Ke970 SVC Eng 070115

Service Manual
Service Manual
KE970
Model : KE970
Date: January, 2007 / Issue 1.0

REVISED HISTORY
Editor Date Issue Contents of Changes S/W Version
G.C. LIM 2006/03/29 0.1
* The information in this manual is subject to change without notice and should not be construed as a
commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes
to equipment design as advances in engineering and manufacturing methods warrant.
* This manual provides the information necessary to install, program, operate and maintain the KE970.
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Table Of Contents
1. INTRODUCTION ...............................7 5. Trouble shooting............................72
1.1 Purpose .................................................. 7 5.1 Trouble shooting test setup....................72
1.2 Regulatory Information............................ 7 5.2 Power on Trouble...................................72
1.3 ABBREVIATION ..................................... 9 5.3 Charging trouble ....................................76
5.4 LCD display trouble................................78
2. PERFORMANCE .............................11 5.5 Camera Trouble .....................................80
2.1 H/W Features.........................................11 5.6 Receiver & Speaker trouble ...................82
2.2 Technical specification...........................12 5.7 Microphone trouble ................................84
5.8 Vibrator trouble ......................................86
3. TECHNICAL BRIEF ........................17
5.9 Keypad back light trouble.......................88
3.1 KE970 Component Block diagram.........17 5.10 Micro SD and SIM card trouble............90
3.2 Baseband Processor (BBP) 5.11 RF PART TROUBLESHOOTING ........93
Introduction ............................................18
3.3 Power management IC ..........................30 6. Download & S/W upgrade...............108
3.4 Power ON/OFF ......................................35
6.1 S/W download setup ............................108
3.5 SIM interface..........................................37
6.2 Download program user guide.............109
3.6 Memory ..................................................38
3.7 LCD Display ...........................................39 7. CIRCUIT DIAGRAM ......................117
3.8 Keypad Switching & Scanning ...............40
3.9 Keypad back-light illumination ...............42 8. PCB LAYOUT ................................123
3.10 LCD back light illumination...................43
3.11 Battery current consumption monitor ...45 9. RF Calibration ..............................129
3.12 JTAG & ETM interface connector ........45 9.1 Test Equipment Setup .........................129
3.13 Audio....................................................46 9.2 Calibration Steps..................................129
3.14 Multi port switch ...................................48
10. Stand along ................................135
3.15 USB charging circuit ............................50
3.16 BLUETOOTH .......................................51 10.1 Test Program Setting .........................135
3.17 Micro SD external memory card slot.....55 10.2 Tx Test ...............................................137
3.18 18pin Multi Media Interface connector .57 10.3 Rx Test...............................................138
3.19 General Description .............................59 11. ENGINEERING MODE ................139
3.20 Receiver part........................................61
3.21 Transmitter part....................................62 12. EXPLODED VIEW &
3.22 RF synthesizer .....................................63 REPLACEMENT PART LIST ..... 141
3.23 TCXO ...................................................63
12.1 Exploded View .................................. 141
3.24 Front End Module control.....................64
12.2 Replacement Parts ............................146
3.25 Power Amplifier Module .......................64
12.3 Accessory ......................................... 159
4. PCB layout......................................65
4.1 Main & Sub PCB component
placement ..............................................65
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1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the KE970.
1.2. Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges you’re your telecommunications
services. System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users
are responsible for programming and configuring the equipment to prevent unauthorized use. LGE
does not warrant that this product is immune from the above case but will prevent unauthorized use of
common-carrier telecommunication service of facilities accessed through or connected to it. LGE will
not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the KE970 or compatibility with the network,
the telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the KE970 must be performed only at the LGE or its authorized agents.
The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
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1. INTRODUCTION
E. Notice of Radiated Emissions

The KE970 complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation

An KE970 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference
from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign.
Following information is ESD handling: Service personnel should ground themselves by using a wrist
strap when exchange system boards.
When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective
packages until these are used. When returning system boards or parts such as EEPROM to the
factory, use the protective package as described.
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1. INTRODUCTION
1.3 ABBREVIATION
For the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
CLA Cigar Lighter Adapter
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli-watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
LGE LG Electronics
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1. INTRODUCTION
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
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2. PERFORMANCE
2. PERFORMANCE
2.1 H/W Feature

Item Feature Comment
Standard Battery Li-ion, 800mAh
AVG TCVR Current 280mA PL5
Standby Current <2.7mA @PP9
Talk time 3hours (GSM TX Level 7)
Standby time 277 hours (Paging Period:9, RSSI: -85dBm)
Charging time 3 hours
RX Sensitivity GSM900 : -105dBm, DCS/PCS : -105dBm
GSM900: 32dBm (Level 5)

TX output power
DCS/PCS: 29dBm (Level 0)
GPRS compatibility Class 10
SIM card type 3V Small
Display 320 x 240 pixels, 2.2 inch wide, 265K color, TFT
Soft icons
Key Pad
Status Indicator 0 ~ 9, #, *, END/PWR, SEND, CLEAR Key
Side Key
Up/Down, AF/Camera double action key
ANT Built in antenna
EAR Phone Jack 18pin multi port Headset jack with Remote controller
PC Synchronization Yes
Speech coding EFR/FR/AMR
Data and Fax Yes
Vibrator Yes
Buzzer No
Voice Recoding Yes
C-Mic Yes
Receiver Yes
Travel Adapter Yes
Options Bluetooth hands-free kit, Data Kit
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2. PERFORMANCE
2.2 Technical specification
Item Description Specification

GSM900
TX: 890 + 0.2 x n MHz
RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )
EGSM
1 Frequency Band TX: 890 + 0.2 x (n-1024) MHz
RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )
DCS1800
TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)
RX: TX + 95 MHz
PCS1900
TX: 1850.2 + ( n-512 ) x 0.2 MHz (n = 512 ~ 810)
RX: TX + 80MHz
RMS < 5 degrees
2 Phase Error
Peak < 20 degrees
3 Frequency Error < 0.1ppm
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
4 Power Level 12 19 dBm 3dB
DCS1800/PCS1900
Level Power Toler. Level Power Toler.
2 26 dBm 3dB 10 10 dBm 4dB
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2. PERFORMANCE
GSM900/EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
Output RF Spectrum 6,000 -71
5
(due to modulation) DCS1800/PCS1900
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
GSM850
Offset from Carrier (kHz) Max. (dBm)
Output RF Spectrum 400 -19
6
(due to switching transient) 600 -21
1,200 -21
1,800 -24
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2. PERFORMANCE

DCS1800/PCS1900
Offset from Carrier (kHz). Max. (dBm)
Output RF Spectrum 400 -22
6
(due to switching transient) 600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
GSM850
BER (Class II) < 2.439% @-102dBm
8 Bit Error Ratio
DCS1800/PCS1900
BER (Class II) < 2.439% @-100dBm
9 Rx Level Report accuracy 3 dB
10 SLR 8 3 dB
11 Sending Response
12 RLR -15 3 dB
13 Receiving Response
* Mean that Adopt a straight line in between 300 Hz

and 1,000 Hz to be Max. level in the range.
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2. PERFORMANCE
14 STMR > 17 dB
15 Stability Margin > 40 dB
16 Idle Noise Sending < -64dB
17 Idle Noise Receiving < -47dB
18 Side tone Distortion Three stage distortion < 10%
<Change> System frequency
19 2.5ppm
(26 MHz) tolerance
20 <Change>32.768KHz tolerance 30ppm
Standby
21 Power consumption
- Normal 5.2mA(Mix. power)
GSM900/Lvl 7(Battery Capacity 800mA) : Min. 2.5 hr
22 Talk Time
GSM900/Lvl 12(Battery Capacity 800 mA) : Min. 3hr
Under conditions, at least Min. 250 hr
1. Brand new and full 800mAh battery
2. Full charge, no receive/send and keep GSM in idle mode.
23 Standby Time
3. Broadcast set off.
4. Signal strength display set at 3 level above.
5. Backlight of phone set off.
At least 65 dB under below conditions:
24 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
Fast Charge : < 450 mA
25 Charge Voltage
Slow Charge: < 55mA
Antenna Bar Number Power
5 -85 dBm ~
4 -90 dBm ~ -86 dBm
26 Antenna Display 3 -95 dBm ~ -91 dBm
2 -100 dBm ~ -96 dBm
1 -105 dBm ~ -101 dBm
0 ~ -105 dBm
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2. PERFORMANCE
Battery Bar Number Voltage( 0.05V)

4 3.86V~4.2V
27 Battery Indicator 3 3.75V~3.85V
2 3.75V~3.69V
1 3.69V~3.62V
0 3.62V~
3.62V↓ 0.05V (Call)
28 Low Voltage Warning
3.50V↓ 0.05V (Standby)
29 Forced shut down Voltage 3.35 0.05 V
1 Li-ion Battery
Standard Voltage = 3.7 V
30 Battery Type
Battery full charge voltage = 4.2 V
Capacity: 800mAh
Switching-mode charger
31 Travel Charger Input: 100 ~ 240 V, 50/60Hz
Out put: 4.8, 0.9A
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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1. KE970 Component Block diagram.
Figure 1. KE970 Hardware architecture
KE970 is composed with 3 different PCB part such as main PCB, keypad FPCB and slide FPCB.
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3. TECHNICAL BRIEF
3.2. Baseband Processor (BBP) Introduction
Figure 2. Top level block diagram of the S-GOLD2TM (PMB8876)
3.2.1 General Description

S-GOLD2TM is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital
functionality of a cellular radio. Additionally S-GOLD2TM Provides multimedia extensions such as
camera, software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital and
mixed signal portions of the base band in 0.13um, 1.5V technology. The chip will fully support the FR,
EFR, HR and AMR-NB vocoding. S-GOLD2TM support multi-slot operation modes HSCSD (up to class
10), GPRS for high speed data application (up to class 12) and EGPRS (up to class 12) without
additional external hardware.
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3. TECHNICAL BRIEF
3.2.2. Block Description

• Processing core
ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,
and the Jazelle Java extension for Java acceleration.
- TEAKLite DSP core
• ARM-Memory
- 32k Byte Boot ROM on the AHB
- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 16k Byte Cache for Program (internal)
- 8k Byte tightly coupled memory for Program(internal)
- 8k Byte Cache for Data(internal)
- 8k Byte tightly coupled memory for Data(internal)
• DSP-Memory
- 104K x 16bit Program ROM
- 8k x 16bit Program RAM
- 60k x 16bit Data ROM
- 37k x 16bit Data RAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit
• Shared Memory Block
1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.
• Controller Bus system
The processor cores and their peripherals are connected by powerful buses. Multi-layer AHB for
connecting the ARM and the other master capable building blocks with the internal and external
memories and with the peripheral buses.
• Clock system
The clock system allows widely independent selection of frequencies for the essential parts of the
S-GOLD2. Thus power consumption and performance can be optimized for each application.
• Functional Hardware block
- CPU and DSP Timers
- MOVE coprocessor performing motion estimation for video encoding algorithms
(H.263, MPEG-4)
- Programmable PLL with additional phase shifters for system clock generation
- GSM Timer Module that off-loads the CPU from radio channel timing
- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)
- GMSK Modulator: gauss-filter with B*T=0.3
- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter
- Hardware accelerators for equalizer and channel decoding.
- Incremental Redundancy memory for EDGE class 12 support
- A5/1, A5/2, A5/3 Cipher unit
- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission
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3. TECHNICAL BRIEF
- Advanced static and dynamic power management features including TDMA-Frame synchronous
low power mode and enhanced CPU modes(idle and sleep modes)
- Pulse Number Modulation output for Automatic Frequency Correction(AFC)
- Serial RF Control interface: support of direct conversion RF
- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI)
serial data transmission
- 1 Serial Synchronous SPI compatible interfaces in the controller domain
- 1 Serial Synchronous SPI compatible interface in the TEAKLite domain
- 2 USART with autobaud detection, hardware flow control and integrated IrDA controller
supporting IrDA’s SIR standard (up to 115.2Kbps)
- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards (up to 4Mbps)
- I2C-bus interface (e.g. connection to S/M power)
- A fast display interface supporting serial and parallel interconnection
- An ITU-R BT.656 compatible Camera interface.
- Programmable clock output for a camera
- An multimedia/Secure Digital Card Interface (MMCI/SD:SDIO capable)
3.2.3. External Devices connected to memory interface

Table 1 Memory interface
Device Name Maker Remark

FLASH PF38F5060M0Y0B0 Intel Synchronous / A synchronous
SDRAM PF38F5060M0Y0B0 Intel Synchronous 104MHz
LCD IL220DBN1A LGIT 8bit access 3times transmission
Melody IC Not Used S/W Infineon Software CODEC
3.2.4. RF Interface (T_OUT)

S-Gold2 uses this interface to control RF IC and Peripherals. 13 signals are provided switch on/off RF
ICs Periodically each TDMA frame.
Table 2 RF Interface Spec.
T_OUT
Resource Interconnection Description
T_OUT0 TXON_PA PAM Power on
T_OUT1 VIBRATOR_EN VBRATOR ON-
T_OUT2 PA_BAND TX RF band select
T_OUT3 ANT_SW1 FEM control
T_OUT6 MODE PAM Mode select
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3. TECHNICAL BRIEF
3.2.5. USART Interface

KE970 have two UART Drivers as follow :
- USART1 : Hardware Flow Control / SW upgrade / Calibration
- USART2 : SW debug trace.
Table 3 USART Interface Spec.
USART_0(USART1)
Resource Name Remark
USART0_TXD TXD_0 Transmit Data
USART0_RXD RXD_0 Receive Data
USART0_CTS CTS_0 Clear To Send
USART0_RTS RTS_0 Request To Send
DSR N.C.
USART_1(USART2)
USART1_TXD TX_DEBUG Trace data tx
USART1_RXD RX_DEBUG Trace data rx
USART1_CTS N.C. N.C.
USART1_RTS N.C. N.C.
3.2.6. ADC channel

BBP ADC block is composed of 7 external ADC channel . This block operates charging process and
other related process by reading battery voltage and other analog values.
Table 4 S-Gold2 ADC channel usage
ADC channel
Resource Interconnection Description
M0 BATT_TEMP Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2 JACK_TYPE Accessory type detect
M7 H/W VERSION S-Gold2 H/W version detect
M8 VSUPPLY Battery supply voltage measure
M9 I_MONITOR Current consumption measure
M10 REMOTE_ADC Remote control key detect
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3. TECHNICAL BRIEF
3.2.7. GPIO map

Over a hundred allowable resources, KE970 is using as follows except dedicated to SIM and Memory.
KE970 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level,
is shown in below table.
Table 5 S-Gold2 GPIO pin Map
Port function KE260 Net Name Description

KEY MATRIX
KP_IN0 KP_IN0 Refer to Key Matrix
KP_OUT5 KP_OUT5 Refer to Key Matrix
USART_0
USART0_RXD RXD_0 UARTO, RS232 Data
USART0_TXD TXD_0 UARTO, RS232 Data
USART0_RTS_N CTS_0 UARTO, RS232 RTS
USART0_CTS_N RTS_0 UARTO, RS232 CTS
CC1CC6IO FM_INT For FM Radio Interrupt
USART_1
USART1_RXD TX_DEBUG For debugging
USART1_TXD RX_DEBUG For debugging
USART1_RTS_N Not Use
USART1_CTS_N Not Use
USB
USB_DPLUS USB_DP USB data
USB_DMINUS USB_DM USB data
- 22 -
3. TECHNICAL BRIEF
MEMORY &CLK
GPIO_20 F_DPD For INTEL Memory
CLK32K CLK32K For FM Radio & BLUETOOTH
GPIO_22 Not Use
CAMERA I/F
CIF_D0 CIF_D(0) Camera DATA[0]
CIF_PCLK CIF_PCLK Camera pixel clock
CIF_HSYNC CIF_HS Camera H sync
CIF_VSYNC CIF_VS Camera V sync
CLKOUT CIF_MCLK Camera main clock
CIF_PD CIF_PD Camera power down(active high)
CIF_RESET CIF_RESET Camera reset
LCD IF/
DIF_D0 DIF_D(0) LCD data[0]
DIF_CS1 DIF_CS LCD chip select
Audio amp inuput select(High:
GPIO_96 FM_BBP_SEL
FM sound, Low: BBP sound)
DIF_CD DIF_CD Command Data switch
DIF_WR MM_WR LCD Write
DIF_RD MM_RD LCD Read
- 23 -
3. TECHNICAL BRIEF
GPIO_99 _USB_CHG_EN USB charging (High: charge disable, Low: enable)

DIF_VD (in) _TF_PWR_EN Trans-Flash card power enable(active low)
DIF_RESET1_GPIO DIF_RESET1 LCD Reset
EINT6 REMOTE_INT For Remote Control Headset
I2c
I2C_SCL SCL For SM-Power, FM Radio, Audio AMP
I2C_SDA SDA "
PM_INT (EINT) PM_INT SM-Power interrupt
SIM CARD
CC_IO SIM_IO SIM CARD I/O
CC_CLK SIM_CLK SIM CARD CLOCK
CC_RST SIM_RST SIM CARD RESET
I2S
I2S2_CLK0 Not Use
GPIO_102 _WP Not Connected
I2S2_RX Not Use
I2S2_TX Not Use
I2S2_WA0 Not Use
I2S2_WA1 Not Use
EXTERNAL MEMORY
MMCI_CMD TF_CMD For T-Flash
MMCI_DAT[0] TF_DAT0 "
MMCI_CLK TF_CLK "
BT I/F
USIF_TXD_MTSR USIF_TXD For Bluetooth
USIF_RXD_MRST USIF_RXD "
USB End of charging detect(High:
GPIO_109 _USB_EOC
EOC, Low: charging)
Remote power on detect (High:

GPIO_110 RPWRON
Remote , Low: Normal
Audio pass select( high:
GPIO_111 SPK_RCV_SEL
Speaker, Low: Receiver)
I2S
I2S1_CLK0 I2S1_CLK For Bluetooth
GPTU0_0 FLASH_EN For Camera Flash LED
- 24 -
3. TECHNICAL BRIEF
I2S1_RX I2S1_RX For Bluetooth

I2S1_TX I2S1_TX "
I2S1_WA0 I2S1_WA0 "
MMC
MMCI_DAT[1] TF_DAT1 For T-Flash
AUDIO I/F
EPN1 RCV_N For Receiver
EPP1 RCV_P "
EPPA1 BBP_SND_L For Speaker
EPPA2 BBP_SND_R For Speaker
MICN1 MIC1_N For Mic
MICP1 MIC1_P "
MICN2 MIC2_N For Headset Mic
MICP2 MIC2_P "
VMICP VMICP For Mic
VMICN VMICN "
RF I/F
PAOUT1
PAOUT2
BB_I
BB_IX
BB_Q
BB_QX
ADC
M_0 BAT_TEMP Battery temperature detect
RF Power amp reference temperature
M_1 RF_TEMP detect
M_2 JACK_TYPE For 18Pin Cable Type Detect
M_7 HW revision indication
M_8 Battery voltage measurement
M_9 I_MONITOR Current consumption measurement
For Remote Control Headset Key detect
M_10 REMOTE_ADC with REMOTE_INT
Reference
VREF
IREF
JTAG
TDO TDO For JTAG & ETM Interface
TDI TDI "
TMS TMS "
TCK TCK "
TRST_n TRSTn "
RTCK RTCK "
- 25 -
3. TECHNICAL BRIEF
ETM
TRIG_IN TRIG_IN "
MON1 MON1 "
MON2 MON2 "
TRACESYNC TRACESYNC "
TRACECLK TRACECLK "
PIPESTAT[2] PIPESTAT[2] "
TRACEPKT[0] TRACEPKT[0] "
Memory
EBU_AD[0] D(0) Data bus[0]
EBU_WR_n _WR Write strobe
- 26 -
3. TECHNICAL BRIEF
EBU_RD_n _RD Read strobe

EBU_BC0_n _BC0
EBU_BC1_n _BC1
EBU_A[0] A(0) Address bus[0]
EBU_CS0_n _FLASH1_CS Flash ROM chip select
EBU_CS1_n _RAM_CS SDRAM Chip select
EBU_CS2_n _FLASH2_CS Not used
EBU_CS3_n _CS3 Not used
EBU_ADV_n _ADV
EBU_RAS_n _RAS
EBU_CAS_n _CAS
- 27 -
3. TECHNICAL BRIEF
EBU_WAIT_n _WAIT
EBU_SDCLKO SDCLKO
EBU_SDCLKI SDCLKI
EBU_BFCLKO BFCLKO
EBU_BFCLKI BFCLKI
EBU_CKE CKE
Memory
FCDP_RBn F_DPD
TDMA RF I/F
T_OUT0 TXON_PA RF Power amp turn on
GPIO_44 VIBRATOR_EN Vibrator enable(High: enable, Low:disable)
T_OUT2 PA_BAND RF band select
T_OUT3 ANT_SW1 RF FEM control signal 1
T_OUT4 ANT_SW2 RF FEM control signal 2
EINT3 ANT_SW3 RF FEM control signal 3
T_OUT6 MODE For RF
GPIO_50 KP_OUT(4) Key pad
EINT7 JACK_DETECT Headset Detect(High: unplugged, Low: plugged)
CC1CC3IO LCD BACKLIGHT LCD Backlight Control
GPIO_53 LCD ID Neodis : L
GPIO_54 _FM_RESET FM Radio chip reset
GPIO_55 AU_PWR_EN Audio amp power enable( active high)
RF I/F
RF_STR0 EN RF Transceiver chip enable
Micro SD card detect (High:
GPIO_57 TF_DETECT
inserted, Low: ejected)
RF_DATA DA RF Transceiver chip data
RF_CLK CLK RF Transceiver chip clock
System port
Automatic Frequency control DAC
AFC AFC
output for 26MHz VCTCXO
CLKOUT0 [<=26MHz] Not Use
Baseband processor PLL
F26M 26MHZ_MCLK
input Main clock
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3. TECHNICAL BRIEF
F32K Sleep crystal 32.768KHz

