Cooling Key Chips Presentation

Power Thermal Solution Solutions Division
Cooling to keep your Key Chips Alive

Guy Diemunsch
Aavid Thermalloy
diemunsch.g@aavid.com
Agenda
From the Chip to the Fluid
The story of conductivity and heat density Technologies and Heat Transfer coefficients Automotive Constrains Solutions
Balancing Chips Temperatures

Mass Flow Rate or Latent Heat Solutions
Emergency situations
Can we store heat? Solutions
04 / 04 / 2011
Rev. 1.1 Guy Diemunsch

Straightforward point of view
In a car the only available cold source is the surrounding air P [W] = H [W/m C] S [m ]
Tsolid/Tfluid
[C]
The surface of the heat exchanger with surrounding air is mainly defined by the power to extract The volume of the heat exchanger is generating the pressure drop : smaller size => higher pressure drop!
04 / 04 / 2011

Conductivity & Heat density
Simple rules !
DCB Thermal Interface Heat Spreader Heat sink base CHIP
04 / 04 / 2011

Simple rules !
The heat is lazy, always searching the easiest way which is a combination of distance and resistance
04 / 04 / 2011

Simple rules !
Conductivity increases heat spreading Thickness increases heat spreading Heat density decreases
04 / 04 / 2011 Rev. 1.1 Guy Diemunsch 6

When the cold source is small:
DCB Thermal Interface Heat Spreader
Pipe or heat pipe
CHIP
Heat sink base
The heat density may remain stable or may increase!

Thermal Interfaces are more critical Heat Transfer Coefficient must increase
04 / 04 / 2011

Reducing Chip temperature &/or increasing
Tsolid/Tfluid
Temperature Power
spreader base chip Interface
fins air Interface
Power and temperature evolution from the chip to the fluid
04 / 04 / 2011

Reducing Chip temperature &/or increasing
Tsolid/Tfluid
Temperature Consequences: increase these Ts Power
Objective A: reduce chip temperature
Objective B: increase this T
peltier spreader base fins air chip Interface Interface Interface
Power and temperature evolution from the chip to the fluid with a Peltier Cell
04 / 04 / 2011

Technologies and Heat Transfer coefficients
From Electronics Cooling
04 / 04 / 2011
10

Technologies and Heat Transfer coefficients Flow
Air: natural convection Air: forced convection Air: jet impingement Water: natural convection Water: forced convection Water: jet impingement Boiling water
From Electronics Cooling 04 / 04 / 2011 Rev. 1.1 Guy Diemunsch
H (W/m .C)
5 30 20 200 200 900 30 300 300 - 8.000 8.000 - 50.000 2.000 - 100.000 Heat pipes Noisy! Thermo Syphon
11

Preliminary conclusion
It is often needed to spread the heat before moving it into a fluid
Some space is needed to allow this spreading => constrain on electronic design
Closer to the chip we are, less possibilities we have

Jet impingement and heat pipe become rapidly a must
04 / 04 / 2011
12

Automotive Constrains
Once again at the end we have to transfer the heat to the air => 2nd worst heat transfer coefficient: forced convection
Therefore all other solutions are only used to transfer the heat to the heat exchanger
The air is dirty => Clogging does not allow high density fins without maintenance In Hybrid vehicles the water might be hot => high density fins required (low T) dirty => high density fins in water may not be welcome (clogging)

Solutions:
Heat Pipe are the best solution to catch efficiently high heat density very close to the chip
04 / 04 / 2011
14

Drawback:
High constrains on the thermal interfaces (chip to evaporator block, evaporator block to Heat Pipe)
04 / 04 / 2011
15

Drawback:
High constrains on the thermal interfaces is improved by direct contact
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16

Limited distance between heat source and heat exchanger (< 1m) Start up difficult Need special heat pipe for low temperatures (< 0C)
04 / 04 / 2011
17

LCPs including offset fins are a lot more efficient than LCPs using pipes they allow heat spreading with high heat exchange surfaces
Risk of clogging

Direct jet impingement cooling overcomes the clogging constrains and is compatible with hot water
Component heat spreader
Nozzles
From Electronics Cooling
Less available surface Chip position constrains to make an efficient Jet impingement solution

The current water to air heat exchanger is quite perfect it has to be duplicated
From Schneider Electric

