (heat sink fixture),it would influence heat transfer.

Adhere the heat- resistant tape on the holes holes.

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Chapter6. Solder paste detail

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1.Storage 1 Storage Conditions

Notes 1. Solder paste should be stored in refrigerated at 0 ~ 10 2. Every day , 10minutes before measuring the temperature of refrigerator, don t dont open the refrigerator . 3. Confirm solder paste warm up to 4 hours or more time before mixing the solder paste . 4. Artificial mixing should be 20 Minutes 5. Solder paste may not be exposed to air more than 30 minutes 6. The lif f ld 6 Th life of solder paste which h b t hi h has been open i 24 h is hours 7. Solder stored in box at room temperature can only be stored for 20 days

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2.Operating 2 Operating Flow

1. The tool for brushing solder paster

Fixed l Fi d pole

FixedKnob

Parts polarity

Tool Number

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2.Operating 2 Operating Flow

a. Put BGA in the tool ,take care of polarity

Focus

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2.Operating 2 Operating Flow

b. Move the fixed rod to the center of parts .whirl knob and fix the tool

Focus

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2.Operating 2 Operating Flow

c. After positioning the tool, brushing solder paste in one direction . Scratch superfluous solder paste on the plate . after making sure each hole have solder paste .Remove rods and rotary knob and go on next step /

before b hi solder paste b f brushing ld t

after brushing solder paste ft b hi ld t

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2.Operating 2 Operating Flow

2. The tool for brushing solder paste

Small steel

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2.Operating 2 Operating Flow

a. Affixed two side with adhesive tape and then the other two side p

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2.Operating 2 Operating Flow

b. After make sure of the polarity ,the hole of small steel and Pad must be in y one place .the small steel close to the PCB board .

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2.Operating 2 Operating Flow

c. Brush solder paste in one direction using small steel so that each hole has p g uniform solder paste

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2.Operating 2 Operating Flow

d. Make sure each hole have uniform solder paste , Scratch superfluous p p solder paste on the plate. then remove the upper belt at last the left .( gently untill they have been pulled up).

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2.Operating 2 Operating Flow

3.The tool for brushing solder paste (dustpan type )

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2.Operating 2 Operating Flow

a. a Make the Handle to the palm side direction ,confirm the polarity ,hold down palm-side confirm hold two sides of tool to make sure the hole of small steel and Pad are in one place .

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2.Operating 2 Operating Flow

b. b Choose the corresponding scraper on a small plate in one direction ,coat solder paste, so that tin is filled with all the holes of p plate .

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2.Operating 2 Operating Flow

c. Confirmed that all the holes have uniform tin,Scratch superfluous solder paste on the plate. after brush ok ,response to the gravity ,press the higher side ,pull up this tool gently gently.

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3.Acceptable 3 Acceptable Standard

Accept: a. Surface are very neat, there is no difference between tin points .Offset of point is less than 1/8 PAD(show as the picture ) b. Surface are not very neat, a little diff b S f t t littl difference i th thi k in the thickness of ti ,but i f tin b t in the scope of standard .no collapse, lack of tin ,no little offset or Dog ears Deny a. collapse, lack of tin ,little offset ,Dog ears b. arch the bridging

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3.Acceptable 3 Acceptable Standard

Show as the picture

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3.Acceptable 3 Acceptable Standard

Clean the tool for brushing solder paste 1. Pour Ultrasonic Cleaning machine Half-slot cleaner. The cleaner should be change every day . 2. In order to avoid residual solder paste to plug the rule of the aperture , put the tool to Ultrasonic cleaning machine ,after brushing solder paste is over. 3. Put down the ON button ,cleaning job will start and stop after 99 seconds automatically 4. After cleaning machine stop ,remove the tool . 5. At last ,use Cotton balls to brush the tool

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3.Accept 3 Accept standard

Notes 1. Confirm the board or component is lead or not before brushing solder paste . 2. When the tool for brushing solder paste is idle, clean it in Ultrasonic Cleaning machine and then Placed in the corresponding fixture tank. Safekeeping. 3. Check the appearance of tool of brushing solder paste is ok .if there is obvious deformation ,it will be not Useful. 4. 4 Solder paste must be used in 24Hours; and time used in the control period period. 5. If the printing quality have problem ,the tool for brushing should be cleaned and Bake so that it can be used . 6. 6 The life of tool for brushing solder paste is 5000 times 7. Selecting corresponding scraper before brushing solder paste . 8. Before the tool for solder paste using the tool need to be allowed ,and then operator can use use.

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Chapter7. Chapter7 Profile measurement standards

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Profile Measurement Standards

a. Temperature measuring tools DATAPAQ DATAPAQ

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Profile Measurement Standards

b. b Measurement processes Put the temperature measurement board into X-Y sliding seat and fix it by PCB fixture rotating the fixed knob .

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Profile Measurement Standards

Insert the plug of temperature isotherms on the board to temperature recorder and then run

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Profile Measurement Standards

c. c Standard temperature for lead manufacturing process product

Max.Temperature

A:205~225 (BGA surface) B:205~220BGA substrate C:205~220 (BGA substrate diagonal) D:205~220BGA bottom p point should 15 Temp difference: Each p Reflow ZoneOver 183 45~90SEC Slope between :170~180 0.35~0.75/second Soaking Zone140~170 60~120 SECBiggest BGA bottom Zone140 170 60 120 Average Ramp up 3/SEC,Average Ramp down 3/SEC

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Profile Measurement Standards

Curve :

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Profile Measurement Standards

d. d Standard temperature for lead manufacturing process product (LGA 775)

Max.Temperature :A: 225socket substrate B:200~225socket solder joint C:200 225socket b tt C 200~225 k t bottom Temperature difference: Each point should 15 Reflow Zone:Over 183 45 90 secs 45~90 Soaking Zone:140~170 60~120 secsP5 socket solder joint Slope b Sl between :170 180 0 35~0 75/ 170~180 0.35 0.75/second d Average Ramp up 3/SEC. Average Ramp down 3/SEC. down North bridge peak temperature < 183.

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Profile Measurement Standards

Curve :

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Profile Measurement Standards

e. e Standard temperature for Lead free manufacturing process Product Lead-free

Max.Temperature

A:230~245 (BGA surface) B:230~ 245BGA substrate C:230~245 (BGA substrate diagonal) D:230~245BGA bottom Temp difference: Each point should15 Reflow ZoneOver 217 45~90 SEC; Soaking Zone150~180 60~120 SECBiggest BGA bottom Slope between 205~215: 0.35~0.75/second Average Ramp up 3/SECAverage Ramp down 3/SEC

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Profile Measurement Standards

Curve :

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Profile Measurement Standards

e. e Standard temperature for Lead free manufacturing process product(LGA775 Lead-free SOCKET )

Max.Temperature Max Temperature

A: 250socket substrate B:230~250 (socket solder joint) C:230~250socket bottom Temp difference: Each point should15 Reflow ZoneOver 217 45~90 SEC Soaking Zone150~180 60~120 SECBiggest BGA bottom Zone150 180 60 120 Slope between 205~215: 0.35~0.75/second Average Ramp up 3/SECAverage Ramp down 3/SEC

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Profile Measurement Standards

Curve:

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Q&A