OSC32K Sleep crystal 32.768KHz
RESET_n _RESET Baseband processor reset
CC1CC1IO TRIG_OUT For JTAG & ETM Interface
Wake up signal to alarm (High;
RTC_OUT RTC_OUT
wake up, Low: Power off)
VCXO_EN VCXO_EN 26MHz clock enable
DSP
DSPIN0 _BT_RESET Bluetooth chip reset
GPIO_62 MIC_GAIN_SEL Microphone gain select (High: 12dB, Low: 0dB)
GPIO_63 _SIM_EN SIM card power enable
- 29 -
3. TECHNICAL BRIEF
3.3. Power management IC
3.3.1. General Description

SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has
been specially designed for usage with S-Gold2. Although optimized for usage with the Infineon S-
GOLD baseband device it is suitable for the S-GOLDlite and the E-GOLD+ baseband devices as
well. It also supports the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the
Bluemoon Single, Infineon’s single chip solution for Bluetooth. If used with S-GOLD2 it provides all
power supply functions (except for the RF PA) for a complete advanced GSM Edge smart phone
minimizing external device count.
Block Description
• Highly efficient step-down converter for main digital baseband supply including Core, DSP and
memory interface (External Bus Unit).
• Support of S-GOLD standby power-down concept
• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices
• Voltage independent switching of two SIM cards
• LDO regulators for baseband I/O supply
• LDO regulator for analog mixed-signal section of S-GOLD
• Low-noise LDO regulators for RF devices
• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth
• Audio amplifier 8 Ohms for handsfree operation and ringing
• Charge Control for charging Li-Ion/Polymer batteries under software control
• Pre-charge current generator with selectable current level
• RTC regulator with ultra-low quiescent current
• USB interface support for peripheral and mini-host mode
• Backlight LEDs driver with current selection and PWM dimming function
• Two single LED driver outputs for signaling
• Vibrator driver with adjustable voltage
• Fully controlable by software via I2C - Bus
• Temperature and battery voltage sensors
• Interrupt channels for peripherals
• System debug mode
• VQFN 48 package with heat sink and non-protruding leads
• Compatible with the Infineon E-GOLD+ V2 and V3
- 30 -
3. TECHNICAL BRIEF
Figure 3 Top level block diagram of the SM-Power(PMB6812)
SM-POWER is a further step on the successful E-Power product line with enhanced and optimized
functionality. SM-POWER features a baseband supply concept with a DC/DC step-down converter
(SDBB) cascaded by two linear regulators (LBB1/2)
- SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone
functions (e.g. organizer functions, games, MP3 decoding) possible.
- SDBB has high efficiency up to 95% and also a power save mode.
- Memory Interface is directly supported by the SDBB
- SDBB can also act as main supply voltage for E-GOLD+ or S-GOLDlite baseband devices.
- For S-GOLD two linear regulators for DSP and Core are cascaded after the SDBB.
- 31 -
3. TECHNICAL BRIEF
SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the
linear regulator LBB1 for the DSP during mobile standby whenever this subsystem is not used. In this
phase the ARM controller and most peripherals including parts of the on-chip SRAM are kept
powered-up with power being supplied by the other linear regulator LBB2.
SM-POWER includes a fully differential audio amplifier able to drive loads down to a nominal value of
8 Ohm for usage in hands-free phones and for ringing
- 400 mW maximum output power
- adjustable gain
- mute switch
- click and pop - protection
SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries
- Precharge current source with two current levels
- Constant current / constant voltage charging with 3 different termination voltages
- Programable charge current limitation for use with different batteries
- Freely programable pulse charging to reduce the thermal power dissipation in the constant voltage
charging phase
- Top-off charge current sensing
SM-POWER completes the USB interface of S-GOLD
- Regulated voltage for S-GOLD USB interface including reverse current and overvoltage protection
- Switch to supply USB pull-up resistor
- Mini-host pull down resistor functionality
- Charge pump with internal switching capacitor for USB host VBUS supply voltage
SM-POWER fully supports LED and Vibra Motor functionality
- no external components needed
- driver for backlight LEDs adjustable in steps up to 140mA and with soft turn on and off by PWM
dimming
- two driver outputs for single LEDs for precharge indication and signaling with i.e. change of colour
- driver for Vibra Motor with adjustable voltages, soft startup / shutdown and current limitation
SM-POWER offers several control functions
- Power-on Reset Generator with logic state machine
- I2C bus interface
- I2C bus configurable mode control logic with ON (push-button or RTC), VCXOEN and LRF3EN
(wake-up by Bluetooth) inputs
- Programable interrupt channels to handle peripherals like SIM, MMC and USB
- Monitoring of charging functions
- Undervoltage Shut-Down
- Errorflags (volatile or non-volatile) from many power-supply functions and thermal sensor in order
to debug system
- Overtemperature Shut-Down
- Overtemperature Warning
- Support of S-GOLD standby power-down concept
- Support of S-GOLD Power-Down Pad Tristate Function
- 32 -
3. TECHNICAL BRIEF
Table 6 LDO Output Table of SM-Power
LDO Net name Output Voltage Output Current Usage

SDBB 1V8_MEM 1.8V 850mA Memory & for LDO
LRFC 1V5_RF 1.5V 120mA RF transceiver
LBB1 1V5_DSP 1.5V 170mA DSP in BBP
LBB2 1V5_CORE 1.5V 300mA ARM core in BBP
LINT 2V72_IO 2.72V 135mA Peripherals
LSIM 2V85_SIM 2.85V 22mA SIM card
LSIM2 2V85_IO2 2.85V 200mA Peripherals
LMMC 2V85_CARD 2.85V 135mA SD card
LANA 2V65_ANA 2.65V 220mA Analog block in BBP
LRTC 2V11_RTC 2.11V 0.3mA RTC block & Backup battery
LRF1 2V85_RF 2.85V 250mA RF IC
LRF2 2V7_RF 2.7V 10mA RF IC
LRF3 2V65_BT 2.65V 150mA BT IC(Blue moon)
LUSB 3V1_USB 3.1V 45mA USB I/F
Figure 4 Power domain block diagram of KE970
- 33 -
3. TECHNICAL BRIEF
PMIC & Li-ion CHARGER

VCHG 2V11_RTC 1V5_CORE 1V5_DSP 2V85_RF VBAT 2V7_VCXO 2V65_BT
C205 C206 C207 C208

0.1u 0.1u 0.1u 0.1u
R204 R205
RTC_OUT PWRON VBACKUP
220K 22K
R207
470K
SPOWER_INT
VCH_CTL
_PMRST C215 C216 C217 C218 C219 C220 C221
VBAT
2.2u 2.2u 2.2u 2.2u 2.2u 2.2u 2.2u
(1608) (1608) (1608) (1608)
1V8_MEM 3V1_USB 1V5_RF VBAT
49
48
47
46
45
44
43
42
41
40
39
38
37
2V65_ANA VBAT
GND
RESETQ
VLBB2
VDDC
VLBB1
VCHC
VDDCH
VRTC
INTOUT
VRF1
VDDRF
VRF2
VRF3
FB201
1 36
VCHS VCHS VCXOEN VCXO_EN
2 35
VBATS VDDA
3 34
VRFC VANA
4 33
PWRON ON VSSR
5
6
VDDPW U203 IREF
32
31 R210 82K
C223
2.2u
C224
2.2u
SW BYP
L201 10uH 7 30 C222 0.1u
8
VSSPW
VSSFB
PMB6812 VDDAU
AUOP
29
(1608)
9 28
FB AUON
10 27
USB_PU VUPU VSSAU
11 26
VUSB AUIP
12 25 VCHG
VBUS_USB VBUS LRF3EN AUIN
SLED2
SLED1
VMMC
VSIM1
VSIM2
VDDB
VINT
SDA
LED
SCL
VIB
13
14
15
16
17
18
19
20
21
22
23
24
Q201
C225 C226 C229 C227 C230 C231 SI3457BDV S
C235
C228 C232 C233 C234 R211
2.2u 2.2u 10u 10u 10u 10u 2.2u 2.2u 0.1u 2.2u G
4.7u
VCH_CTL 100K
connecto GND to PIN7 / PIN8 (1608)
KEY_BACKLIGHT
BT_VCXO_EN
SLED1
SCL
SDA
D1 D2 D3 D4
2V72_IO 2V85_CARD 2V85_IO2 2V85_SIM VBAT
D201
SDB1040
VCHS
VBAT
R221
0.15
C241 C242 C243 C244 C245
2.2u 2.2u 2.2u 2.2u 2.2u
(1608) C240
68u
Figure 5 SM-Power circuit diagram with charging part
3.3.2. Charging
SM-POWER provides together with an external p-channel FET Siliconix Si3455 an external AC-
adapter a complete charge control function for charging of Li-Ion or Li-Ion-Polymer batteries. Either
a 1-cell Li-Ion or Li-Ion-Polymer battery with 4.1, 4.2 or 4.4 Volts may be used.
4.2V~3.86V 3.85V~3.75V 3.75V~3.69V 3.69V~3.62V
Figure 6 Battery Block Indication
1. Charging method : CC-CV

2. Charger detect voltage : 4.0V
3. Charging time : 3h
4. Charging current : 500mA
5. CV voltage : 4.2V
6. Cutoff current : 100mA
7. Full charge indication current (icon stop current) : 100mA
- 34 -
3. TECHNICAL BRIEF
8. Recharge voltage : 4.00V

9. Low battery alarm
a. Idle : 3.50V~3.35V
b. Dedicated : 3.59V~3.35V
10. Low battery alarm interval
a. Idle : 3min
b. Dedicated:1min
11. Switch-off voltage : 3.35V
12. Charging temperature adc range
a. ~ -5˚C : low charging voltage operation (3.6V ~ 3.9V) .
b. -5˚C ~ 50˚C : standard charging (up to 4.2 V)
c. 50˚C ~ : low charging voltage operation (3.6V ~ 3.9V)
3.4. Power ON/OFF

KE970 Power State : Defined 3cases as follow
] Power-ON : Power key detect ( SM-Power’s ON port
] Power-ON-charging : Charger detect.
] Power-ON-remote : remote power on detect (Factory use only)
Figure 7 Power on application.
- 35 -
3. TECHNICAL BRIEF
Input ON is a power-on input for SM-POWER with 2 active high levels (see Figure 8). It might be
triggered by a push button or by the RTCOUT output of the S-GOLD device as well. To detect if the
push-button is pressed during system operation the logical level at pin ON or its change (if Bit 1 EION
in INTCTRL2 is asserted) is recorded in bit LON of the ISF register. If the high level of voltage at pin
ON does not reach VIHdet (Vbat-0.8 ~ Vbat-0.3) the above-mentioned bit won’t be set.
To support Remote power on function for factory mass production, applied an analog switch as
following figure. As monitoring the RPWRON(GPIO_110) and Key matrix KP_OUT(1) & KP_IN(5),
KE970 system recognize whether remote power on or End-key pushed
VBAT
U305 NLAST4599DFT2G
2
VCC
C326
0.1u
6 NO
COM 5
PWRON
4 NC
END_KEY
GND
IN
3
RPWRON
R329
100K
KP_OUT(1)
1
Q301 R311 10K
END_KEY
2SC5585 2
3 R310
KP_IN(5) 100K
END KEY VBAT

ON/END
END_KEY
END
Figure8 Remote power on and End-key power on circuit
- 36 -
3. TECHNICAL BRIEF
3.5. SIM interface

KE970 supports 3V plug in SIM, SIM interface scheme is shown in (Figure 10).
SIM_IO, SIM_CLK, SIM_RST ports are used to communicate with BBP(S-Gold2) and the SIM power
supply enabled by BBP (_SIM_EN).
SIM Interface
SIM_CLK : SIM card reference clock
SIM_RST : SIM card Async /sync reset
SIM_IO : SIM card bidirectional reset
_SIM_EN
SIM_RST
SIM_CLK
SIM_IO
2V85_CARD 2V72_IO C236 C237

Q203 27p NA 2V85_SIM
1 S1 D1 6
R212 100K
G
2 G1 G2 5
TF_PWR_EN R213
3 D2 S2 4 R214
100K 4.7K
S
NTJD4105CT1G
C238 Q202
C239 1u SI1305-E3
27p
R215 R216 R217 R218 R219
C7
C3
C6
C2
C5
C1
100K 100K 100K 100K 100K

C7
C3
C6
C2
C5
C1
1
TF_DAT2 1
2
TF_DAT3 2
3
TF_CMD 3
4 16
4 CN202 GND1
5 15
TF_CLK 5 GND2
6 14
6 GND3
7 13
TF_DAT0 7 GND4
8 12
TF_DAT1 8 GND5
11
GND6
R223 47 9
TF_DETECT SWB
10
SWA
C250 C251 C252
1000p 22p 1uF
Figure 9 SIM CARD Interface
- 37 -
3. TECHNICAL BRIEF
3.6. Memory
512Mbit Flash & 256Mbit SDRAM employed on KE970 with 16 bit parallel data bus thru ADD(0) ~
ADD(24). The 512Mbit Sibley Wireless Flash memory with LPSDRAM stacked device family offers
multiple high-performance solutions. The Sibley flash die is manufactured on 90 nm process
technology.
It delivers 108 MHz synchronous burst and page-mode read rates with supports multi-partitioning with
Read-While-Write (RWW) or Read-While-Erase (RWE) dual operations. The LPSDRAM is a high-
performance volatile memory operating at speeds up to 104 MHz with configurable burst lengths.
A(0:24) U101 PF38F6070M0Y0BE D(0:15)

A(0) D1 M2 D(0)
A0 DQ0
A(1) C1 L1 D(1)
A1 DQ1
A(2) B1 K1 D(2)
A2 DQ2
A(3) B2 L2 D(3)
A3 DQ3
A(4) A2 M4 D(4)
A4 DQ4
A(5) B3 L3 D(5)
A5 DQ5
A(6) A3 L4 D(6)
A6 DQ6
A(7) A4 L5 D(7)
A7 DQ7
A(8) G8 M5 D(8)
A8 DQ8
A(9) F8 L6 D(9)
A9 DQ9
A(10) E8 M6 D(10)
A10 DQ10
A(11) G9 L7 D(11)
A11 DQ11
A(12) F9 L8 D(12)
A12 DQ12
A(13) E9 K9 D(13)
A13 DQ13
A(14) D9 L9 D(14)
A14 DQ14
A(15) C9 M8 D(15)
A15 DQ15
A(16) B9
A16 _1G_CS
A(17) B4 D5 R106 0 1 TP102
A17 _ADV _ADV
A(18) B5 G3
A18 F1__CE _FLASH1_CS
A(19) A5
A19 F2__CE
G2 R107 NA 2 _FLASH2_CS
A(20) F7 H3 R108 NA 3
A20 F3__CE
A(21) E7 E6
A21 F4__CE_A27 BFCLKI
A(22) B7 K5 R109 24
A22 F_CLK BFCLKO
A(23) A6 J5
A23 D_CLK SDCLKO
1V8_MEM A(24) A7 H5
A24 D__CLK SDCLKI
A8 H7 R110 24
_FLASH1_CS A25 _OE _RD
R111 0 4 B8
A26 F__RST
G7 TP103
_RESET
J9 R112 10K
F_WAIT _WAIT
J1 E2 1V8_MEM
F_VPP _WE _WR
H6 TP105
D__WE
D4 E1
C125 C126 F1_VCC1 F__WP1
J4 F1 R113
$V 1K
0.1u 0.1u F1_VCC2 F__WP2
D6 B6 R114 1K
F2_VCC1 F_DPD F_DPD
J6 E5 TP106
F2_VCC2 N_CLE
D8
N_ALE R115
C5
D_VCC1 100K
D3 H1
D_VCC2 N_RY__BY
D7
D_VCC3
G6
C127 C128 D_CKE CKE
D2 G4 TP108 A(13)
0.1u 0.1u S_VCC D_BA0
H4 TP109 A(14)
D_BA1
J2 F4 TP110
VCCQ1 D__RAS _RAS
J3 F3 TP111
VCCQ2 D__CAS _CAS
J7 F2 TP112
VCCQ3 D1__CS _RAM_CS
J8 E3
VCCQ4 D2__CS
H9
D_DM0_S__LB _BC0
C2 H8
C129 C130 VSS1 D_DM1_S__UB _BC1
C3 M7
0.1u 0.1u VSS2 D_UDQS
C4 M3
VSS3 D_LDQS
C6 F6
VSS4 N__RE_S__CS1
C7 H2
VSS5 N__WE_S_CS2
C8
VSS6
K2
VSS7
K3 A1
VSS8 DU1
K4 A9
VSS9 DU2
K6 M1
VSS10 DU3
K7 M9
VSS11 DU4
K8 G1
VSS12 RFU
Figure 10 Flash memory & SDRAM MCP circuit diagram
- 38 -
3. TECHNICAL BRIEF
3.7. LCD Display

LCD module include:
- LCD : 320*240 265K Color TFT LCD
- Backlight : 5 piece of white LED illumination
LCD module is connected to main board thru 35 pins connector.
LCD FPC Interface Spec:
Table 7 LCD FPC Interface Spec.
Pin No. Pin Name I/O Description
1 VCC(2.8V) Power LCD power supply
2 VDDIO(2.8V) Power LCD power supply
3 GND Power LCD power supply
4 MAKER_ID O LCD maker Identification
5 D0 I/O Data[0] for LCD
21 GND - Ground
22 /RESET I Reset
23 /WR I Write strobe
24 /RD I Read strobe
25 /CS I LCD chip select
26 RS I Command / Data switch
27 IFMODE I 8bit / 16bit switch
28 GND - Ground
29 VSYNC_OUT I NA
30 MLED_Cathod5 O Back light LED Cathode
35 MLED_Anode I Back light LED Anode
- 39 -
3. TECHNICAL BRIEF
3.8. Keypad Switching & Scanning

The keypad interface is a peripheral which can be used for scanning keypads up to 6 rows (outputs
from Port Control Logic) and 6 columns (inputs to PCL). The number of rows and columns depend on
settings of the PCL.
KB_SND
KP_IN(0:5) MENU OK SERCH
KP_IN(0)
501 502 503 KB_CLR
KP_IN(1)
504 505 506 KB_UP
KP_IN(2)
507 508 509 KB_DOWN
KP_IN(3)
KB_STAR 510 KB_SHA KB_BGM
KP_IN(4)
AF
KB_CAM
LEFT END RIGHT SHUTTER
KP_IN(5)
KP_OUT(0:4)
SIDE KEY
KP_OUT(0)
KP_OUT(1)
KP_OUT(2)
KP_OUT(3)
KP_OUT(4)
Figure 11 KEY FPCB part numeric key matrix
HALL_EN
SCROLL_KEY_A SCROLL_KEY_B
4
U601 U602
OUT
PDN
OUT
PDN
EM-0611 EM-0611
V_SCROLL_2.8
VDD
VDD
VSS
VSS
1
- 40 -
3. TECHNICAL BRIEF
601 602 603
MENU OK SERCH
KP_IN(0)
604 605
LEFT RIGHT
KP_IN(5)
KP_OUT(0)
KP_OUT(1)
KP_OUT(2)
VA601 VA602
ICVL0505600V150FR ICVL0505600V150FR
Figure 12 LCD PCB part Navi & Scroll key matrix
Most of numeric keys are located on the Keypad FPCB, Scroll key for menu navigation is on the LCD
FPCB, and Power on (End key), BGM hot key, Camera shutter and volume up & down keys are
connected via 70pin board to board connector between main PCB and Keypad FPCB.
- 41 -
3. TECHNICAL BRIEF
3.9. Keypad back-light illumination

There are 2 snow white color LEDs on the KEY FPCB for keypad illumination. Keypad Back-light is
controlled by SM-Power LED port which has constant current control function.
The whole configuration of the SM-POWER LED drivers is shown in below Figure16.
Figure 13 Keypad Back-light LEDs
VBAT
LD501 LEWWS44-E
KEY_BACKLIGHT
R501 100ohm
R502 100ohm
LD502 LEWWS44-E
change to LEWWS44
Figure 14 Keypad Back-light LEDs
- 42 -
3. TECHNICAL BRIEF
3.10. LCD back light illumination