Agenda

04 / 04 / 2011
21

When we have multiple chips working together it is important, to balance loads an improve efficiency, that each kind of chip has the same temperature Because we use a mass flow to cool the ideal solution is that all components are // vs the flow
CHIP A1 CHIP B1 CHIP A2 CHIP B2
04 / 04 / 2011
22

However it often impossible to do! Management of the Mass flow rate (air or liquid)
CHIP A1 CHIP B1 CHIP A2 CHIP B2
P [J/s] = Hc [J/kg C] M [kg/s] M = P / Hc (0,5 or 1,5 or 3) (Hc: Heat Capacity)
[C]
04 / 04 / 2011
23

Latent Heat
When the phase change occurs the temperature is fixed and stable
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24

Solutions:
Latent heat: heat pipe (or hp loop, vapor chamber)
From Schneider Electric
04 / 04 / 2011
25

Solutions:
Jet impingement allows to recreate a // cooling
04 / 04 / 2011
26

Solutions:
Fin density variation (air)
Incompatible with low cost extrusions


Solutions:
Fin density variation (liquid)
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28
Agenda

04 / 04 / 2011
29
What is an emergency situation?
As soon as a component of the cooling chain fails we face an emergency situation
TIM Heat Transfer Heat exchange Air (forced)
Closer to the chip the failure is, higher the emergency is
04 / 04 / 2011
30
Can we store heat?
Yes, the two possible functions able to store heat might be:
TIM Heat Transfer Heat exchange Air (forced)
However it is theory:
the air is available, we just have to insure that it is always moving in most of the cases the components are designed to be fully loaded by heat and the system works as a serial assembly
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31
Solutions:
No TIM
Direct liquid/dual phase cooling
Mechanical high performance TIM

Mirror surface High pressure mechanical assemblies Welding, Soldering, Brazing
04 / 04 / 2011
32
Use liquid transfer designed with storage capacities
High volume of liquid Higher mass flow rate
Implement backup Heat Pipes
Anyway this will result with margin in Rth

Always allow natural convection and use as much as possible the movement of the car to generate backup forced convection
04 / 04 / 2011
33

Cooling Key Chips Presentation

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Power Thermal Solution Solutions Division

Cooling to keep your Key Chips Alive

Power Thermal Solution Solutions Division

Balancing Chips Temperatures

Rev. 1.1 Guy Diemunsch

From the Chip to the Fluid

Power Thermal Solution Solutions Division

Rev. 1.1 Guy Diemunsch

From the Chip to the Fluid

Power Thermal Solution Solutions Division

Rev. 1.1 Guy Diemunsch

From the Chip to the Fluid

Power Thermal Solution Solutions Division

Rev. 1.1 Guy Diemunsch

From the Chip to the Fluid

Power Thermal Solution Solutions Division

From the Chip to the Fluid

Power Thermal Solution Solutions Division

Heat sink base

The heat density may remain stable or may increase!

Rev. 1.1 Guy Diemunsch

From the Chip to the Fluid

Power Thermal Solution Solutions Division

spreader base chip Interface

fins air Interface

Power and temperature evolution from the chip to the fluid

Rev. 1.1 Guy Diemunsch

From the Chip to the Fluid

Power Thermal Solution Solutions Division

Objective A: reduce chip temperature

Objective B: increase this T

peltier spreader base fins air chip Interface Interface Interface

Rev. 1.1 Guy Diemunsch

From the Chip to the Fluid

Power Thermal Solution Solutions Division

From Electronics Cooling

Rev. 1.1 Guy Diemunsch

From the Chip to the Fluid

Power Thermal Solution Solutions Division

From the Chip to the Fluid

Power Thermal Solution Solutions Division

Closer to the chip we are, less possibilities we have

Rev. 1.1 Guy Diemunsch

From the Chip to the Fluid

Power Thermal Solution Solutions Division

From the Chip to the Fluid

Power Thermal Solution Solutions Division

Rev. 1.1 Guy Diemunsch

From the Chip to the Fluid

Power Thermal Solution Solutions Division

Rev. 1.1 Guy Diemunsch

From the Chip to the Fluid

Power Thermal Solution Solutions Division

Rev. 1.1 Guy Diemunsch

From the Chip to the Fluid

Power Thermal Solution Solutions Division

Rev. 1.1 Guy Diemunsch

From the Chip to the Fluid

Power Thermal Solution Solutions Division

From the Chip to the Fluid

Power Thermal Solution Solutions Division

Component heat spreader

From Electronics Cooling