The MAX8645Y charge pump drives up to 6 white LEDs in the main display for backlighting and up to
2 white LEDs for flash, all with regulated constant current for uniform intensity. By utilizing adaptive
1x/1.5x/2x charge pump modes and very-low-dropout current regulators, it achieves high efficiency
over the 1-cell lithium-battery input voltage range. 1MHz fixed-frequency switching allows for tiny
external components and low input ripple. Two on-board 200mA programmable output voltage LDOs
are provided to meet camera module requirements.
VBAT
U501 MAX8645Y
1 23
PIN C1P
2 C511
IN
C509
10u 22 1u
C1N
3 26
GND C2P V_SCROLL_2.8
24 C514
PGND
29
BGND
27 1u
C2N
25
OUT MLED_A
20
LCD_BACKLIGHT ENM1
19
ENM2
21 16
FLASH_EN ENF M1 MLED_C1
18 15
SCROLL_EN ENLDO M2 MLED_C2
28 14
P1 M3 MLED_C3
17 13
P2 M4 MLED_C4
12
M5 MLED_C5
11
M6
8 10
SETM F1 FLASH_LED_C
M1 = 18.4mA 9
F2
7
MSMF05C-P
D501
SETF VA503
F1 = 160mA 4
LDO1
6 5
REFBP LDO2
R512 R513 C515 C516 C517
7500ohm 5.1K 0.01u 1u 10u
Figure 15 LCD Back light unit and Flash LED charge pump IC
For more dimming flexibility or to reduce the number of control traces, the MAX8645Y supports serial
pulse dimming. Connect ENM1 and ENM2 together to enable single-wire pulse dimming of the main
LEDs (or ENF only for single-wire pulse dimming of the Flash LEDs). When ENM1 and ENM2 (or
ENF) go high simultaneously, the main (or flash) LEDs are enabled at full brightness. Each
subsequent low-going pulse (500ns to 250•Ïs pulse width) reduces the LED current by 3.125% (1/32),
so after one pulse the LED current is 96.9% (or 31/32) * ILED. The 31st pulse reduces the current to
0.03125 x ILED. The 32nd pulse sets the LED current back to ILED. Figure 1 shows a timing diagram for
single-wire pulse dimming.
Because soft-start is longer than the intitial tHI, apply dimming pulses quickly upon startup (after initial
tHI) to avoid LED current transitioning through full brightness.
- 43 -
3. TECHNICAL BRIEF
Initial t HI
0 > 200 s 1 2 3 4 5 27 28 29 30 31 32
ENM1 and ENM2
t SOFT-START t HI t SHDN
t LO
2ms (typ.)
32/32 500ns to 250us > 500ns 32/32
31/32 31/32
30/32
29/32
28/32
27/32
IM_ or IF_ 5/32
4/32
3/32 2/32
SHDN 1/32 SHDN
Figure 16 Seiral pulse dimming timing diagram
Setting the Main Output Current

SETM controls M1-M6 regulation current. Current flowing into M1, M2, M3, M4, M5, and M6 is a
multiple of the current flowing out of SETM.
IM1=IM2=IM3=IM4=IM5=IM6 = K * (0.6V / RSETM) = 18.4mA

where K = 230, RSETM = 7500
where K = 23, 69, or 230 (depending upon the state of ENM1 and ENM2, see Table 8), and RSETM is
the resistor connected between SETM and GND (see the Typical Operating Circuit).
Table 8. ENM1/ENM2 current setting table
ENM1/ENM2 STATES BRIGHTNESS M1 - M6 CURRENT

ENM1 = low, ENM2 = low Shutdown 0
ENM1 = low, ENM2 = high 1/10 Brightness 23 x ISETM
ENM1 = high, ENM2 = low 3/10 Brightness 69 x ISETM
ENM1 = high, ENM2 = high Full Brightness 230 x ISETM
Setting the Flash Output Current
SETF controls the F1-F2 regulation current. Current flowing into F1 and F2 is a multiple of the
current flowing out of SETF.
IF1=IF2 = N * (0.6V / RSETF) = 162mA

where N = 1380, RSETF = 5100
- 44 -
3. TECHNICAL BRIEF
3.11 Battery current consumption monitor

KE970 use a current monitoring function to calculate the battery capacity and the remaining time, as
monitoring current flow from the battery thru 47mohm resistor.
VSUPPLY VBAT
C201
0.1u
C202 C203
2.2u 2.2u
CN201
D1 C204 U201
R203
1 100p 5 1
47mohm LOAD NC
2 2
BATT_TEMP (F) GND
3 R202 1K 4 3
VIN IOUT I_MONITOR
D2
C209 C210 C211 ZXCT1010E5TA C212 R206
10p 27p 47p 1u 2.2K
(F)
Figure 17 Current monitor circuit
3.12 JTAG & ETM interface connector
2V72_IO 1V8_MEM
CN101
G1 G2
1 30
TRACEPKT(0:7)
2 29
TRACECLK
3 28 TRACEPKT(7)
4 27 TRACEPKT(6)
_TRST
5 26 TRACEPKT(5)
TDI
6 25 TRACEPKT(4)
TMS
7 24 TRACEPKT(3)
TCK
8 23 TRACEPKT(2)
RTCK
9 22 TRACEPKT(1)
TDO
10 21 TRACEPKT(0)
_EXTRST
11 20
TRIG_IN PIPESTAT2
12 19
TRIG_OUT PIPESTAT1
13 18
PIPESTAT0
14 17
TRACESYNC
15 16
G3 G4
Figure 18 JTAG & ETM(Embedded Trace Module) interface connector
In case of KE970 mass production, the JTAG & ETM interface connector will not be mount on board.
That is only for developing and software debugging purpose.
- 45 -
3. TECHNICAL BRIEF
3.13. Audio
KE970 Audio signal flow diagram as following diagram.
Figure 19 Audio signal flow diagram
- 46 -
3. TECHNICAL BRIEF
3.13.1. Audio amplifier sub system IC with 3D effect

Audio amplifier sub system IC is an audio power amplifier capable of delivering 500mW of
continuous average power into a mono 8Ω load, 25mW per channel of continuous average power
into stereo 32Ω single-ended (SE) loads. The LM4845 features a 32-step digital volume control and
eight distinct output modes. The digital volume control, 3D enhancement, and output modes
(mono/SE/OCL) are programmed through a two-wire I2C interface that allows flexibility in routing
and mixing audio channels.
3V3_AUDIO
C255
1u
C256
0.1u
20
16
25
12
4
3
GND1
GND2
GND3
VDD1
VDD2
PGND
23
MONO_IN+
2V72_IO
11 22
SCL SCL MONO_IN-
10 15
SDA SDA MONO+ SPK_P
13 U207 17
ID_ENB MONO- SPK_N
R233 100K LM4946SQX
2 19
VOC RHP3D1
C260
7 24 0.068u
I2CSPI_VDD RHP3D2
R237
C263 4.7K
14 8 R238 0
0.1u I2CSPI_SEL RIN BBP_SND_R
C262 220n
CBYPASS
5
LHP3D1
LHP3D2
ROUT HS_OUT_R
LOUT
C264 100u
LIN
C266 100u
21
18
6
9
HS_OUT_L
R241 0
BBP_SND_L
C267 470n C268 220n
C270
0.068u R243
C269 1u
4.7K
Figure 20 Audio amplifier Sub-system IC
2V85_IO2
2V72_IO
R224
100
R225
C253 100p
10K
CTS_0
R226 47 U205
1 10 C254
VCC NO2
27p
2 9
RTS_0 NO1 COM2 MULTI_PORT_2
R227 47 R228 24
3 8
COM1 IN2 HSO_SEL
4 7 2V85_IO2
IN1 NC2
R230 47K
5 6
HS_OUT_R NC1 GND
NLAS5223BMNR2G
C258
HS_OUT_L 27p
MULTI_PORT_3
R232 24
3V3_AUDIO
R235
100
C261 100p
SPK_N
U208
1 10 C265
VCC NO2
100p
2 9
SPK_P NO1 COM2 SPK_RCV_N
3 8
COM1 IN2 SPK_RCV_SEL
4 6
IN1 NC2
5 7
RCV_P NC1 GND
NLAS5223BMNR2G
C271
RCV_N 100p
SPK_RCV_P
Figure 21 Audio signal distribute analog switch
- 47 -
3. TECHNICAL BRIEF
3.13.2. Microphone with gain switching circuit

When a call is established, MICBIAS signal goes up to ‘2.5V’ in the MKE970. PMB8876(S-Gold2)
provides both 2.0V and 2.5V for MICBIAS to circuit designer. VA01, VA02 are employed to enhance
ESD immunity.
MICROPHONE VA501
ESD9X5.0ST5G
MIC1_P
C501 C502 C503 1 MIC501
15p 33p 47p 2 OSF213-42DC
MIC1_N
VA502
ESD9X5.0ST5G
R503 220 R504 1K

VMICP
C506
1u
R505 220 R507 1K
VMICN
R506
NA
Figure 22 Microphone circuit
3.14. Multi port switch

Multi port switch has employed to decrease MMI(Multi Media Interface) connector’s pin number. USB,
USART, Remote controlled Headset is connected via this multi port switch. When USB VBUS voltage
is detected Multi port 0 and 1 is connected to USB_DP and USB_DM each. If the remote controlled
headset is plugged into MMI connector, then multi port 0 and 1 in go through REMOTE_INT and
REMOTE_ADC.
Table 9 Multi port switch truth table
VBUS_USB='L' VBUS_USB='L' VBUS_USB='H'

JACK_DETECT='L' JACK_DETECT='H'
Pin6 REMOTE_INT TXD USB_DP
Pin7 REMOTE_ADC RXD USB_DM
- 48 -
3. TECHNICAL BRIEF
2V72_IO VBAT
R229
10K
Pin6
TXD_0
Pin7
RXD_0
C257
0.1u VBAT
17
16
15
14
13
U206 DG2018DN_T1_E4
COM1
NO1
V+
NC4
Pin6BGND
R231
1 12
NC1 Pin7 COM4 MULTI_PORT_1 10K
2 11
JACK_DETECT IN1_2 NO4
3 10
C259 NO2 IN3_4
COM3 Pin6
4 9
100p COM2 Pin7 NC3 C
OUT
R234
GND
Q204
NO3
NC2
B
VBUS_USB
RN1307 IN
R244 R236 10K
Pin6
5
6
7
8
REMOTE_INT GND E 10K

100K MULTI_PORT_0
Pin7
REMOTE_ADC
VA201
USB_PU
R239 1.5K
Pin6
USB_DP
R240 10 Pin7
USB_DM
R242 10
Figure 23 Multi port switch 1
2V85_IO2
2V72_IO
R224 HSO_SEL MULTI_PORT_2 MULTI_PORT_3
100 H CTS_0 RTS_0
L HS_OUT_L HS_OUT_R
R225
C253 100p
10K
CTS_0
R226 47 U205
1 10 C254
VCC NO2
27p
2 9
RTS_0 NO1 COM2 MULTI_PORT_2
R227 47 R228 24
3 8
COM1 IN2 HSO_SEL
4 7 2V85_IO2
IN1 NC2
R230 47K
5 6
HS_OUT_R NC1 GND
NLAS5223BMNR2G
C258
HS_OUT_L 27p
MULTI_PORT_3
R232 24
3V3_AUDIO
R235
SPK_RCV_SEL SPK_RCV_P SPK_RCV_N
100
H SPK_P SPK_N
L RCV_P RCV_N
C261 100p
SPK_N
U208
1 10 C265
VCC NO2
100p
2 9
SPK_P NO1 COM2 SPK_RCV_N
3 8
COM1 IN2 SPK_RCV_SEL
4 6
IN1 NC2
5 7
RCV_P NC1 GND
NLAS5223BMNR2G
C271
RCV_N 100p
SPK_RCV_P
Figure 24 Multi port switch 2
- 49 -
3. TECHNICAL BRIEF
3.15. USB charging circuit

The USB charging circuit is a fully integrated USB VBUS voltage single-cell Li-ion battery charger
circuit.
The charger uses a CC/CV charge profile required by Li-ion batteries. CC charging current and End of
charging current is programmable IREF & IMIN resistors. IREF resistor between this pin and the GND pin to
set the charge current limit determined by the following equation:
ICC = 12089/33K = 366mA
The End Of Charging current is set by IMIN That can be programmed by the as following equation:
IEOC = 11000/220K = 50mA
VBAT
U202 ISL6294
2V72_IO
1 8
VBUS_USB VIN BAT
2 7 360mA
R201 _PPR IREF
10K 3 6 50mA
_USB_EOC _CHG IMIN
4 5
_USB_CHG_EN _EN GND
9
PGND
C213 R208 R209 C214
1u 220K 33K 1u
Figure 25 USB charging circuit
Charging indicator LED controlled by two ICs, one is a SM-Power, the other is a ISL6294. When
TA(Travel Charger) is plugged in to MMI connector, the LD100 controlled by SM-Power both power off
case and power on case. When USB cable is connected via MMI connector, indicator LED is
controlled by ISL6294 in power off case and by SM-Power in power on case.
- 50 -
3. TECHNICAL BRIEF
3.16. BLUETOOTH
Figure 26 BLUETOOTH Functional block diagram.
- 51 -
3. TECHNICAL BRIEF
3.16.1. General Features

• Single Chip Bluetooth device for cellular applications integrating radio, baseband and memory
• Fabricated in advanced low power 0.13•Ïm CMOS technology
• Very low component count (6 external components)
• Ultra low power design
- Peak current 40mA for basic data rate
- Peak current 45mA for enhanced data rate
- Bluetooth low power mode typ. 25µA
• Multiple input clock signals supported (10-40MHz)
• Supply from external voltage regulator 1.8V..3.6V 1)
• Autonomous power down scenarios of Bluetooth and cellular system supported
• Packages:
- P-VQFN-48 package
- P-WFLGA-56 package
• Temperature range from -40°C up to 85°C
• Boundary scan for interface lines via JTAG
3.16.2 Micro-Controller-Section
• ARM7TDMI-STM ARM® Processor for protocol and application software
• Timers + Watchdog + Interrupt Module
3.16.3 Micro-Controller Memory

• 32 KByte RAM
• 256 KByte read only Program Memory
• 8 KByte Patch RAM
3.16.4 Interfaces
• UART (Bluetooth - Interface, support for HCI UART and Three-Wire UART transport layers
with/without hardware handshaking) up to 3.25MBaud
• Two channel PCM Audio interface with I2S mode
• I2C Interface
• Three channel full duplex CVSD trans coder
• General Purpose I/Os
- External interrupt
- Port output levels available during low-power mode (VDD supplied)
• Separate voltage domains for GPIO, UART and PCM interfaces
• Control signal for requesting external (cellular) system clock
• Multi frequency (e.g. 32.768 kHz) low power clock input
- 52 -
3. TECHNICAL BRIEF
3.16.5. RF-Section
• Integrated antenna switch to minimize external components count
• Programmable RF transmit power between -55dBm...+6dBm
- Fine tuning in 2dB programmable steps also supported
• 20dBm power class 1 supported with external power amplifier
- Separate TX output interface to PA (bypass of internal T/R switch)
- Digital power step control
• Receiver sensitivity typ. -90dBm
• High performance integrated LNA with excellent blocking and inter modulation performance
• Low-IF receiver topology eliminates external IF filters
• Digital demodulation for optimum sensitivity and co- / adjacent channel performance
- Digital offset compensation, symbol and frame synchronization
• RSSI information for power control
- 53 -
3. TECHNICAL BRIEF
3.16.6 System Integration
Figure 27 Mobile system integraton
The UART (serial interface) is used for the software interface between S-Gold2 baseband and the
Bluetooth chip. For the HCI UART transport layer four interface lines are needed, two for data
(UARTTXD and UARTRXD) and two for hardware flow control (UARTRTS and UARTCTS). For the
HCI Three-Wire UART transport layer two interface lines (UARTTXD and UARTRXD) are needed. The
hardware flow control lines (UARTRTS and UARTCTS) are supported but the use is optional. In
KE970 used three-wire UART communication.
The UART interface has its own supply voltage (VDDUART) to ensure compatibility with the I/O
voltages used by the S-Gold2.
The PCM/I2S interface is used as audio interface and can handle up to two voice channels. The PCM
interface also has its own supply voltage (VDDPCM) to ensure compatibility with the I/O voltages used
by the S-Gold2 baseband processor.
- 54 -
3. TECHNICAL BRIEF
USIF_RXD
USIF_TXD
I2S1_CLK
I2S1_WA
I2S1_RX
I2S1_TX
2V72_IO1V8_MEM
BLUETOOTH
C323 C324
0.1u 0.1u
G8
G9
H8
H9
D9
D8
A1
A9
E8
E9
J8
J7
J1
J9
NC1
NC2
UARTCTS
UARTRTS
UARTTXD
UARTRXD
VDDUART
PCMCLK
PCMFR1
PCMOUT
PCMIN
VDDPCM
NC3
NC4
B6 C9
TDO SCL0_P0_13
A7 C8
TDI PCMFR2_SDA0_P0_12
B4 F8 BT_VCXO_EN
TMS SLEEPX_P0_15
B7 C2
TCK CLK32_P1_5 CLK32K
A6
TRST_
2V65_BT 1V5_CORE 1V8_MEM VBALUN B9 B1
RTCK WAKEUP_HOST_P1_8
A5 B2
JTAG_ WAKEUP_BT_P1_7
D1
RESET_ _BT_RESET
F1 H5
VDDSUP U307 RFOUT
D2
VDDCREG PMB8753
A8 A4
VDD_1 PAON
B3 A3
VDD_2 PSEL0
F9 B8
VDDC1 PSEL1
B5
VDDC2
G2 A2
VDDPMREG TX_CONF_RXON
H4
VDDRF
E1 F2
VDDRFREG1 VSSVCO
E2 F4
VDDRFREG2 VSSRF1
H1 E5
TX_CONF_P0_14
VDDPLL VSSRF2
J6 F5
VCOCAP1 VSSRF3
CLKIN_XTAL
H6 E4
VCOCAP2 VSSRF4
C334 C335 C336 C337 C338 C339 C340
RFIOX
VBALUN
LOAD
TXAX
VSS1
VSS2
VSS3
VSS4
VSS5
TXA1
TXA2
RFIO
P1_6
0.1u 0.1u 0.1u 0.1u 0.1u 10n 1000p

D4
D5
D6
E6
F6
G1
H2
H7
C1
J3
H3
J2
J5
J4
FL308 R333
DBF71B601 PAD301 PAD302
0
4 1
B2 UB
L304 1.2nH C343
3 2 R335 R336
BT_CLK 2p B1 DC NA NA
G2
G1
C347
L305 1.2nH 100p
6
5
Figure 28 Bluetooth circuit
3.17. Micro SD external memory card slot

The TransFlash Memory Module has eight exposed contacts on one side. The S-Gold2 is connected
to the module using a dedicated eight-pin connector
Figure 29 Micro SD pin assignment
- 55 -
3. TECHNICAL BRIEF
Table 10 Micro SD memory pad assign.
SD mode
Pin No. Name Type Description
1 DAT2 I/O Data bit [2]
2 CD/DAT3 I/O Data bit [3]
3 CMD I/O Command response
4 VDD Power Power supply
5 CLK I Clock
6 VSS Ground Power ground
Figure 30 Micro SD memory card detection scheme
Table 11 Micro SD memory card detect truth table.
Micro SD card status

it is removed it is inserted
TF_DETECT High Low
- 56 -
3. TECHNICAL BRIEF
R318 NA
U304 NCP348MTR2G
1 10 R319
IN1 _EN
100K
4 9
IN2 GATE_OUT
5 8 VCHG
R338 IN3 GATE
18PIN MUILTIPORT RECEPTACEL

NA
3 7
_FLAG OUT2
2 6
2V85_IO2 GND OUT1
11
NC1
12
NC2
U306 R320
NCS2200SQ2T2G 1M 2V72_IO 2V65_ANA VSUPPLY
2V65_ANA 5 4 VIN-
R321 1 VCC
HOOK_DETECT C325
OUT
GND 3 VIN+
47 100p
2
R322
C327 C328
10K
10K
47K
220K
NA
R323 100p
FB302
FB303
27p
1.5K
MIC2_N
C329 19
R324
R325
R326
R327
C330 22n R328 2.2K 1
10p
MIC2_P 2
C331 3
C332 22n 4
27p C333 MULTI_PORT_2
5
10u MULTI_PORT_3
6
MULTI_PORT_0
7
MULTI_PORT_1
8
FL307 ICVE10184E150R101FR 9
R337 1K C349
1 9 10
JACK_TYPE INOUT_A1 INOUT_B1 1000p
2 8 11
JACK_DETECT INOUT_A2 INOUT_B2
3 7 12
TX_DEBUG INOUT_A3 INOUT_B3
4 6 R330 1K 13
RX_DEBUG INOUT_A4 INOUT_B4 RPWRON_EN
R332 NA 14
DSR
G1
G2
15
16
5
10
17
CN303
18
VA302
VA303
VA304
VA305
VA306
C342 C346
FB304
VBUS_USB 20
33u 0.1u
C348
2.2u
Figure 31 Micro SD socket circuit with power control
3.18. 18pin Multi Media Interface connector

Table 12 Multi media interface pin assign
KE970 MMI
Pin Function Description
1 FM_ANT FM radio antenna / Audio ground
2 HS_MIC Headset microphone signal
3 JACK_TYPE Accessory type detect
4 HS_OUT_L / CTS Headset left sound / CTS
5 HS_OUT_R / RTS Headset Right sound / RTS
TXD / USB_DP /
6 USART / USB/ Remote control interrupt
REMOTE_INT
RXD / USB_DM /
7 USART / USB/ Remote control Key ADC
REMOTE_ADC
8 JACK_DETECT Headset detect (active low)
9 VBAT Battery voltage
10 VBAT Battery voltage
11 RPWRON Remote power on (active high. 2.8V)
12 VCHG Charger voltage
13 VCHG Charger voltage
14 DSR N.C.
15 VBUS_USB USB VBUS
16 TX_DEBUG Trace TX data(Debug)
17 RX_DEBUG Trace RX data(Debug)
18 GND Power GND
- 57 -
3. TECHNICAL BRIEF
R318 NA
U304 NCP348MTR2G
1 10 R319
IN1 _EN
100K
4 9
IN2 GATE_OUT
5 8 VCHG
R338 IN3 GATE

NA
3 7
_FLAG OUT2
2 6
2V85_IO2 GND OUT1
11
NC1
12
NC2
U306 R320
NCS2200SQ2T2G 1M 2V72_IO 2V65_ANA VSUPPLY
2V65_ANA 5 4 VIN-
R321 1 VCC
HOOK_DETECT C325
OUT
GND 3 VIN+
47 100p
2
R322
C327 C328
10K
10K
47K
220K
NA
R323 100p
FB302
FB303
27p
1.5K
MIC2_N
C329 19
R324
R325
R326
R327
C330 22n R328 2.2K 1
10p
MIC2_P 2
C331 3
C332 22n 4
27p C333 MULTI_PORT_2
5
10u MULTI_PORT_3
6
MULTI_PORT_0
7
MULTI_PORT_1
8
FL307 ICVE10184E150R101FR 9
R337 1K C349
1 9 10
JACK_TYPE INOUT_A1 INOUT_B1 1000p
2 8 11
JACK_DETECT INOUT_A2 INOUT_B2
3 7 12
TX_DEBUG INOUT_A3 INOUT_B3
4 6 R330 1K 13
RX_DEBUG INOUT_A4 INOUT_B4 RPWRON_EN
R332 NA 14
DSR
G1
G2
15
16
5
10
17
CN303
18
VA302
VA303
VA304
VA305
VA306
C342 C346
FB304
VBUS_USB 20
33u 0.1u
C348
2.2u
Figure 32 MMI 18pin connector circuit
- 58 -
3. TECHNICAL BRIEF
RF circuit technical brief
3.19. General Description

The RF transceiver (PMB 6272 SMARTi-PM) is an integrated single chip, quad-band transceiver for
GSM850/GSM900/GSM1800/GSM1900 designed for voice and data transfer applications. The
transceiver provides an analog I/Q baseband interface and consists of a direct conversion receiver and
a quad-band polar transmitter for GSM and EDGE with integrated PGA functionality. Further on a
completely integrated SD-synthesizer with HSCSD and GPRS/EDGE capability, a digitally controlled
reference oscillator with three outputs, a fully integrated quad-band RF oscillator and a three wire bus
interface with all necessary control circuits complete the transceiver.
Figure 33 RF transceiver PMB7262 SMARTi-PM functional block diagram
- 59 -
3. TECHNICAL BRIEF
GSM850 GSM900 DCS1800 PCS1900
1V5_RF 2V85_RF 2V85_RF
C416 C417 C418 C419 C420 C421 C422 C423

2.5p 2.5p 2.2p 2.2p 1.5p 1.5p 1.2p 1.2p
C424 C425
0.1u 0.1u
L403 L404
L402 L405
22nH 18nH 5.6nH 5.6nH
2V85_RF 2V7_VCXO
1V5_RF
R408
C432 C433 C434 0

0.1u 0.1u 0.1u C435
32
31
30
29
28
27
26
25
24
23
22
21
0.1u
FE1
VDDBIAS2V8
RX1X
RX1
RX2X
RX2
GND2
RX3X
RX3
RX4X
RX4
VDDLNA1V5
(PIN21) (PIN20)
FE2
33
VBIAS VBIAS
34
R409 VDDTX1V5 VDDRX2V8
35 20 C436
LBAND_PAM_IN TX1 U403 VDDRX1V5
R410 0 36 19 R411 47n
HBAND_PAM_IN TX2 PMB6272 VCO_RC
0 37 18 820 R416
VDDTX2V8 VDDVCO2V8 0
38 17
R417 R418 R412 R413 VDDMIX2V8 EN RF_EN
39 16
NA NA NA NA C438 C439 R415 GND3 VDDXO2V8 C437
40 15
VDDDIG2V8
VDDDIG1V5
0.1u 0.1u 10 FSYS1 26MHZ_MCLK

14
GND4 GND1 1000p
FSYS3
FSYS2
41 XOX 13
CLK
XO
DA
AX
BX
A
B
1
2
3
4
5
6
7
8
9
10
11
12
2V7_VCXO
R419
C440 0 R420
100p X401
1V5_CORE 2V85_RF 3 1 620
OUT VCONT AFC
C441 C442 C443
4 2
1000p VCC GND 22p NA
R421 BT_CLK C444
26MHz
1uF
10 R422
C445 C446 RF_CLK
0.1u 0.1u 0
R423
RF_DA
0
R424
QX
0
C447 C448
NA NA
R425
Q
0
R426
IX
0
C449 C450
NA NA
R427
I
0
Figure 34 RF transceiver PMB7262 SMARTi-PM schematic
- 60 -
3. TECHNICAL BRIEF
3.20. Receiver part
Figure 35 Receiver part block diagram
The constant gain direct conversion receiver contains all active circuits for a complete receiver chain
for GSM/GPRS/EDGE (see Figure 39). The GSM850/900/DCS1800/ PCS1900 LNAs with balanced
inputs are fully integrated. No inter-stage filtering is needed. The orthogonal LO signals are generated
by a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band.
Down conversion to baseband domain is performed by low/high band quadrature direct down
conversion mixers. The baseband chain contains a LNB (low noise buffer), channel filter, output buffer
and DC-offset compensation. The 3rd order low pass filter is fully integrated and provides sufficient
suppression of blocking signals as well as adjacent channel interferers and avoids anti-aliasing
through the baseband ADC. The receive path is fully differential to suppress on-chip interferences.
Several gain steps are implemented to cope with the dynamic range of the input signals. Depending
on the baseband ADC dynamic range, single- or multiple gain step switching schemes are applicable.
Furthermore an automatic DC-offset compensation can be used (depending on the gain setting) to
reduce the DC-offset at baseband-output. A programmable gain correction can be applied to correct
for front end- and receiver gain tolerances.
- 61 -
3. TECHNICAL BRIEF
3.21. Transmitter part

The GMSK transmitter supports power class 4 for GSM850 and GSM900 as well as power class 1 for
DCS1800 and PCS1900. The digital transmitter architecture is based on a very low power fractional-N
Sigma-Delta synthesizer without any external components (see Figure39). The analog I/Q modulation
data from the baseband is converted to digital, filtered and transformed to polar coordinates. The
phase/frequency signal is further on processed by the Sigma-Delta modulation loop. The output of its
associated VCO is divided by four or two, respectively, and connected via an output buffer to the
appropriate single ended output pin. This configuration ensures minimum noise level. The 8PSK
transmitter supports power class E2 for GSM850 and GSM900 as well as for DCS1800 and PCS1900.
The digital transmitter architecture is based on a polar modulation architecture, where the analog
modulation data (rectangular I/Q coordinates) is converted to digital data stream and is subsequently
transformed to polar coordinates by means of a CORDIC algorithm. The resulting amplitude
information is fed into a digital multiplier for power ramping and level control. The ready processed
amplitude signal is applied to a DAC followed by a low pass filter which reconstructs the analog
amplitude information. The phase signal from the CORDIC is applied to the Sigma-Delta fractional-N
modulation loop. The divided output of its associated VCO is fed to a highly linear amplitude
modulator, recombining amplitude and phase information. The output of the amplitude modulator is
connected to a single ended output RF PGA for digitally setting the wanted transmit power. The PA
interface of SMARTi-PM supports direct control of standard dual mode power amplifiers (PA’s) which
usually have a power control input VAPC and an optional bias
Figure 36 Transmitter part block diagram
- 62 -
3. TECHNICAL BRIEF
control pin VBIAS for efficiency enhancement. In GMSK mode, the PA is in saturated high efficiency
mode and is controlled via its VAPC pin directly by the baseband ramping DAC. In this way both up- /
down-ramping and output power level are set. In 8PSK mode, the ramping functionality is assured by
an on-chip ramping generator, whereas output power is controlled by the PGA’s as described above.
3.22. RF synthesizer
The transceiver contains a fractional-N sigma-delta synthesizer for the frequency synthesis in the RX
operation mode. For TX operation mode the fractional-N sigma-delta synthesizer is used as Sigma-
Delta modulation loop to process the phase/frequency signal. The 26MHz reference signal is provided
by the internal crystal oscillator. This frequency serves as comparison frequency of the phase detector
and as clock frequency for all digital circuitry.The divider in the feedback path of the synthesizer is
carried out as a multi-modulus divider (MMD). The loop filter is fully integrated and the loop bandwidth
is about 100 kHz to allow the transfer of the phase modulation. The loop bandwidth is automatically
adjusted prior to each slot (OLGA2). To overcome the statistical spread of the loop filter element values
an automatic loop filter adjustment (ALFA) is performed before each synthesizer startup. The fully
integrated quad-band VCO is designed for the four GSM bands (850, 900, 1800, 1900 MHz) and
operates at double or four times transmit or receive frequency. To cover the wide frequency range the
VCO is automatically aligned by a binary automatic band selection (BABS) before each synthesizer
startup.
3.23. TCXO
The transceiver contains a fully integrated 26MHz temperature compensated controlled crystal
oscillator (DCXO) with three outputs for the system clock, one output for the GSM baseband and two
additional for other subsystems (GPS, Bluetooth, etc.). The only external part of the oscillator is the
crystal itself. The overall pulling range of the TCXO consists of eight subranges. The subrange closest
to the ‘0ppm’ at the middle AFC-value is selected during the calibration process in the mobile¢•s
production and is used for the rest of the lifetime. The frequency tuning is performed along the
selected subrange by programming the frequency control word (XO_TUNE) via the three wire bus
(“3Wbus”).
- 63 -
3. TECHNICAL BRIEF
3.24. Front End Module control

Implemented in the Transceiver are two outputs for direct control of front end modules with two logic
input pins to select RX- and TX-mode as well as low- and high band operation.
2V85_RF
U401
NC7WV16P6X
Y1 A1 ANT_SW1
VCC GND
C401
1000p Y2 A2 ANT_SW2
R401
100ohm
R402
100ohm
C402 C403
100p 100p
11
16
18
19
20
14
13
10
9
10p
GND1
GND2
GND3
GND4
GND5
GND6
VC1
VC2
ESD
C404
C405
L406 3.3nH 22p LSHS-M085FE
R404 G2
G3 ANT ANT RF ANT FL401
4 0
G1 17
G2 C406
3 SW401 L401
GSM1800_RX_OUT1
GSM1800_RX_OUT2
GSM1900_RX_OUT1
GSM1900_RX_OUT2
GSM850_RX_OUT1
GSM850_RX_OUT2
GSM900_RX_OUT1
GSM900_RX_OUT2
GSM1800_1900_TX
G1 NA C407
2 KMS-512 100nH
GSM850_900_TX
1.2p
WFL-R-SMT10
CN401
1
2
3
4
5
6
7
8
12
15
Figure 37 FEM schematic
3.25. Power Amplifier Module
GND25 GND15
27 26
GND24 GND14
28 25
GND23 GND13
29 24
GND22 GND12
30 23
GND21 GND11
31 22
GND20 GND10
C408 32 21 VSUPPLY
GND19 GND9
100p 33 20
GND18 GND8
34 19
GND17 GND7
35 U402 18
GND16 GND6
36 SKY77340 17
C409 C410
0.5p NA GSM_OUT EN TXON_PA
9 8
GND5 GSM_IN LBAND_PAM_IN
10 7
GND4 VRAMP PA_LEVEL
11 6 R405 1.2K
RSVD2 VBATT
12 5 R406 0
GND3 RSVD1 VBIAS
13 4
R407 GND2 BS PA_BAND
0 14 3
GND1 DCS_PCS_IN HBAND_PAM_IN
15 2
DCS_PCS_OUT MODE MODE
16 1
C411 C412
NA NA
C426 C427 C413 C428 C429 C430 C414 C431 C415

0.1u 1u 68u 27p 100p 100p 100p 820p 100p
Figure 38 PAM schematic
- 64 -
4. PCB layout
4. PCB layout
4.1 Main & Sub PCB component placement
Figure 39 Main PCB top
Figure 40 Main PCB top placement
- 65 -
4. PCB layout
Figure 41 Main PCB bottom
Figure 42 Main PCB bottom placement
- 66 -
4. PCB layout
Figure 43 KEY FPCB top
Figure 44 KEY FPCB placement
- 67 -
4. PCB layout
Figure 45 KEY FPCB bottom
Figure 46 KEY FPCB bottom placement
- 68 -
4. PCB layout
RF transceiver FEM
Antenna feeding Mobile SW

RF PAM
Charging block
26MHz
Main clock
SIM/T-Flash
socket
OVP block
Camera
connector
Audio Amp
Back Up Battery PMIC

Power inductor
BlueTooth
Memory
Audio/AF LDO
18Pin connector
BBP
KEY FPCB
connector
Sleep crystal Battery contact
- 69 -
4. PCB layout
Flash LED
LCD FPCB
connector LCD Backlight
block
Key light
Volume up
LED
Volume
down
MP3
AF trig /
Shutter
Microphone
Main
connector
- 70 -
4. PCB layout
Hall IC
LCD
conne ctor
Slide key
LED
SPK
Vibrator
PAD
PAD
KEY FPCB
conne ctor
- 71 -
5. Trouble shooting
5. Trouble shooting
5.1 Trouble shooting test setup
4.000V 0. 0000A
Figure 51 Equipment setup
Power on all of test equipment

- Connect PIF-UNION JIG or dummy battery to the DUT for power up.
- Connect mobile switch cable between Communication test set and DUT when you need to make a
phone call.
-Follow trouble shooting procedure
5.2 Power on Trouble

Check Points
-Battery Voltage( Need to over 3.35V)
-Power-On Key detection (PWRON signal)
-Outputs of LDOs from PMIC
- 72 -
5. Trouble shooting
VBAT
U305 NLAST4599DFT2G
2
VCC
C326
0.1u
6 NO
COM 5
PWRON
4 NC
END_KEY
GND
IN
3
1
RPWRON
R329
100K
VBAT
U308 R1114D281D-TR-F
1 3 R331
VDD VOUT RPWRON
C341 470 KP_OUT(1)
4 2 1
NC GND1 0.1u
RPWRON_EN
6
CE GND2
5 Q301 R311 10K
END_KEY
2SC5585 2
C344 R334 C345 3 R310
100p 100K 0.1u KP_IN(5) 100K
End key
_RESET
- 73 -
5. Trouble shooting
PMIC & Li-ion CHARGER

VCHG 2V11_RTC 1V5_CORE 1V5_DSP 2V85_RF VBAT 2V7_VCXO 2V65_BT
C205 C206 C207 C208

0.1u 0.1u 0.1u 0.1u
R204 R205
RTC_OUT PWRON VBACKUP
220K 22K
R207
470K
SPOWER_INT
VCH_CTL
_PMRST C215 C216 C217 C218 C219 C220 C221
VBAT
2.2u 2.2u 2.2u 2.2u 2.2u 2.2u 2.2u
(1608) (1608) (1608) (1608)

49
48
47
46
45
44
43
42
41
40
39
38
37
2V65_ANA VBAT
GND
RESETQ
VLBB2
VDDC
VLBB1
VCHC
VDDCH
VRTC
INTOUT
VRF1
VDDRF
VRF2
VRF3
FB201
1 36
2 35
VBATS VDDA
3 34
VRFC VANA
4 33
PWRON ON VSSR
5
6
VDDPW U203 IREF
32
31 R210 82K
C223
2.2u
C224
2.2u
SW BYP
L201 10uH 7 30 C222 0.1u
8
VSSPW
VSSFB
PMB6812 VDDAU
AUOP
29
(1608)
9 28
FB AUON
10 27
USB_PU VUPU VSSAU
11 26
VUSB AUIP
12 25 VCHG
VBUS_USB VBUS AUIN
LRF3EN
SLED2
SLED1
VMMC
VSIM1
VSIM2
VDDB
VINT
SDA
LED
SCL
VIB
13
14
15
16
17
18
19
20
21
22
23
24
Q201
C225 C226 C229 C227 C230 C231 SI3457BDV S
C235
C228 C232 C233 C234 R211
2.2u 2.2u 10u 10u 10u 10u 2.2u 2.2u 0.1u 2.2u G
4.7u
VCH_CTL 100K
connecto GND to PIN7 / PIN8 (1608)
KEY_BACKLIGHT
BT_VCXO_EN
SLED1
SCL
SDA
D1 D2 D3 D4
2V72_IO 2V85_CARD 2V85_IO2 2V85_SIM VBAT
D201
SDB1040
VCHS
VBAT
R221
0.15
C241 C242 C243 C244 C245
2.2u 2.2u 2.2u 2.2u 2.2u
(1608) C240
68u
ON
(PWRON)
SM-P Delay time
LDOs
SM-POWE 2V7_V 1V8_ 1V5_C 1V5_ 2V72 2V65_ 2V85 2V85 2V85_ 3V1_ 1V5_ 2V85
R LDOS CXO MEM ORE DSP _IO ANA _SIM _IO2 CARD USB RF _RF
LDO NAME VRF2 VLB SW(S VLB VINT VANA VSIM VSIM VMMC VUS VRF VRF
B2 DBB) B1 1 2 B C 1
Delay
time(msec) 20 24.2 23.7 26.2 26.2 28.1 30.2 32.2 34.3 36.6 628 628
- 74 -
5. Trouble shooting
START
Connect power
supply to the DUT
Vbat = over 3.35V
Yes Check the

RPWRON,
No
"PWRON" replace U305
signal
Yes
No Check solder
"_RESET"
U303 or replace it
signal
Yes
No Check solder
Check the all
U203 or replace it
LDO's output
Yes
No Check solder
Is the 26MHz
X401, U403
clock From
or replace it
Yes
Replace main PCB
- 75 -
5. Trouble shooting
5.3 Charging trouble

Check Points
-Connection of TA (check TA voltage 4.8V)
-Charging Current Path component voltage drop
-Battery voltage
• Charging method : CC-CV • Switch-off voltage : 3.35V
• Charger detect voltage : about 4.0V • Charging temperature ADC range
• Charging time : 3h under - ~ -20°C : small charging operation.
• Charging current : 500mA - -20°C ~ 60°C : charging.
• Cutoff current : 100mA - 60°C ~ : not charging operation small
• Low battery alarm charging operation.
-. Idle : 3.62V
-. Dedicated : 3.50V
4.2V~3.86V 3.85V~3.75V 3.75V~3.69V 3.69V~3.62V
VCHG
Q201
SI3457BDV S
C235 R211
G
VCH_CTL 4.7u 100K
D1 D2 D3 D4
D201
SDB1040
VCHS
VBAT
R221
0.15
C240
68u
- 76 -
5. Trouble shooting
START
No Resolder the
18pin
MMI(CN303) CN303
Yes
No The TA can be broken

Source pin
Change other TA
of Q201=
then retest
Yes
Drain pin No Check solder

of Q201 = Q201 or replace it
Yes
D201 voltage No
Replace it
drop
Yes
Battery voltage No Waiting until battery

is over 3.4V? Voltage goes up to 3.4V
Yes
Battery No Change the Battery

thermistor retest
Yes
Charge is operating
- 77 -
5. Trouble shooting
5.4 LCD display trouble

Check Points
-LCD assembly status ( FPCB)
-Connector combination
CN501
1 70
KP_IN(0:5)
2 69
3 68 KP_IN(0)
VMICP
4 67 KP_IN(1)
VMICN
5 66 KP_IN(2)
MIC1_P
L501 270nH 6 65 KP_IN(3)
C504 C505
7 64
L502 270nH 15p 47p
8 63 KP_IN(4)
MIC1_N KP_OUT(0:4)
9 62 KP_IN(5)
SPK_RCV_P
10 61 KP_OUT(0)
SPK_RCV_N
11 60 KP_OUT(1)
12 59 KP_OUT(4)
SCROLL_KEY_A
13 58 KP_OUT(2)
SCROLL_KEY_B
14 57 KP_OUT(3)
END_KEY
15 56
SLED1 LCD_VSYNC
16 55
SLIDE_KEY_BACKLIGHT
17 54
L_D(0:7)
18 53 L_D(0)
DIF_RESET
19 52 L_D(1)
20 51 L_D(2)
LCD_ID
21 50 L_D(3)
22 49
LCD_BACKLIGHT
23 48 L_D(4)
L_WR
24 47 L_D(5)
L_CD
25 46 L_D(6)
L_CS
26 45 L_D(7)
VBAT 27 44
KEY_BACKLIGHT
28 43
LCD_IF_MODE
29 42
FLASH_EN
30 41
SCROLL_EN
31 40
C507 HALL_EN
2V72_IO 32 39
1u
33 38
34 37
MOTOR_N
35 36
C508
1u
At first check the LCD

back light enable
signal
70pin FPCB connector
LCD connector
- 78 -
5. Trouble shooting
START
Check LCD connector

combination then LCD test
with New LCD
No
Is LCD Replace LCD
connector OK? connector
Yes
No Replace LCD
Is LCD FPCB
normal? module
Yes
Assemble
- 79 -
5. Trouble shooting
5.5 Camera Trouble

Check Points
-Connectors combination
-EMI filter soldering
FLASH_EN
C301
17
100p
PGND
1V8_MEM 2V85_IO2
CIF_PCLK OUT8 IN8 R301
9 8 CN301
CIF_RESET OUT7 IN7 NA G1 G2
10 7 C304
SDA OUT6 IN6
11 6 1 34 0.1u
SCL OUT5 IN5
12 5 2 33
CIF_D7 OUT4 IN4 CIF_D(7)
C305
13 4 3 32 0.1u
14 3 4 31
15 2 5 30
CIF_D7
16 1 6 29
CM1431-08 FL301 CIF_D6
7 28
CIF_D5
8 27
CIF_D4
9 26
17
CIF_D(0:7) CIF_D(0:7)
10 25
11 24 PGND CIF_D(3)
OUT8 IN8
12 23 9 8 CIF_D(2)
OUT7 IN7
2V85_IO2 2V8_AF 13 22 10 7 CIF_D(1)
CIF_PD OUT6 IN6
R306 0 14 21 11 6 CIF_D(0)
OUT5 IN5
15 20 12 5
OUT4 IN4 CIF_MCLK
16 19 13 4
OUT3 IN3 CIF_VS
17 18 14 3
OUT2 IN2 CIF_HS
15 2
FB301 OUT1 IN1
G3 G4 16 1
C313 C314 C315 FL304
0.1u 2.2u 0.1u
Check the connector Check signal flow via

combination EMI filter
- 80 -
5. Trouble shooting
START
Check camera connector,

34pin main PCB connector
combination then Camera test
with equipped camera module
FL301, FL304 are No

Resolder
soldered well?
Yes
Replace New No Replace

Camera Main PCB
Yes
Replace Camera module
Yes
Assemble
- 81 -
5. Trouble shooting
5.6 Receiver & Speaker trouble

Check Points
-Speaker wire
-Audio amp soldering
3V3_AUDIO
C255
1u
VMICP
C256
0.1u
C302
1u
VMICN
20
16
25
12
4
3
GND1
GND2
GND3
VDD1
VDD2
PGND
2V72_IO
MONO_IN+
23 MIC1_P
SCL
11
SCL MONO_IN-
22 C303
SDA
10
SDA MONO+
15
SPK_P 15p
MIC1_N
13 U207 17
ID_ENB MONO- SPK_N
R233 100K LM4946SQX
2 19
VOC RHP3D1
C260 SPK_RCV_P
7 24 0.068u
L301 100nH
C306 C307
I2CSPI_VDD RHP3D2
R237
C263 4.7K
14 8 R238 0
0.1u I2CSPI_SEL RIN BBP_SND_R
C262 220n
15p 27p
CBYPASS
5
LHP3D1
LHP3D2
ROUT HS_OUT_R
SPK_RCV_N
LOUT
C264 100u
LIN
C266 100u
L302 100nH
21
18
6
9
HS_OUT_L
R241 0
BBP_SND_L
C267 470n C268 220n
C270
0.068u R243
C269 1u
4.7K
Check signal
flow via Inductor
L301, L302
Check the SPK wire and soldering
Check Audio
amp, In output
signal
- 82 -
5. Trouble shooting
START
Check Speaker wire
No Resolder or
L301, L302
Replace SPK
have low resistance?
module
Yes
Between L301, L302 No Replace LCD FPCB

and Speaker contact then retest
Yes
No
U207 is working Resolder or
properly? Replace it
Yes
Replace Main PCB
Assemble
- 83 -
5. Trouble shooting
5.7 Microphone trouble

Check Points
-Microphone hole
-Mic. Bias & signal come from
MICROPHONE VA501
ESD9X5.0ST5G
MIC1_P
C501 C502 C503 1 MIC501
15p 33p 47p 2 OSF213-42DC
MIC1_N
VA502
ESD9X5.0ST5G
R503 220 R504 1K

VMICP
C506
1u
R505 220 R507 1K
VMICN
R506
NA
Mic.
bias
- 84 -
5. Trouble shooting
START
Check microphone sound hole
Make a phone call then No Check mic. Bias

R503 Mic. Bias come
line
from BBP?
Yes
70pin connector No
combination
Repair the damaged
is good? part
Yes
No Replace
Signal comes out from
Microphone microphone
Assemble
- 85 -
5. Trouble shooting
5.8 Vibrator trouble

Check Points
- Vibrator contact
- IC is working correct
U302
SUY98005LT1G
R313 1
VIBRATOR_EN VIN R314 L303
3
1K R315 VOUT MOTOR_N
2 GND 10 100nH C322
100K
0.1u
Check the wire and soldering
Check the driver IC

Enable signal goes to
high then vibration
- 86 -
5. Trouble shooting
START
Check Vibrator
wire and soldering
No Check U302 or
Pin1 of U302 is
high ? replace it
Yes
Pin3 of U302 is No Check U302 or

low? replace it
Yes
Replace Vibrator
Assemble
- 87 -
5. Trouble shooting
5.9 Keypad back light trouble

Check Points
-Signal path is connected well
-Control IC is working properly
VBAT
LD501 LEWWS44-E
KEY_BACKLIGHT
R501 100ohm
R502 100ohm
LD502 LEWWS44-E
Check R501,502 resistor
- 88 -
5. Trouble shooting
START
Check All of LEDs solder
No Check U203ís
R181ís voltages
pin17 or
goes down
replace it
Yes
70pin connector No Repair the damaged

combination part
Yes
Replace Sub PCB
Assemble
- 89 -
5. Trouble shooting
5.10 Micro SD and SIM card trouble

Check Points
-Power control FET is working
-Socket soldering
-Proper SIM is used
-Card detect is working
_SIM_EN
SIM_RST
SIM_CLK
SIM_IO
2V85_CARD 2V72_IO C236 C237
Q203 27p NA 2V85_SIM
1 S1 D1 6
R212 100K
G
2 G1 G2 5
TF_PWR_EN R213
3 D2 S2 4 R214
100K 4.7K
S
NTJD4105CT1G
C238 Q202
C239 1u SI1305-E3
27p
R215 R216 R217 R218 R219
C7
C3
C6
C2
C5
C1
100K 100K 100K 100K 100K
C7
C3
C6
C2
C5
C1
1
TF_DAT2 1
2
TF_DAT3 2
3
TF_CMD 3
4 16
4 CN202 GND1
5 15
TF_CLK 5 GND2
6 14
6 GND3
7 13
TF_DAT0 7 GND4
8 12
TF_DAT1 8 GND5
11
GND6
R223 47 9
TF_DETECT SWB
10
SWA
C250 C251 C252
1000p 22p 1uF
- 90 -
5. Trouble shooting
Check
soldering all
pin of socket
Pin 1,6 / 7 6 5
2V85_SIM
3 2 1
Pin 3 /
SIM_CLK
TF_DETECT
- 91 -
5. Trouble shooting
START
Check All of SIM card voltage

KE820/KG99 support
1.8V & 3V SIM only
No Repair it
6 pins are
soldered well?
Yes
Q202 is No Replace the

working? damaged
part
Yes
SIM connector
OK
No Repair it
10 pins are
soldered well?
Yes
Q203 is No Replace the

working? damaged
part
Assemble
- 92 -
5. Trouble shooting
5.11 RF PART TROUBLESHOOTING

5.11.1 RF Components
SW401
U402
X401 U403 FL401
REFERENCE PART Description
U402 PAM (Power Ampilifier Module)
X401 VCTCXO (26MHz)
FL401 FEM (Front End Module)
U403 Transceiver
SW401 Mobile Switch
- 93 -
5. Trouble shooting
5.11.2 Trouble Shooting of Receiver Part
Checking Flow
START
Setup Test Equipment

Cell Power : -7 4dBm
EGSM CH30
DCS CH699
Check point
VCTCXO
Check point
PLL Control
Check point
Mobile SW &FEM
Check point
RX I/Q Signal
Re-Download S/W & CAL
- 94 -
5. Trouble shooting
5.11.3 Checking VCTCXO Circuit
Checking Points Checking Flow
Pin : 2.7V No
Is the waveform Replace X401
of Pin3 similar to
X401 Yes
Is the waveform No
Checking U203
of Pin4 similar to (PMIC)
Yes
Pin 3: 26MHz
VCTCXO Circuit is OK.
See next page to check
PLL Circuit.
VCTCXO Circuit Diagram Waveform
2V7_VCXO
Pin 4
R419
0 R420
X401
3 1 620
OUT VCONT AFC
C442 C443
4 2
VCC GND 22p NA
C444
1uF
26MHz Pin 3
- 95 -
5. Trouble shooting
5.11.4 Checking PLL Control signals
Checking Points Checking Flow
R426 (RF_CLK)
No
EN Signal is Check U403
OK ?
R423 (RF_DATA)
Yes
No
U403 DA(Data) is Check U403
Normal?
Yes
No
CLK(Clock) is
Check U403
R416 (RF_EN) Normal?
Yes
Control Signal is OK.

Mobile SW & FEM.
RF Transceiver Circuit Diagram Waveform
0.1u 0.1u 0.
RF_EN
32
31
30
29
28
27
26
25
24
23
22
21
FE1
VDDBIAS2V8
RX1X
RX1
RX2X
RX2
GND2
RX3X
RX3
RX4X
RX4
VDDLNA1V5
(PIN21) (PIN20)
FE2
33
VBIAS
34
VDDTX1V5 VDDRX2V8
35 20 C436
TX1 U403 VDDRX1V5
36 19 R411 47n
TX2 PMB6272 VCO_RC
37 18 820
VDDTX2V8 VDDVCO2V8
38 17
VDDMIX2V8 EN
39
40
GND3 VDDXO2V8
16
15 RF_CLK
VDDDIG2V8
VDDDIG1V5
FSYS1
14
GND4 GND1
FSYS3
FSYS2
41 13
XOX
CLK
XO
DA
AX
BX
A
B
1
2
3
4
5
6
7
8
9
10
11
12
C440
RF_DATA
100p
C441
1000p
BT_CLK
R422
46 RF_CLK
u 0
R423
RF_DA
0
- 96 -
5. Trouble shooting
5.11.5 Checking Mobile SW & FEM
Mobile SW & FEM Circuit Diagram
11
16
18
19
20
14
13
10
9
10p
GND1
GND2
GND3
GND4
GND5
GND6
VC1
VC2
ESD
C404
C405
R404 G2
4 0
G1 17
G2 C406
3 SW401 L401
GSM1800_RX_OUT1
GSM1800_RX_OUT2
GSM1900_RX_OUT1
GSM1900_RX_OUT2
GSM850_RX_OUT1
GSM850_RX_OUT2
GSM900_RX_OUT1
GSM900_RX_OUT2
GSM1800_1900_TX
G1 NA C407
2 KMS-512 100nH
GSM850_900_TX
1.2p
WFL-R-SMT10
CN401
1
2
3
4
5
6
7
8
12
15
Checking Points
SW401
FL401
RX Mode EGSM DCS PCS
ANT_SW1 Off Off Off
ANT_SW2 On Off Off
- 97 -
5. Trouble shooting
Checking Flow
Check Pin 1, 2 of SW401

with RF Cable
No Replace Mobile SW
Signal is OK ?
(SW401)
Yes
Check Pin 20, 21, 22 of

FL308?
Yes
No
Control Signal is Check PMB8876 (U102)
OK?
Yes
No
Pin 16, 17 or 14, Replace FEM (FL308)
15
Yes
Mobile SW & FEM is OK.

See next page to check I/Q
Signals.
ANT SW
ANT SW2
EGSM RX ANT SW
- 98 -
5. Trouble shooting
5.11.6 Checking RX I/Q Signals
Checking Flow
R422
RF_CLK
0 Check RX I/Q Signals
R423
RF_DA
0
R424
QX
No Replace
0 Signals are
C447 C448 Transceiver
NA NA Normal ?
PMB6272(U403)
R425
Q
0
Yes
R426
IX
0 RX Part is OK.
C449 C450 Check Base Band Circuit
NA NA
or
R427
I Re-Download S/W and Cal
0
Checking Points
I RX
I I
Q
Q
Q
- 99 -
5. Trouble shooting
5.11.7 Shooting of Transmitter Part
Checking Flow Checking Points
Setup Test Equipment

Cell Power : - 74dBm
EGSM CH30 6
DCS CH699
3
Check point 1 2
VCTCXO
4
Check point 2
PLL Control 5
6
Check point 3
TX I/Q Signal
Check point 4
Transceiver
Check point 5
PAM Control
Check 6
FEM & Mobile
Re-Download S/W & RF

CAL
5.11.8 VCTCXO Circuit

See RX Part “1. Checking VCTCXO Circuit”
5.11.9 Checking PLL Control Signal

See RX Part “2. Checking PLL Control Signal”
- 100 -
5. Trouble shooting
5.11.10 Checking TX I/Q Signals
Checking Flow
R422
RF_CLK
0
Check TX I/Q Signals
R423
RF_DA
0
R424
QX
0
C447 C448
NA NA Signals are
R425
Q Normal ?
0
R426
IX
0 Yes
C449 C450
NA NA
R427 TX Part is OK.
I
0 Check Base Band Circuit
or
Re-Download S/W and Cal
I TX
Checking Points
Q
I
I
Q
Q
U403
- 101 -
5. Trouble shooting
5.11.11 Checking Transceiver Output Signals
32
31
30
29
28
27
26
25
24
23
22
21
FE1
VDDBIAS2V8
RX1X
RX1
RX2X
RX2
GND2
RX3X
RX3
RX4X
RX4
VDDLNA1V5
FE2
33
VBIAS VBIAS
34
R409 VDDTX1V5 VDDRX2
35
LBAND_PAM_IN TX1 U403 VDDRX1
R410 0 36
HBAND_PAM_IN TX2 PMB6272 VCO_
0 37
VDDTX2V8 VDDVCO2
38
R417 R418 R412 R413 VDDMIX2V8
39
NA NA NA NA C438 C439 R415 GND3 VDDXO2
40
VDDDIG2V8
VDDDIG1V5
0.1u 0.1u 10 FSY
GND4 GN
FSYS3
FSYS2
41
XOX
CLK
XO
DA
AX
BX
A
B
1
2
3
4
5
6
7
8
9
10
11
12
Checking Points
LBAND PAM IN
U402
HBAND PAM IN (DCS/PCS)
MODE Transceiver Output
GMSK Fixed
8PSK Ramp Burst Control
- 102 -
5. Trouble shooting
Checking Flow
Check Output Signal
N Replace
Signals are PMB6272(U402)
Normal ?
Yes
Transceiver is OK.
PAM Control Circuit.
- 103 -
5. Trouble shooting
5.11.12 Checking PAM Control Signals
GND25 GND15
27 26
GND24 GND14
28 25
GND23 GND13
29 24
GND22 GND12
30 23
GND21 GND11
31 22
GND20 GND10
32 21 VSUPPLY
GND19 GND9
33 20
GND18 GND8
34 19
GND17 GND7
35 U402 18
GND16 GND6
36 SKY77340 17
GSM_OUT EN TXON_PA
9 8
GND5 GSM_IN LBAND_PAM_IN
10 7
GND4 VRAMP PA_LEVEL
11 6 R405 1.2K
RSVD2 VBATT
12 5 R406 0
GND3 RSVD1 VBIAS
13 4
GND2 BS PA_BAND
14 3
15 2
DCS_PCS_OUT MODE MODE
16 1
C426 C427 C413 C428 C429 C430 C414 C431 C415

0.1u 1u 68u 27p 100p 100p 100p 820p 100p
Checking Points
TXON PA
PA LEVEL
MODE
MODE MODE PA_LEVEL TXON_PA
GMSK LOW Ramp Burst Control HIGH
8PSK HIGH Control Amp bias HIGH
- 104 -
5. Trouble shooting
Checking Flow
Check Control Signals
N Check
Signals are PMB8876(U102)
Normal ?
Yes
PAM Control Signal is

OK.
FEM & Mobile SW Circuit
- 105 -
5. Trouble shooting
5.11.13 Checking FEM & Mobile SW
Mobile SW & FEM Circuit Diagram
11
16
18
19
20
14
13
10
9
10p
GND1
GND2
GND3
GND4
GND5
GND6
VC1
VC2
ESD
C404
C405
R404 G2
4 0
G1 17
G2 C406
3 SW401 L401
GSM1800_RX_OUT1
GSM1800_RX_OUT2
GSM1900_RX_OUT1
GSM1900_RX_OUT2
GSM850_RX_OUT1
GSM850_RX_OUT2
GSM900_RX_OUT1
GSM900_RX_OUT2
GSM1800_1900_TX
G1 NA C407
2 KMS-512 100nH
GSM850_900_TX
1.2p
WFL-R-SMT10
CN401
1
2
3
4
5
6
7
8
12
15
Checking Points
SW401
FL401
TX Mode EGSM DCS PCS
ANT_SW1 On Off Off
ANT_SW2 Off On On
- 106 -
5. Trouble shooting
Checking Flow
Check Pin 1, 2 of SW401

with RF Cable
No Replace Mobile SW
Signal is OK ?
(SW401)
Yes
Check Pin 20, 21, 22 of

FL308?
Yes
No
Control Signal is Check PMB8876 (U102)
OK?
Yes
No
Pin 16, 17 or 14, Replace FEM (FL308)
15
Yes
Mobile SW & FEM is OK.

Check Antenna.
ANT SW
ANT SW2
EGSM TX
ANT SW
- 107 -
6. Download & S/W upgrade
6.1 S/W download setup
4.000V 0.0000A
#%
!"#$
Preparation
• Target terminal
• PIF-Union
• RS-232 Cable and PIF-UNION to Phone interface Cable
• Power Supply or Battery
• IBM compatible PC supporting RS-232 with Windows 98 or newer.
If you are going to use battery, the voltage of the battery should be over 3.7V for stable power
supplying during S/W download.
- 108 -
6.2 Download program user guide

Execute Flashtool program, then below window will be appeared.
Click the OK button
- 109 -
When the application is started first time the following screen appears.
Each section is described in the text below.
Click the check box to enable or disable file download.

Click on the blue text to select the file to download.
This will open a normal file select box. Select the wanted file.
- 110 -
Click on the blue text to select the COM port.
- 111 -
Click on the blue text to select the Baud rate.

Click OK button to next step.
- 112 -
Will change the window as below
Click to anywhere on the control panel to start download.

Can see the “Reset the phone/module” then remote power on the target phone
- 113 -
During download, the screen will look something like this:
The blue bar shows the download progress. The FLS filename and the expected checksum are
shown. The download statistics are shown. Click “Reset” to reset the counters.
After download, the status is shown.
- 114 -
If there is a need to stop the download process, click on the panel for the channel to be stopped.
To stop the download the panel must be clicked twice.
This is to avoid that the download is stopped accidentally.
Furthermore, to avoid that the download is stopped on a mouse double-click, there must be at least
0.5 second between the two clicks.
If the panel is clicked only once, the text “Click again to stop” will disappear and the download will
continue.
If a valid second click is detected, the download process is stopped and the progress bar turns yellow.
At this point the download can be started from the beginning as usually.
NOTE: That the download statistic is unaffected when the download is stopped manually.
- 115 -
- 116 -
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10 11 12
A 1V5_CORE 1V5_CORE 1V5_DSP 1V8_MEM 1V8_MEM 2V72_IO 1V8_MEM 2V72_IO 2V85_CARD 2V85_SIM 2V11_RTC 1V5_DSP 3V1_USB A
R101
C101 C102 C103
4.7
C104 C105 C106 C107 C108
0.1u 0.1u 0.1u
C119 C120 C121 C122 C123 C124 0.1u 0.1u 0.1u 0.1u 0.1u
INTEL MEMORY
1u 0.1u 10n 0.1u 0.1u 0.1u
C109 C110 C111 C112 C113 C114 C115 NOR SDRAM DIE Maker P/N 1 2 3 4
1u 0.1u 10n 1u 0.1u 10n 0.1u C116 C117 C118 EUSY0319301 512M 256M 1 PF38F5070M0Y0B0 NA 0 ohm NA NA
1u 0.1u 10n Sibley
EUSY0302101 1G 256M 2 PF38F5570MMY0B0 NA 0 ohm 0 ohm NA
EUSY0328701 1G 256M 1 PF38F6070M0Y0BE 0 ohm NA NA 0 ohm Capulet
W10
W13
W12
W11
W19
W14
M10
G19
H10
H11
R12
U15
R11
K10
K11
A15
B19
E13
E10
A13
A19
T12
L10
L11
L19
J10
J11
J15
W2
W7
W1
M9
M5
H9
R8
H5
K8
K9
P5
A9
B1
E8
A1
L8
L9
L5
J8
J9
J1
J5
A(0:24) A(0:24) U101 PF38F6070M0Y0BE D(0:15)
VDD_MAIN1
VDD_MAIN2
VDD_MAIN3
VDD_MAIN4
VDD_MAIN5
VDD_MAIN6
VDD_DSP1
VDD_DSP2
VDD_DSP3
VSS_DSPMAIN1
VSS_DSPMAIN2
VSS_DSPMAIN3
VSS_DSPMAIN4
VSS_DSPMAIN5
VSS_DSPMAIN6
VSS_DSPMAIN7
VSS_DSPMAIN8
VDDP_EBU1
VDDP_EBU2
VDDP_EBU3
VSSP_EBU1
VSSP_EBU2
VSSP_EBU3
VDDP_ETM
VSSP_ETM
VDDP_DIGA
VDDP_DIGB
VDDP_DIGC1
VDDP_DIGC2
VDDP_DIGD
VSSP_DIG1
VSSP_DIG2
VSSP_DIG3
VSSP_DIG4
VDDP_MMC
VDDP_SIM
VDD_RTC
VDD_PLL
VSS_PLL_RTC
VDD_USB
VSS_USB
NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
NC9
B EBU_A0
H2 TP101 A(0) A(0) D1
A0 DQ0
M2 D(0) B
H3 A(1) A(1) C1 L1 D(1)
EBU_A1 A1 DQ1
J4 A(2) A(2) B1 K1 D(2)
VCXO_EN EBU_A2 A2 DQ2
J2 A(3) A(3) B2 L2 D(3)
EBU_A3 A3 DQ3
J3 A(4) A(4) A2 M4 D(4)
R102 EBU_A4 A4 DQ4
K1 A(5) A(5) B3 L3 D(5)
22K EBU_A5 A5 DQ5
VSUPPLY K2 A(6) A(6) A3 L4 D(6)
EBU_A6 A6 DQ6
U17 K3 A(7) A(7) A4 L5 D(7)
BATT_TEMP M0 EBU_A7 A7 DQ7
W17 K5 A(8) A(8) G8 M5 D(8)
RF_TEMP M1 EBU_A8 A8 DQ8
W16 L2 A(9) A(9) F8 L6 D(9)
R104 JACK_TYPE M2 EBU_A9 A9 DQ9
F W15 L1 A(10) A(10) E8 M6 D(10)
390K M7 M EBU_A10 A10 DQ10
R103 3.3K V16 M1 A(11) A(11) G9 L7 D(11)
M8 EBU_A11 A11 DQ11
V17 N1 A(12) A(12) F9 L8 D(12)
R105 F I_MONITOR M9 EBU_A12 A12 DQ12
W18 K4 A(13) A(13) E9 K9 D(13)
100K REMOTE_ADC M10 EBU_A13 A13 DQ13
L4 A(14) A(14) D9 L9 D(14)
EBU_A14 A14 DQ14
L12 P1 A(15) A(15) C9 M8 D(15)
M11
PAOUT1A
PAOUT1B
Do not assemble CN101, It is only for debugging purpose EBU_A15
EBU_A16
L3 A(16) A(16) B9
A15
A16
DQ15
_1G_CS
K12 BB R1 A(17) A(17) B4 D5 R106 0 1 TP102
PAOUT2A EBU_A17 A17 _ADV _ADV
J12 N2 A(18) A(18) B5 G3
PA_LEVEL PAOUT2B EBU_A18 A18 F1__CE _FLASH1_CS
EBU_A19
N4 A(19) A(19) A5
A19 F2__CE
G2 R107 NA 2 _FLASH2_CS
C N15 N5 A(20) A(20) F7 H3 R108 NA 3 C
QX BB_QX EBU_A20 A20 F3__CE
P15 T1 A(21) A(21) E7 E6
Q BB_Q EBU_A21 A21 F4__CE_A27 BFCLKI
R13 BB R2 A(22) A(22) B7 K5 R109 24
I BB_I EBU_A22 A22 F_CLK BFCLKO
R14 U2 A(23) A(23) A6 J5
IX BB_IX EBU_A23 A23 D_CLK SDCLKO
V2 A(24) 1V8_MEM A(24) A7 H5
EBU_A24 D(0:15) A24 D__CLK SDCLKI
B17 A8 H7 R110 24
TXON_PA T_OUT0 _FLASH1_CS A25 _OE _RD
VIBRATOR_EN
B16
T_OUT1 EBU_AD0
V4 TP104 D(0) R111 0 4 B8
A26 F__RST
G7 TP103
_RESET
B15 R4 D(1) J9 R112 10K
PA_BAND T_OUT2 EBU_AD1 F_WAIT _WAIT
D13 W3 D(2) J1 E2 1V8_MEM
ANT_SW1 T_OUT3 EBU_AD2 F_VPP _WE _WR
B14 T5 D(3) H6 TP105
ANT_SW2 T_OUT4 EBU_AD3 D__WE
C18 R6 D(4) D4 E1
T_OUT5 EBU_AD4 C125 C126 F1_VCC1 F__WP1
D15 U5 D(5) J4 F1 R113
$V 1K
MODE T_OUT6 DIGC1~2 EBU_AD5 0.1u 0.1u F1_VCC2 F__WP2
D14 W4 D(6) D6 B6 R114 1K
KP_OUT(4) T_OUT7 EBU_AD6 F2_VCC1 F_DPD F_DPD
A18 W5 D(7) J6 E5 TP106
JACK_DETECT T_OUT8 EBU_AD7 F2_VCC2 N_CLE
C14 U6 D(8) D8
LCD_BACKLIGHT T_OUT9 EBU_AD8 N_ALE R115
A16 V5 D(9) C5
LCD_ID T_OUT10 EBU_AD9 D_VCC1 100K
BASE BAND PROCESSOR

TP107 C13 V6 D(10) D3 H1
T_OUT11 EBU_AD10 D_VCC2 N_RY__BY
D17 W6 D(11) D7
AF_PWR_EN T_OUT12 EBU_AD11 D_VCC3
T8 D(12) G6
EBU_AD12 C127 C128 D_CKE CKE
C15 U7 D(13) D2 G4 TP108 A(13)
AFC AFC EBU_AD13 S_VCC D_BA0
U103
D C17 V7 D(14) 0.1u 0.1u H4 TP109 D
RF_EN RF_STR0 EBU_AD14 D_BA1 A(14)
A17 R7 D(15) J2 F4 TP110
TF_DETECT RF_STR1 DIGC1~2 EBU_AD15 VCCQ1 D__RAS _RAS
B18 J3 F3 TP111
RF_CLK
RF_DA
C16
RF_CLK
RF_DATA PMB8876 EBU_CS0_N
P4
V1 TP113
_FLASH1_CS
1V8_MEM
J7
J8
VCCQ2
VCCQ3
D__CAS
D1__CS
F2
E3
TP112
_CAS
_RAM_CS
EBU_CS1_N _RAM_CS VCCQ4 D2__CS
H1 T2 H9
SLIDE_OPEN CLKOUT0 EBU EBU_CS2_N _FLASH2_CS D_DM0_S__LB _BC0
P3 C2 H8
EBU_CS3_N C129 C130 VSS1 D_DM1_S__UB _BC1
U12 C3 M7
26MHZ_MCLK F26M PLL 0.1u 0.1u VSS2 D_UDQS
K19 G2 TP114 C4 M3
VCXO_EN VCXO_EN DIGA FCDP_RB_N FCDP VSS3 D_LDQS
C6 F6
VSS4 N__RE_S__CS1
L18 T7 R116 C7 H2
SIM_IO CC_IO EBU_ADV_N _ADV VSS5 N__WE_S_CS2
N3 3.3K C8
SIM EBU_RD_N _RD VSS6
J16 U1 K2
SIM_CLK CC_CLK EBU_WR_N _WR VSS7
M19 T6 K3 A1
SIM_RST CC_RST EBU_WAIT_N _WAIT VSS8 DU1
M2 K4 A9
EBU_RAS_N _RAS VSS9 DU2
C12 M4 K6 M1
TF_DAT0 MMCI_DAT0 EBU_CAS_N _CAS VSS10 DU3
D12 M3 K7 M9
TF_DAT1 MMCI_DAT1 EBU_BC0_N _BC0 VSS11 DU4
B12 P2 K8 G1
TF_DAT2 MMCI_DAT2 EBU_BC1_N _BC1 VSS12 RFU
A12 MMC U3 R117 24
TF_DAT3 MMCI_DAT3 EBU_SDCLKO SDCLKO
E12 U4
TF_CMD MMCI_CMD EBU_SDCLK1 SDCLKI
E TF_CLK
C11
MMCI_CLK EBU_BFCLKO
R3 R118 24
BFCLKO
E
V3
EBU_BFCLKI BFCLKI
B2 T3
SPK_RCV_SEL IRDA_RX EBU_CKE CKE
A2 DIGD
RPWRON IRDA_TX
V12 1V8_MEM
RTC_OUT RTC_OUT
U11 U13
USB_DP USB_DPLUS RTC F32K
V11 USB V13
USB_DM USB_DMINUS OSC32K
X101 U102 SN74AUC1G08YZPR
A2
E17 U14 32.768KHz A1 VCC
TDO TDO RTC RESET_N _RESET _FLASH1_CS
D19 P16 2 1 C2
TDI TDI VREFN _1G_CS
F16 L17 C131 220n B1
TMS TMS DIGC2 VREFP C132 C133 _FLASH2_CS GND
E16 M16 R119 22K
TCK TCK IREF 15p 15p
C19 C1
_TRST TRST_N
D18 M15
RTCK RTCK VDDBB
L15
VSSBB
E14
TRIG_IN TRIG_IN DIGC2
TP115 B13 U18
MON1 MON1DIGC1 VDDVBR_1
TP116 A14 R17 2V65_ANA
MON2 MON2 DIGC1 VDDVBR_2
U8
TRACESYNC TRACESYNC
V8 T17
TRACECLK TRACECLK VSSVBR_1
F PIPESTAT0
T9
PIPESTAT0 VSSVBR_2
P17 F
U9
PIPESTAT1 PIPESTAT1
W8 T15
PIPESTAT2 PIPESTAT2 VDDVBT
R9 R16
TRACEPKT0 VSSVBT
TRACEPKT(0) W9 T14
TRACEPKT1 ETM VDDD
TRACEPKT(1) T10 U16
TRACEPKT2 VSSD
TRACEPKT(2) V9 V14
TRACEPKT3 VDDM
TRACEPKT(3) U10 V15
TRACEPKT4 VSSM
TRACEPKT(4) V10 K17 C134 C135 C136
TRACEPKT5 VDDBG
TRACEPKT(5) R10 DIGD N19
TRACEPKT6 DIGD DIGA VSSBG
USIF_RXD_MRST
T11 N16 0.1u 0.1u 0.1u

USIF_TXD_MTSR
TRACEPKT(6)
RSTOUT_N DIGA
USART0_RTS_N
USART0_CTS_N
USART1_RTS_N
USART1_CTS_N
ON BOARD ARM9 JTAG & ETM INTERFACE
TRACEPKT7 DIGA AGND
TRACEPKT(7) K15
USART0_RXD
DIGD USART1_RXD
USART0_TXD
USART1_TXD
DIGB DIGA GUARD
DIF_RESET1
DIF_RESET2
SSC1_MRST
SSC1_MTSR
PM_INT RTC
DIGD
SSC1_SCLK
CIF_HSYNC
DIGD DIGD
CIF_VSYNC
CIF_RESET
USIF_SCLK
VBR
DSP_OUT0
DSP_OUT1
I2S1_CLK0
I2S1_CLK1
I2S2_CLK0
I2S2_CLK1
TRACEPKT(0:7) (U18 U17 T15 : Voice)

CIF_PCLK
I2S1_WA0
KP_OUT0
KP_OUT1
KP_OUT2
KP_OUT3
I2S2WA0
I2S2WA1
I2C_SDA
DSP_IN0
DSP_IN1
DIF_CS1
DIF_CS2
CLKOUT
I2C_SCL
I2S1_RX
I2S2_RX
EPREF1
EPREF2
I2S1_TX
I2S2_TX
DIF_WR
EPPA11
EPPA12
DIF_CD
DIF_HD
DIF_RD
DIF_VD
CIF_PD
DIF_D0
DIF_D1
DIF_D2
DIF_D3
DIF_D4
DIF_D5
DIF_D6
DIF_D7
CIF_D0
CIF_D1
CIF_D2
CIF_D3
CIF_D4
CIF_D5
CIF_D6
CIF_D7
KP_IN0
KP_IN1
KP_IN2
KP_IN3
KP_IN4
KP_IN5
KP_IN6
EPPA2
VMICN
EPN11
EPN12
VMICP
EPP11
EPP12
MICN1
MICN2
MICP1
MICP2
2V72_IO 1V8_MEM
A6
C7
B6
D8
E7
A5
D7
C6
A4
E6
D6
C4
B5
A3
B3
B4
C5
E11
B11
C10
A11
D11
B10
A10
B9
C9
A8
D10
E9
C8
B8
D2
D1
D5
F5
E3
E2
E1
D3
F4
C2
C1
F18
P18
N17
R19
T19
V18
V19
U19
T18
R18
M18
M17
P19
N18
L16
K16
F19
G16
G17
G15
E18
J18
H17
H19
H18
J19
H16
C3
E4
T13
J17
K18
H15
B7
A7
D9
F3
F1
G5
F2
G4
G1
H4
G3
G18
F17
E19
F15
CN101
G1 G2
G 1 30
TRACEPKT(0:7)
G
DIF_D(0)
DIF_D(1)
DIF_D(2)
DIF_D(3)
DIF_D(4)
DIF_D(5)
DIF_D(6)
DIF_D(7)
2 29
I2S1_CLK
FLASH_EN
I2S1_RX
I2S1_TX
I2S1_WA
SCROLL_EN
HALL_EN
TF_PWR_EN
SLIDE_KEY_BACKLIGHT
TRACECLK
3 28 TRACEPKT(7)
NA
KP_OUT(5)-NA
4 27
CIF_MCLK
CIF_RESET
CIF_PD
KP_IN(0)
KP_IN(1)
KP_IN(2)
KP_IN(3)
KP_IN(4)
KP_IN(5)
KP_OUT(0)
KP_OUT(1)
KP_OUT(2)
KP_OUT(3)
TRIG_OUT
RCV_N
RCV_P
BBP_SND_R
BBP_SND_L
PM_INT
CLK32K
F_DPD
USIF_RXD
TXD_0
RXD_0
RTS_0
CTS_0
TX_DEBUG
RX_DEBUG
HSO_SEL
AUDIO_AMP_EN
CIF_HS
TRACEPKT(6)
CIF_PCLK
CIF_VS
SCROLL_KEY_A
_TRST
USIF_TXD
_USB_EOC
_BT_RESET
_SIM_EN
SCROLL_KEY_B
5 26 TRACEPKT(5)
TDI
6 25
R120
TRACEPKT(4)
DIF_D(0:7) TMS
7 24 TRACEPKT(3)
R121 TCK
8 23
CIF_D(0)
CIF_D(1)
CIF_D(2)
CIF_D(3)
CIF_D(4)
CIF_D(5)
CIF_D(6)
CIF_D(7)
TRACEPKT(2)
0 RTCK
2V72_IO 9 22 TRACEPKT(1)
C137 C138 TDO
10 21
VMICP
TRACEPKT(0)
22n 22n _EXTRST
VMICN
11 20
DIF_CS
DIF_RESET
REMOTE_INT
DIF_CD
DIF_WR
LCD_VSYNC
_USB_CHG_EN
HOOK_DETECT
DSR
LCD_IF_MODE
TRIG_IN PIPESTAT2
12 19
TRIG_OUT PIPESTAT1
UART R122 1K 13 18
CIF_D(0:7) PIPESTAT0
3G 2.5G 14 17
TRACESYNC
1 C139 C140 R123 1K 15 16
GND GND
2 15p 15p
RX RX RXD_0
3 G3 G4
TX TX TXD_0
4 L101 L102 L103 L104
SCL
SDA
UFLS NC1
5 270nH 270nH 100nH 100nH
ON_SW ON_SW RPWRON_EN
6
VBAT VBAT VSUPPLY
H PWR NC2
7
Engineer:
H
8 OJ101 OJ102 OJ103 OJ104
URXD NC3
UTXD NC4
9
Drawn by: G.C.LIM LG Electronics
10
DSR
MIC1_N
MIC1_P
MIC2_N
MIC2_P
DSR
11
RTS RTS_0 R&D CHK: B.Y.YANG TITLE: Size:
12
CTS CTS_0 A3
DOC CTRL CHK: KE/ME970 MAIN 12 1 8 A
MFG ENGR CHK:

(Infineon S-GOLD2)
Changed by: Date Changed: Time Changed: QA CHK: REV: Drawing Number:
mentor 2006-10-25 1.2 1/4 Page:
1 2 3 4 5 6 7 8 9 10 11 12
- 117 -
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10 11 12
A A
USB CHARGING CIRCUIT WITH INDICATE LED BATTERY CURRENT MONITOR

PMIC & Li-ion CHARGER VSUPPLY VBAT
VBAT C201
0.1u
VCHG 2V11_RTC 1V5_CORE 1V5_DSP 2V85_RF VBAT 2V7_VCXO 2V65_BT U202 ISL6294 C202 C203
2V72_IO 2.2u 2.2u
1 8 CN201
VBUS_USB VIN BAT
D1 C204 U201
C205 C206 C207 C208 R203
2 7 360mA 1 100p 5 1
0.1u 0.1u 0.1u 0.1u R201 _PPR IREF 47mohm LOAD NC
2 2
R204 R205 10K BATT_TEMP (F) GND
3 6 50mA 3 R202 1K 4 3
RTC_OUT PWRON VBACKUP _USB_EOC _CHG IMIN VIN IOUT I_MONITOR
D2
220K 22K C209 C210 C211 ZXCT1010E5TA C212 R206
4 5
R207 _USB_CHG_EN _EN GND 10p 27p 47p 1u 2.2K
9 (F)
B 470K PGND B
C213 R208 R209 C214
1u 220K 33K 1u
SPOWER_INT
VCH_CTL
_PMRST C215 C216 C217 C218 C219 C220 C221
VBAT
2.2u 2.2u 2.2u 2.2u 2.2u 2.2u 2.2u
(1608) (1608) (1608) (1608)

49
48
47
46
45
44
43
42
41
40
39
38
37
2V65_ANA VBAT
GND
RESETQ
VLBB2
VDDC
VLBB1
VCHC
VDDCH
VRTC
INTOUT
VRF1
VDDRF
VRF2
VRF3
FB201
1 36
2 35
VBATS VDDA
3 34
VRFC VANA
4 33
PWRON ON VSSR
5
6
VDDPW U203 IREF
32
31 R210 82K
C223
2.2u
C224
2.2u
SW BYP
L201 10uH 7 30 C222 0.1u
C 8
VSSPW
VSSFB
PMB6812 VDDAU
AUOP
29
(1608) C
MICRO SD & SIM HYBRID SOCKET

9 28
FB AUON
10 27
USB_PU VUPU VSSAU
11 26
VUSB AUIP
12 25 VCHG
VBUS_USB VBUS AUIN
_SIM_EN
LRF3EN
SIM_RST
SIM_CLK
SLED2
SLED1
VMMC
VSIM1
VSIM2
VDDB
SIM_IO
VINT
SDA
LED
SCL
VIB
13
14
15
16
17
18
19
20
21
22
23
24
Q201
C225 C226 C229 C227 C230 C231 SI3457BDV S
C235 2V85_CARD 2V72_IO C236 C237
C228 C232 C233 C234 R211 Q203 27p NA
2.2u 2.2u 10u 10u 10u 10u 2.2u 2.2u 0.1u 2.2u G
4.7u 2V85_SIM
AUDIO/AF LDO
VCH_CTL 100K
connecto GND to PIN7 / PIN8 (1608) 1 S1 D1 6
R212 100K
G
2 G1 G2 5
TF_PWR_EN R213
R214
KEY_BACKLIGHT
BT_VCXO_EN
SLED1
3 D2 S2 4
100K
SCL
4.7K
SDA
S
D1 D2 D3 D4 NTJD4105CT1G
C238 Q202
2V72_IO 2V85_CARD 2V85_IO2 2V85_SIM VBAT VBAT
C239 1u SI1305-E3
2V8_AF 3V3_AUDIO
27p
11
D D201 1
PGND R215 R216 R217 R218 R219 D
C7
C3
C6
C2
C5
C1
VIN 100K 100K 100K 100K 100K
SDB1040 10
VO1
C7
C3
C6
C2
C5
C1
2 1
AF_PWR_EN EN1 TF_DAT2 1
9 2
VCHS VO2 TF_DAT3 2
3 3
AUDIO_AMP_EN EN2 TF_CMD 3
VBAT 8 4 16
R221 NC3 4 CN202 GND1
R222 4 5 15
0.15 R220 CBYP TF_CLK 5 GND2
100K 7 6 14
C241 C242 C243 C244 C245 100K NC2 6 GND3
5 7 13
2.2u 2.2u 2.2u 2.2u 2.2u NC1 TF_DAT0 7 GND4
6 8 12
(1608) C240 GND TF_DAT1 8 GND5
11
68u C246 C247 C248 C249 GND6
U204 R223 47 9
1u 1000p 1u 1u TF_DETECT SWB
ISL9014IRJNZ 10
SWA
C250 C251 C252
1000p 22p 1uF
E E
MULTI-PORT SWITCH 2
2V85_IO2
AUDIO AMP SUB SYSTEM 2V72_IO

R224 HSO_SEL MULTI_PORT_2 MULTI_PORT_3
MULTI-PORT SWITCH 1
100 H CTS_0 RTS_0
L HS_OUT_L HS_OUT_R
R225
C253 100p
3V3_AUDIO 10K 2V72_IO VBAT
CTS_0
R226 47 U205
1 10 C254
F C255
VCC NO2 F
27p
1u 2 9 R229
RTS_0 NO1 COM2 MULTI_PORT_2 10K
C256 R227 47 R228 24
0.1u 3 8 Pin6
COM1 IN2 HSO_SEL TXD_0
Pin7
RXD_0
4 7 2V85_IO2 C257
IN1 NC2 0.1u VBAT
20
16
25
12
R230 47K
4
5 6
17
16
15
14
13
HS_OUT_R NC1 GND U206 DG2018DN_T1_E4
GND1
GND2
GND3
VDD1
VDD2
PGND
COM1
NO1
V+
NC4
Pin6BGND
23 NLAS5223BMNR2G
MONO_IN+ R231
2V72_IO 1 12
C258 NC1 Pin7 COM4 MULTI_PORT_1 10K
11 22 2 11
SCL SCL MONO_IN- HS_OUT_L 27p JACK_DETECT IN1_2 NO4
3 10
MULTI_PORT_3 C259 NO2 IN3_4
COM3 Pin6
10 15 R232 24 4 9
SDA SDA MONO+ SPK_P 100p COM2 Pin7 NC3 C
3V3_AUDIO OUT
R234
GND
Q204
NO3
13 U207 17
NC2
B
ID_ENB MONO- SPK_N VBUS_USB
R233 100K LM4946SQX RN1307 IN
R244 R236 10K
2 19 Pin6
5
6
7
8
VOC RHP3D1 R235 REMOTE_INT GND E 10K
C260 SPK_RCV_SEL SPK_RCV_P SPK_RCV_N 100K
0.068u 100 MULTI_PORT_0
7 24 H SPK_P SPK_N Pin7
G I2CSPI_VDD RHP3D2
R237
REMOTE_ADC G
C263 L RCV_P RCV_N
14 8 4.7K R238 0
0.1u I2CSPI_SEL RIN BBP_SND_R C261 100p
C262 220n
SPK_N VA201
CBYPASS
5 U208
LHP3D1
LHP3D2
ROUT HS_OUT_R
1 10
LOUT
VCC NO2 C265

C264 100u
LIN
100p
2 9
C266 100u SPK_P NO1 COM2 SPK_RCV_N USB_PU
21
18
R239 1.5K
9
HS_OUT_L
3 8 Pin6
COM1 IN2 SPK_RCV_SEL USB_DP
R241 0 R240 10 Pin7
BBP_SND_L USB_DM
C267 470n C268 220n 4 6 R242 10
C270 IN1 NC2
0.068u R243
C269 1u 5 7
4.7K RCV_P NC1 GND JACK_DETECT VBUS_USB MULTI_PORT_0 MULTI_PORT_1
NLAS5223BMNR2G 0 0 REMOTE_INT REMOTE_ADC
C271
1 0 TXD_0 RXD_0
RCV_N 100p
0/1 1 USB_DP USB_DM
SPK_RCV_P
H Engineer:
H
Drawn by: G.C.LIM

LG Electronics
R&D CHK: B.Y.YANG TITLE: Size:

A3
MFG ENGR CHK:

(PMIC, AUDIO, etc.)
Changed by:
mentor
Date Changed:
2006-10-25
Time Changed: QA CHK: REV:
1.2 Drawing Number:
2/4 Page:
1 2 3 4 5 6 7 8 9 10 11 12
- 118 -
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10 11 12
A
MAIN PCB & SUB PCB INTERFACE CONNECTOR A
(AXK870145YG PLUG) 2M AF CAMERA I/F CONNECTOR
FLASH_EN
VMICP D301 MSMF05C-P
C302
1u
VMICN C301
17
MIC1_P 100ohm/15pF/15KV 100p
C303 KP_IN(0:5)
PGND
FL302 CM1431-08 1V8_MEM 2V85_IO2
15p CIF_PCLK OUT8 IN8 R301
CN302 16 1 KP_IN(0) 9 8 CN301
MIC1_N OUT1 IN1 CIF_RESET OUT7 IN7 NA G1 G2
1 70 15 2 KP_IN(1) 10 7 C304
SPK_RCV_P OUT2 IN2 SDA OUT6 IN6
L301 100nH 2 69 14 3 KP_IN(2) 11 6 1 34 0.1u
C306 C307 OUT3 IN3 SCL OUT5 IN5
3 68 13 4 KP_IN(3) 12 5 2 33
15p 27p OUT4 IN4 CIF_D7 OUT4 IN4 CIF_D(7)
C305
4 67 12 5 KP_IN(4) 13 4 3 32 0.1u
B SPK_RCV_N
L302 100nH 5 66 11
OUT5 IN5
6 KP_IN(5)
KP_OUT(0:5) CIF_D6
14
OUT3 IN3
3 CIF_D(6)
4 31
B
OUT6 IN6 CIF_D5 OUT2 IN2 CIF_D(5)
6 65 10 7 KP_OUT(0) 15 2 5 30
OUT7 IN7 CIF_D4 OUT1 IN1 CIF_D(4)
CIF_D7
7 64 9 8 16 1 6 29
PGND
KP_OUT(1)
OUT8 IN8 CM1431-08 FL301 CIF_D6
8 63 7 28
C308 C310 R302 FL303 CIF_D5
9 62 8 27
HALL EFFECT S/W
17
1000p C309 0.1u 100K CIF_D4

10 61 9 26
17
C311 C312
17
CIF_D(0:7) CIF_D(0:7)
1000p 1000p 18p
PGND
R303 220 11 60 KP_OUT(4) 10 25

SCROLL_KEY_A IN8 OUT8
PGND
R305 220 8 9 12 59 FL305 R304 100 11 24 CIF_D(3)
SCROLL_KEY_B IN7 OUT7 OUT8 IN8
7 10 13 58 16 1 KP_OUT(2) 12 23 9 8 CIF_D(2)
DIF_RESET IN6 OUT6 OUT1 IN1 OUT7 IN7
6 11 14 57 15 2 KP_OUT(3) 2V85_IO2 2V8_AF 13 22 10 7 CIF_D(1) 2V72_IO
LCD_ID IN5 OUT5 OUT2 IN2 CIF_PD OUT6 IN6
5 12 15 56 14 3 R306 0 14 21 11 6 CIF_D(0)
LCD_BACKLIGHT IN4 OUT4 OUT3 IN3 LCD_VSYNC OUT5 IN5
4 13 16 55 13 4 15 20 12 5
DIF_WR IN3 OUT3 OUT4 IN4 SLIDE_KEY_BACKLIGHT OUT4 IN4 CIF_MCLK
3 14 17 54 12 5 16 19 13 4
DIF_CD IN2 OUT2 OUT5 IN5 DIF_D(0:7) OUT3 IN3 CIF_VS R307 100K
2 15 18 53 11 6 DIF_D(0) 17 18 14 3
DIF_CS IN1 OUT1 OUT6 IN6 OUT2 IN2 CIF_HS SLIDE_OPEN
1 16 19 52 10 7 DIF_D(1) 15 2
OUT7 IN7 FB301 OUT1 IN1
20 51 9 8 G3 G4 16 1
PGND
DIF_D(2)
OUT8 IN8 C313 C314 C315 C316 C317
2
21 50 DIF_D(3) FL304
OUT
VDD
0.1u 2.2u 0.1u 0.1u 0.1u
22 49
17
23 48 FL306
24 47 16 1
VSS
DIF_D(4)
C C
NC
OUT1 IN1
VA301 25 46 15 2 DIF_D(5) U301
OUT2 IN2
3
ICVL0505600V150FR 26 45 14 3 DIF_D(6) EM-0781-T5
END_KEY OUT3 IN3
27 44 13 4 DIF_D(7)
SLED1 OUT4 IN4 R308
28 43 12 5 100K
KEY_BACKLIGHT OUT5 IN5 LCD_IF_MODE
29 42 11 6
OUT6 IN6 FLASH_EN
VBAT 30 41 10 7
OUT7 IN7 SCROLL_EN
31 40 9 8
PGND
OUT8 IN8 HALL_EN
32 39
33 38
C318 R309
17
2V72_IO 34 37
0.1u MOTOR_N 100K
35 36
C319
0.1u
D D
EXTERNAL RESET
BACK UP BATTERY 2V 0.5mAh
2V72_IO 2V11_RTC
VIBRATOR VBACKUP
KP_OUT(1) R312
1
Q301 R311 10K 100K
END_KEY
2SC5585 2
U302 U303 C320
3 R310 0.1u
KP_IN(5) 100K SUY98005LT1G _EXTRST 7 A1 VCC 8
R313 1
VIBRATOR_EN VIN R314 L303 C321 SPOWER_INT 6 B1 Y1 1 PM_INT
3 BAT301
1K VOUT MOTOR_N 0.1u _RESET 5 Y2 B2 2 _PMRST
R315
2 GND 10 100nH C322 4 GND A2 3
100K
0.1u
NC7WZ08L8X
AND GATE
E E
R316 NA
R317 NA
R318 NA
U304 NCP348MTR2G
USIF_RXD
USIF_TXD
I2S1_CLK
I2S1_WA
I2S1_RX
R319
I2S1_TX
1 10
IN1 _EN
2V72_IO1V8_MEM
100K
REMOTE POWER ON
4 9
IN2 GATE_OUT
BLUETOOTH R338
5
IN3 GATE
8 VCHG

NA
3 7 VBAT
_FLAG OUT2
2 6
C323 C324 2V85_IO2 GND OUT1
11
0.1u 0.1u NC1
G8
G9
12
H8
H9
D9
D8
A1
A9
E8
E9
J8
J7
J1
J9
NC2
NC1
NC2
UARTCTS
UARTRTS
UARTTXD
UARTRXD
VDDUART
PCMCLK
PCMFR1
PCMOUT
PCMIN
VDDPCM
NC3
NC4
U305 NLAST4599DFT2G
F F
2
U306 R320
NCS2200SQ2T2G 1M
VCC
B6 C9 2V72_IO 2V65_ANA VSUPPLY C326
TDO SCL0_P0_13 0.1u
A7 C8 2V65_ANA 5 4 VIN- 6 NO
TDI PCMFR2_SDA0_P0_12 R321
B4 F8 BT_VCXO_EN 1 VCC COM 5
TMS SLEEPX_P0_15 HOOK_DETECT C325 PWRON
B7 C2 OUT
GND 3 VIN+ 4 NC
TCK CLK32_P1_5 CLK32K 47 100p END_KEY
A6 2
TRST_ R322
GND
2V65_BT 1V5_CORE 1V8_MEM VBALUN B9 B1 C327 C328
10K
10K
47K
220K
NA
IN
RTCK WAKEUP_HOST_P1_8 R323
A5 B2 100p
FB302
FB303
JTAG_ WAKEUP_BT_P1_7 27p
1.5K
1
D1 MIC2_N
RESET_ _BT_RESET
F1 H5 C329 19
R324
R325
R326
R327
VDDSUP U307 RFOUT C330 22n RPWRON
D2 R328 2.2K 1
VDDCREG PMB8753 10p R329
A8 A4 MIC2_P 2
VDD_1 PAON 100K
B3 A3 C331 3
VDD_2 PSEL0 C332 22n
F9 B8 4
VDDC1 PSEL1 27p C333 MULTI_PORT_2
B5 5
VDDC2 10u MULTI_PORT_3
G2 A2 6
VDDPMREG TX_CONF_RXON MULTI_PORT_0
H4 7
VDDRF MULTI_PORT_1
E1 F2 8
VDDRFREG1 VSSVCO
E2 F4 FL307 ICVE10184E150R101FR 9 VBAT
VDDRFREG2 VSSRF1 R337 1K C349
H1 E5 1 9 10
TX_CONF_P0_14
G J6
VDDPLL VSSRF2
F5
JACK_TYPE
2
INOUT_A1 INOUT_B1
8
1000p
11
G
VCOCAP1 VSSRF3 JACK_DETECT INOUT_A2 INOUT_B2
CLKIN_XTAL
H6 E4 3 7 12 U308 R1114D281D-TR-F
VCOCAP2 VSSRF4 TX_DEBUG INOUT_A3 INOUT_B3
R331
4 6 R330 1K 13 1 3
C334 C335 C336 C337 C338 C339 C340 RX_DEBUG INOUT_A4 INOUT_B4 RPWRON_EN VDD VOUT RPWRON
RFIOX
VBALUN R332 NA 14
LOAD
TXAX
VSS1
VSS2
VSS3
VSS4
VSS5
TXA1
TXA2
RFIO
P1_6
0.1u 0.1u 0.1u 0.1u 0.1u 10n 1000p DSR C341 470
G1
G2
15 4 2
NC GND1 0.1u
16 6 5
5
10
RPWRON_EN CE GND2
17
D4
D5
D6
E6
F6
G1
H2
H7
C1
J3
H3
J2
J5
J4
FL308 R333
DBF71B601 PAD301 PAD302 CN303
18
VA302
VA303
VA304
VA305
VA306
0 C344 R334 C345

4 1
B2 UB C342 C346 100p 100K 0.1u
FB304
L304 1.2nH C343 VBUS_USB 20
3 2 R335 R336 33u 0.1u
BT_CLK 2p B1 DC NA NA
G2
G1
C347
L305 1.2nH 100p C348
6
5
2.2u
H Engineer:
H
Drawn by: G.C.LIM

LG Electronics

A3
MFG ENGR CHK:

(BT, External connector, etc.)
Changed by:
mentor
Date Changed:
2006-10-25
1.2 Drawing Number:
3/4 Page:
1 2 3 4 5 6 7 8 9 10 11 12
- 119 -
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 1 0 11 12
2V85_RF
U401
NC7WV16P6X
A Y1 A1 ANT_SW1
A
VC1 VC2
PIN 14 PIN 13 VCC GND
C401
GSM850_EGSM TX H L 1000p Y2 A2 ANT_SW2
DCS_PCS TX L H
GSM850 RX L L R401
100ohm
EGSM900 RX L L
DCS1800 RX L L R402
100ohm
C402 C403
PCS1900 RX L L 100p 100p
B B
11
16
18
19
20
14
13
10
9
10p
GND1
GND2
GND3
GND4
GND5
GND6
VC1
VC2
ESD
C404
C405
R404 G2
4 0
G1 17
G2 C406
3 SW401 L401
GSM1800_RX_OUT1
GSM1800_RX_OUT2
GSM1900_RX_OUT1
GSM1900_RX_OUT2
GSM850_RX_OUT1
GSM850_RX_OUT2
GSM900_RX_OUT1
GSM900_RX_OUT2
GSM1800_1900_TX
G1 NA C407
2 KMS-512 100nH
GSM850_900_TX
1.2p GND25 GND15
WFL-R-SMT10 27 26
GND24 GND14
CN401 28 25
GND23 GND13
29 24
GND22 GND12
30 23
GND21 GND11
31 22
GND20 GND10
C408 32 21 VSUPPLY
GND19 GND9
33 20
1
2
3
4
5
6
7
8
12
15
100p
GND18 GND8
34 19
GND17 GND7
35 U402 18
GND16 GND6
36 SKY77340 17
C409 C410
0.5p NA GSM_OUT EN TXON_PA
C 9
GND5 GSM_IN
8
LBAND_PAM_IN
C
10 7
GND4 VRAMP PA_LEVEL
11 6 R405 1.2K
RSVD2 VBATT
GSM850 GSM900 DCS1800 PCS1900 12 5 R406 0
GND3 RSVD1 VBIAS
13 4
2V85_RF 2V85_RF R407 GND2 BS PA_BAND
1V5_RF 0 14 3
15 2
C416 C417 C418 DCS_PCS_OUT MODE MODE
C419 C420 C421 C422 C423 16 1
2.5p 2.5p 2.2p C411 C412
2.2p 1.5p 1.5p 1.2p 1.2p
NA NA
C424 C425
0.1u 0.1u C426 C427 C413 C428 C429 C430 C414 C431 C415
L403 L404 68u
L402 L405 0.1u 1u 27p 100p 100p 100p 820p 100p
22nH 18nH 5.6nH 5.6nH
2V85_RF 2V7_VCXO
D 1V5_RF D
R408
C432 C433 C434 0

0.1u 0.1u 0.1u C435
32
31
30
29
28
27
26
25
24
23
22
21
0.1u
FE1
VDDBIAS2V8
RX1X
RX1
RX2X
RX2
GND2
RX3X
RX3
RX4X
RX4
VDDLNA1V5
(PIN21) (PIN20)
FE2
33
VBIAS VBIAS
34
R409 VDDTX1V5 VDDRX2V8
35 20 C436
LBAND_PAM_IN TX1 U403 VDDRX1V5
R410 0 36 19 R411 47n
HBAND_PAM_IN TX2 PMB6272 VCO_RC R414 22K
0 37 18 820 R416
VDDTX2V8 VDDVCO2V8 0 RF_TEMP
38 17
R417 R418 R412 R413 VDDMIX2V8 EN RF_EN
39 16
NA NA NA NA C438 C439 R415 GND3 VDDXO2V8 C437 PT401 10K
40 15
VDDDIG2V8
VDDDIG1V5
0.1u 0.1u 10 FSYS1 26MHZ_MCLK

14
GND4 GND1 1000p
FSYS3
FSYS2
41 13
XOX
CLK
XO
DA
AX
BX
A
E E
1
2
3
4
5
6
7
8
9
10
11
12
2V7_VCXO
R419
C440 0 R420
100p X401
1V5_CORE 2V85_RF 3 1 620
OUT VCONT AFC
C441 C442 C443
4 2
1000p VCC GND 22p NA
R421 BT_CLK C444
26MHz
1uF
10 R422
C445 C446 RF_CLK
0.1u 0.1u 0
R423
RF_DA
0
R424
QX
F 0
F
C447 C448
NA NA
R425
Q
0
R426
IX
0
C449 C450
NA NA
R427
I
0
G G
H Engineer:
H
Drawn by: H.T.LEE LG Electronics

A3
MFG ENGR CHK:

(RF)
Changed by:
mentor
Date Changed:
2006-10-25
1.2 Drawing Number:
4/4 Page:
1 2 3 4 5 6 7 8 9 10 11 12
- 120 -
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10 11 12
A A
MAIN PCB & SUB PCB INTERFACE CONNECTOR

(SOCKET:AXK770145G) MICROPHONE KEY_BACKLIGHT_LED
VA501
ESD9X5.0ST5G VBAT
LD501 LEWWS44-E
CN501
KEY_BACKLIGHT
1 70 R501 100ohm
KP_IN(0:5) MIC1_P
2 69 1
C501 C502 C503 MIC501
3 68 KP_IN(0) 2 OSF213-42DC R502 100ohm
VMICP 15p 33p 47p LD502 LEWWS44-E
4 67 KP_IN(1)
VMICN MIC1_N
5 66 KP_IN(2)
MIC1_P change to LEWWS44
B L501 270nH
C504 C505
6 65 KP_IN(3) B
7 64
L502 270nH 15p 47p
8 63 KP_IN(4)
VA502
MIC1_N KP_OUT(0:4)
9 62 KP_IN(5) ESD9X5.0ST5G
SPK_RCV_P
10 61 KP_OUT(0)
SPK_RCV_N
11 60 KP_OUT(1) R503 220 R504 1K
VMICP
12 59 KP_OUT(4)
SCROLL_KEY_A C506
13 58 KP_OUT(2)
SCROLL_KEY_B 1u
14 57 KP_OUT(3) R505 220 R507 1K
END_KEY VMICN
15 56
SLED1 LCD_VSYNC R506
16 55
SLIDE_KEY_BACKLIGHT NA
SLIDE_KEYLED_CONTROL
17 54
L_D(0:7)
18 53 L_D(0)
DIF_RESET
19 52 L_D(1)
20 51 L_D(2)
LCD_ID R508 2.7K
21 50 L_D(3)
SLIDE_KEY_BACKLIGHT
22 49
LCD_BACKLIGHT Q501
23 48 L_D(4) 1 2 3
L_WR
24 47 L_D(5) EMX18
L_CD
25 46 L_D(6)
R509 12
L_CS
C C
END KEY
26 45 L_D(7)
VBAT 27 44
KEY_BACKLIGHT
28 43 VBAT R510 12 6 5 4
LCD_IF_MODE
29 42 ON/END
FLASH_EN
30 41
SCROLL_EN R511 NA
31 40
C507 HALL_EN END_KEY SLED1 SLIDE_LED
2V72_IO 32 39
1u END
33 38
34 37
MOTOR_N
35 36
C508
1u
D D
FPCB INTERFACE CONNECTOR LCD BACKLIGHT / FLASH

KEYPAD VBAT
(PLUG)
U501 MAX8645Y
1 23
KB_SND PIN C1P
2V72_IO CN502 VBAT 2 C511
KP_IN(0:5) MENU OK SERCH G2 G1 IN
C509
KP_IN(0) 54 1 10u 22 1u
C1N
53 2 3 26
501 502 503 KB_CLR GND C2P V_SCROLL_2.8
E C512 1u
52 3
C513 1u
24
PGND C514 E
51 4 29
BGND
KP_IN(1) 50 5 27 1u
L_D(0:7) DIF_RESET L_WR C2N
49 6 25
504 505 506 KB_UP L_CS OUT MLED_A
L_D(0) 48 7
L_CD
L_D(1) 47 8 20
LCD_IF_MODE LCD_BACKLIGHT ENM1
KP_IN(2) L_D(2) 46 9 19
HALL_EN ENM2
L_D(3) 45 10 21 16
507 508 509 KB_DOWN SCROLL_KEY_B FLASH_EN ENF M1 MLED_C1
44 11 18 15
SCROLL_KEY_A SCROLL_EN ENLDO M2 MLED_C2
L_D(4) 43 12 28 14
LCD_ID P1 M3 MLED_C3
KP_IN(3) L_D(5) 42 13 17 13
LCD_VSYNC P2 M4 MLED_C4
L_D(6) 41 14 12
KB_STAR 510 KB_SHA KB_BGM MLED_C5 M5 MLED_C5
L_D(7) 40 15 11
MLED_C4 M6
39 16 8 10
MLED_C3 SETM F1 FLASH_LED_C
KP_IN(4) 38 17 M1 = 18.4mA 9
KP_IN(0:5) SLIDE_LED MLED_C2 F2
AF 37 18 7
MSMF05C-P
D501
KB_CAM MLED_C1 SETF VA503
KP_IN(0) 36 19 F1 = 160mA 4
END SHUTTER KP_OUT(0:5) MLED_A LDO1
LEFT RIGHT KP_IN(5) 35 20 6 5
REFBP LDO2
34 21
KP_OUT(0)
R512 R513 C515 C516
KP_OUT(1) 33 22 C517
V_SCROLL_2.8 7500ohm 5.1K 0.01u 1u 10u
F KP_OUT(2) 32 23
MOTOR_N
F
KP_IN(5) 31 24
KP_OUT(0:4)
SIDE KEY SPK_RCV_P
30 25
KP_OUT(0) L503 100nH 29 26
C519
KP_OUT(1) 28 27
47p
KP_OUT(2)
SPK_RCV_N
KP_OUT(3) L504 100nH G4 G3
KP_OUT(4)
G LD503 G
LEWWH25LA
MLED_A FLASH_LED_C
VA504
IN502 IN504
IN501 IN503
H Engineer:
H
Drawn by: JASON LG Electronics

R&D CHK: G.C.Lim TITLE: Size:
A3
DOC CTRL CHK: KE970/ME970 12 1 8 A
MFG ENGR CHK:

KEY FPCB
Changed by: Date Changed: Time Changed: QA CHK: REV: Drawing Number: Page:
mentor 2006-11-10 1.1 1/1
1 2 3 4 5 6 7 8 9 10 11 12
- 121 -
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10 11 12
A A
KEY INTERFACE CONNECTOR

LCD_Connector
2V72_IO CN601 VBAT 2V72_IO
G2 G1 CN602
54 1
1
53 2
2
52 3
C601 1u 3
B 51 4
4
B
50 5
DIF_RESET L_WR LCD_ID 5
49 6
L_D(0:7) L_CS 6
L_D(0) 48 7
L_CD 7
L_D(1) 47 8
LCD_IF_MODE 8
L_D(2) 46 9
HALL_EN 9
L_D(3) 45 10
SCROLL_KEY_B 10
44 11
SCROLL_KEY_A 11
L_D(4) 43 12
LCD_ID L_D(0:7) 12
L_D(5) 42 13
LCD_VSYNC 13
L_D(6) 41 14 L_D(0)
MLED_C5 14
L_D(7) 40 15 L_D(1)
MLED_C4 15
39 16 L_D(2)
MLED_C3 16
38 17 L_D(3)
SLIDE_LED MLED_C2 17
37 18 L_D(4)
KP_IN(0:5) MLED_C1 2V72_IO 18
36 19
KP_IN(0) MLED_A L_D(5)
19
KP_IN(5) 35 20 L_D(6)
KP_OUT(0:5) 20
KP_OUT(0) 34 21 L_D(7)
21
KP_OUT(1) 33 22
V_SCROLL_2.8 R601 22
KP_OUT(2) 32 23 100K
MOTOR_N DIF_RESET 23
C 31 24
L_WR 24
C
30 25
SPK_RCV_P 25
29 26
SPK_RCV_N C602 L_CS 26
28 27
0.1u L_CD 27
LCD_IF_MODE 28
G4 G3
29
LCD_VSYNC 30
R602 MLED_C5 31
NA MLED_C4 32
MLED_C3 33
MLED_C2 34
MLED_C1 35
MLED_A
IMSA-9671S-35Y902
D D
HALL EFFECT S/W(SCROLL)
HALL_EN
VBAT
SCROLL_KEY_A SCROLL_KEY_B
OUT601
VIBRATOR C603 1u
4
U601 U602 OUT602

MOTOR_N
OUT
PDN
OUT
PDN
EM-0611 EM-0611
V_SCROLL_2.8
VDD
VDD
VSS
VSS
E E
1
C604
NA
OUT603
SPEAKER
SPK_RCV_P
SPK_RCV_N OUT604
C605
NA
KEY_BACKLIGHT_LED VBAT
SCROLL_KEY PRE_CHARGING_LED LD601 R603 220

SLIDE_LED
F F
LD602 R604 220
601 602 603 SSC-TWH104-HL
MENU OK SERCH
KP_IN(0)
604 605
LEFT RIGHT
KP_IN(5)
D601
SCROLL_KEY_B
KP_OUT(0)
KP_OUT(1) SCROLL_KEY_A
KP_OUT(2)
KP_OUT(0)
KP_OUT(1)
VA601 VA602
G ICVL0505600V150FR ICVL0505600V150FR
KP_OUT(2)
G
MSMF05C-P
VISION MARK
TP601 TP602
H Engineer:
H
Drawn by: JASON LG Electronics

R&D CHK: G.C.LIM TITLE: Size:
A3
DOC CTRL CHK: KE970/ME970 12 1 8 A
MFG ENGR CHK:

LCD FPCB(LGIT/HITACHI)
Changed by: Date Changed: Time Changed: QA CHK: REV: Drawing Number: Page:
mentor 2006-10-15 1.1 1/1
1 2 3 4 5 6 7 8 9 10 11 12
- 122 -
8. PCB LAYOUT
- 123 -
8. PCB LAYOUT
- 124 -
8. PCB LAYOUT
- 125 -
8. PCB LAYOUT
- 126 -
8. PCB LAYOUT
- 127 -
8. PCB LAYOUT
- 128 -
9. RF Calibration
9. RF Calibration
9.1 Test Equipment Setup
4.00 V 0.000 A
9.2 Calibration Steps
9.2.1. Turn on the Phone.
9.2.2. Execute “HK_24.exe”
- 129 -
9. RF Calibration
9.2.3. Click “SETTING” Menu
9.2.4. Setup “Ezlooks” menu such as the following figure
- 130 -
9. RF Calibration
9.2.5. Setup “Line System” menu such as the following figure
Adjust the number of
9.2.6. Setup Logic operation such as the following figure.
Operation Mode
1. By-Pass: not control by GPIB
2. Normal : control by GPIB
Setup UART Port

PWR : Power Supply
CELL :Call-Test Equipment
- 131 -
9. RF Calibration
9.2.7. Select “MODEL”.
9.2.8. Click “START” for RF calibration
9.2.9. RF Calibration finishes.
- 132 -
10. Stand-alone Test
9.2.10. Calibration data will be saved to the following folder.
Saving format:
year/month/day_PASS
- 133 -
Notices:
1. The state of Phone is “ test mode “ during the CALIBRATION.
2. Calibration program automatically changes either “normal mode” or “ptest mode”.
3. RF Calibration steps as follow:
TX Channel compensation: EGSM->DCS->PCS->EDGE EGSM->EDGE DCS->EDGE PCS
RX Channel compensation: EGSM->DCS->PCS
4. Phone Operation Mode
- 134 -
10. Stand along
10. Stand along
10.1. Test Program Setting

1 Set COM Port.
2 Check PC Baud rate.
3 Confirm EEPROM & Delta file prefix name.
1 2
4 Click “Update Info” for communicating Phone and Test -Program.
Not Connected
- 135 -
10. Stand along
Connected
5 For the purpose of the Standalone Test, Change the Phone to “ptest mode” and then Click the
“Reset” bar.
6 Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished.
Change "ptest mood"
- 136 -
10. Stand along
10.2. Tx Test
1 Click “Non signaling mode” bar and then confirm “OK” text in the command line.
2 Put the number of TX Channel in the ARFCN.

3 Select “Tx” in the RF mode menu and “PCL” in the PA Level menu.
4 Finally, Click “Write All” bar and try the efficiency test of Phone.
- 137 -
10. Stand along
10.3. Rx Test
1 Put the number of RX Channel in the ARFCN.
2 Select “Rx” in the RF mode menu.
3 Finally, Click “Write All” bar and try the efficiency test of Phone.
2 3
4 The Phone must be changed “normal mode” after finishing Test.

5 Change the Phone to “normal mode” and then Click the “Reset” bar.
5
4
Change "normal mode"
- 138 -
11. ENGINEERING MODE
11. ENGINEERING MODE
Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided
by a handset. The key sequence for switching the engineering mode on is “2945#*#” Select. Pressing END
will switch back to non-engineering mode operation. Use Up and Down key to select a menu and press
‘select’ key to progress the test. Pressing back key will switch back to the original test menu.
[1] BB test [4] Call Timer [7] DRM Engineering Mode

[1-1] Battery Info [7-1] GetAllRoTable
[5] Factory Reset [7-2] GetRoTable
[1-1-1] BattInfo
[1-2] Bluetooth Test [6] MF Test
[1-2-1] Enter Test Mode [6-1] All Auto Test
[1-2-1-1] Audio Test
[6-2] Backlight
[1-2-1-2] RF Test
[6-2-1] Backlight On
[1-2-2] OnOff Test
[6-2-1] Backlight Off
[1-2-2-1] Bluetooth On
[6-3] Audio
[1-2-2-1] Bluetooth Off
[6-3-1] Audio test
[1-2-3] Headset Test
[6-4] Vibrator
[1-2-4] Communication Mode
[6-4-1] Vibrator on
[1-2-5] Xhtml compose print
[6-4-2] Vibrator off
[1-2-6] Xhtml Print Test
[6-5] LCD
[2] Model Version test [6-5-1] Auto LCD
[2-1] Version [6-6] Key pad

[6-7]Mic Speaker
[3] ENG MODE [6-8] Camera
[3-1] CELL ENVIRON [6-8-1] Camera Main Preview
[3-2] PS Layer Info [6-8-2] Flash On
[3-2-1] Mobility [6-8-2] Flash Off
[3-2-2] RadioRes
[3-2-3] Gprs
[3-3] LAYER1 INFO
[3-3-1] Close
[3-4] Reset Information
[3-4-1] Excpt
[3-5] Memory Configuration
[3-6] MenGenConf
[3-7] MemAllUse
[3-8] MemDetUse
[3-9] MemDump
[3-0] Change Frequency Band
[3-0-1] Close
- 139 -
- 140 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.1 EXPLODED VIEW
20
72 61
15 16
19 74
7 75 71
14
6 12
4 62
3 58
1 2 57
17 18
60
59
13
8
70 73
10
11
9 54 68
42
44 46 47 56
5 53
43 48
39 69
63 36 38
24 41
23 49
35
33
50
30
22 25
32 51
45
26 40
52
65 55
28 37
66
29 64
31
21 34
- 141 -
- 142 -
12.2 Replacement Parts Note: This Chapter is used for reference, Part order
<Mechanic component> is ordered by SBOM standard on GCSC
Location
Level Description Part Number Spec Color Remark
No
Aluminum
1 GSM(SLIDE) TGLL0006901
Silver
Aluminum
2 AAAY00 ADDITION AAAY0180102
Silver
3 MCJA00 COVER,BATTERY MCJA0037301 PRESS, STS, , , , , Silver 56
Aluminum
2 APEY00 PHONE APEY0370401 KE970 EUAAV
Silver
Aluminum
3 ACGM00 COVER ASSY,REAR ACGM0080801 KE970_COVER ASSY,REAR
Silver
4 MCCC00 CAP,EARPHONE JACK MCCC0043501 MOLD, Urethane Rubber S195A, , , , , Without Color 51
4 MCCF00 CAP,MOBILE SWITCH MCCF0037701 MOLD, Urethane Rubber S195A, , , , , Silver 46
4 MCJN00 COVER,REAR MCJN0059801 MOLD, PC LUPOY SC-1004A, , , , , Black 45
4 MDAD00 DECO,CAMERA MDAD0026901 ELECTROFORMING, Ni, , , , , Silver 54
4 MLAB00 LABEL,A/S MLAB0000601 HUMIDITY STICKER Without Color
4 MLCE00 LENS,FLASH MLCE0007001 MOLD, PMMA HI835M, , , , , Transparent 48
4 MLEA00 LOCKER,BATTERY MLEA0034801 MOLD, POM LUCEL FW-700A, , , , , Silver 42
4 MPBT00 PAD,CAMERA MPBT0034201 COMPLEX, (empty), , , , , Black 67
4 MPBZ00 PAD MPBZ0157301 COMPLEX, (empty), , , , , Black 66
4 MPBZ01 PAD MPBZ0173201 COMPLEX, (empty), , , , , Without Color 41
4 MSDB00 SPRING,COIL MSDB0003701 COMPLEX, (empty), , , , , Without Color 43
4 MTAA00 TAPE,DECO MTAA0127001 COMPLEX, (empty), , , , , Without Color 53
4 MTAB01 TAPE,PROTECTION MTAB0159501 COMPLEX, (empty), , , , , Without Color 68
4 MTAD00 TAPE,WINDOW MTAD0060201 COMPLEX, (empty), , , , , Without Color 49
4 MTAZ00 TAPE MTAZ0162601 COMPLEX, (empty), , , , , Without Color 47
4 MTAZ01 TAPE MTAZ0171701 COMPLEX, (empty), , , , , Without Color
4 MWAE00 WINDOW,CAMERA MWAE0021701 COMPLEX, (empty), , , , , Black 50
Aluminum
3 ACGQ00 COVER ASSY,SLIDE ACGQ0013501 KE970/ME970_COVER ASSY,SLIDE
Silver
Aluminum
4 ACGK00 COVER ASSY,FRONT ACGK0081001 ME970_ COVER ASSY,FRONT
Silver
5 MBJL00 BUTTON,SIDE MBJL0036601 MOLD, PC LUPOY SC-1004A, , , , , Silver 21
5 MCJK00 COVER,FRONT MCJK0065401 MOLD, PC LUPOY SC-1004A, , , , , Silver 23
5 MDAG00 DECO,FRONT MDAG0024901 MOLD, POM LUCEL FW-700A, , , , , Gray 22
5 MFBD00 FILTER,MIKE MFBD0018901 COMPLEX, (empty), , , , , Black 29
5 MGAZ00 GASKET MGAZ0052401 COMPLEX, (empty), , , , , Silver 30
5 MICZ00 INSERT MICZ0028801 COMPLEX, (empty), , , , , Gold 28
- 143 -
Location
No
5 MICZ01 INSERT MICZ0028901 COMPLEX, (empty), , , , , Gold 24
5 MTAB00 TAPE,PROTECTION MTAB0140001 COMPLEX, (empty), , , , , Green 34
COVER Aluminum
4 ACGR00 ACGR0009201
ASSY,SLIDE(LOWER) Silver
Aluminum
5 MCJV00 COVER,SLIDE(LOWER) MCJV0009401 MOLD, PC LUPOY SC-1004A, , , , , 19
Silver
Aluminum
5 MGAD00 GASKET,SHIELD FORM MGAD0132401 COMPLEX, (empty), , , , , 73
Silver
5 MGDA00 GUIDE,LEFT MGDA0007001 MOLD, POM LUCEL N109-LD, , , , , Gray
5 MGDB00 GUIDE,RIGHT MGDB0002901 MOLD, POM LUCEL N109-LD, , , , , Gray
5 MICZ00 INSERT MICZ0024601 C4605BD,M1.4x0.3pitch,1.7T,2.5PI Without Color
5 MICZ01 INSERT MICZ0028501 COMPLEX, (empty), , , , , Without Color
5 MMAA00 MAGNET,SWITCH MMAA0006901 COMPLEX, (empty), , , , , Without Color
Aluminum
5 MPBJ00 PAD,MOTOR MPBJ0039301 COMPLEX, (empty), , , , , 18
Silver
COVER
4 ACGS00 ACGS0011701 Silver
ASSY,SLIDE(UPPER)
5 MCJW00 COVER,SLIDE(UPPER) MCJW0009201 PRESS, STS, , , , , Without Color 4
6 MDAY00 DECO MDAY0034001 PRESS, STS, , , , , Without Color
6 MFEZ00 FRAME MFEZ0011801 PRESS, STS, , , , , Without Color
6 MICZ00 INSERT MICZ0028401 PRESS, STS, , , , , Without Color
6 MICZ01 INSERT MICZ0029301 COMPLEX, (empty), , , , , Without Color
5 MFBC00 FILTER,SPEAKER MFBC0025301 PRESS, STS, , , , , Black 57
5 MPBG00 PAD,LCD MPBG0056801 COMPLEX, (empty), , , , , Black 6
5 MTAA00 TAPE,DECO MTAA0132401 COMPLEX, (empty), , , , , Without Color 58
5 MTAD00 TAPE,WINDOW MTAD0064801 COMPLEX, (empty), , , , , Without Color 3
1.4 mm,2.7 mm,MSWR3(BK) ,N ,+ , ,; ,[empty] ,[empty] , ,

4 GMEY01 SCREW MACHINE,BIND GMEY0015401 Black 10
,[empty] ,BLACK ,[empty] ,[empty]
4 GMZZ00 SCREW MACHINE GMZZ0017701 1.4 mm,3.0 mm,MSWR3 ,N ,+ ,- , Silver 11,62,64
1.4 mm,1.5 mm,MSWR3(FN) ,B ,+ ,- , ,; ,[empty] ,[empty]

4 GMZZ01 SCREW MACHINE GMZZ0023501 Silver 63,70
, , ,[empty] ,SILVER ,[empty] ,[empty]
1.4 mm,3.75 mm,MSWR3(BK) ,N ,+ ,- , ,; ,[empty]

4 GMZZ02 SCREW MACHINE GMZZ0023601 61
,[empty] , , ,[empty] ,BLACK ,[empty] ,[empty]
4 MBJA00 BUTTON,DIAL MBJA0022401 COMPLEX, (empty), , , , , Without Color 32
4 MCCH00 CAP,SCREW MCCH0100901 COMPLEX, (empty), , , , , Silver 20
4 MDAY00 DECO MDAY0035401 CASTING, Zn Alloy, , , , , Silver 8
4 MGAD00 GASKET,SHIELD FORM MGAD0131001 COMPLEX, (empty), , , , , Gold
- 144 -
Location
No
4 MKAC00 KEYPAD,FUNCTION MKAC0009001 COMPLEX, (empty), , , , , Without Color 5
4 MLAC00 LABEL,BARCODE MLAC0003401 EZ LOOKS(user for mechanical) Without Color
4 MPBJ00 PAD,MOTOR MPBJ0040801 COMPLEX, (empty), , , , , Black 16
4 MPBZ00 PAD MPBZ0183101 COMPLEX, (empty), , , , , Black

Aluminum
4 MRAA00 RAIL,SLIDE MRAA0004801 COMPLEX, (empty), , , , , 71
Silver
4 MTAC00 TAPE,SHIELD MTAC0044801 COMPLEX, (empty), , , , , Blue
4 MTAZ00 TAPE MTAZ0192001 COMPLEX, (empty), , , , , Without Color
4 MWAC00 WINDOW,LCD MWAC0073501 COMPLEX, (empty), , , , , Without Color 2
6 ADCA00 DOME ASSY,METAL ADCA0060201 Without Color 33
3 GMEY00 SCREW MACHINE,BIND GMEY0009201 1.4 mm,3.5 mm,MSWR3(BK) ,B ,+ ,HEAD D=2.7mm Black 69
3 MCCH00 CAP,SCREW MCCH0097401 MOLD, Urethane Rubber S195A, , , , , Without Color 52
3 MLAK00 LABEL,MODEL MLAK0006301 LG (30.5x21.5 4-1R) Pearl White
5 MCBA00 CAN,SHIELD MCBA0012801 PRESS, STS, , , , , Silver 36
6 MPBZ00 PAD MPBZ0180401 COMPLEX, (empty), , , , , Black
5 MCBA01 CAN,SHIELD MCBA0012901 PRESS, STS, , , , , Silver 39
6 MGAD00 GASKET,SHIELD FORM MGAD0132601 COMPLEX, (empty), , , , , Gold
6 MSAZ00 SHEET MSAZ0044001 COMPLEX, (empty), , , , , Silver
5 MLAZ00 LABEL MLAZ0038301 PID Label 4 Array Without Color
- 145 -
<Main component> Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
Location
No
3.0 ,-2.0 dBd,, ,bluetooth, internal ,; ,SINGLE ,-2.0 ,50
4 SNGF00 ANTENNA,GSM,FIXED SNGF0022601 44
,3.0
4 ESQY00 SWITCH,ROTARY ESQY0000801 1 V,1 A,VERTICAL ,1 G, 9
4 SACY00 PCB ASSY,FLEXIBLE SACY0054601 Slide LCD FPCB 14
PCB
5 SACB00 SACB0034801 Slide LCD FPCB
ASSY,FLEXIBLE,INSERT
6 MSAZ00 SHEET MSAZ0042501 COMPLEX, (empty), , , , , Without Color 13
5 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0049301 Slide LCD FPCB
PCB ASSY,FLEXIBLE,SMT
6 SACC00 SACC0029401 Slide LCD FPCB
BOTTOM
7 C601 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
7 C602 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
7 CN602 CONNECTOR,FFC/FPC ENQY0012201 35 PIN,0.3 mm,ETC , ,H=1.0
7 D601 DIODE,TVS EDTY0008604 SOT-563 ,6 V,100 W,R/TP ,PB-FREE
7 LD601 DIODE,LED,CHIP EDLH0011901 WHITE ,1608 ,R/TP ,PB-FREE(ZENER)
7 LD602 DIODE,LED,CHIP EDLH0011901 WHITE ,1608 ,R/TP ,PB-FREE(ZENER)
7 R601 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
7 U601 IC EUSY0311501 ,4 PIN,R/TP ,1.8X1.2 size Hall IC for FD JOG Dial
7 U602 IC EUSY0311501 ,4 PIN,R/TP ,1.8X1.2 size Hall IC for FD JOG Dial
7 VA601 VARISTOR SEVY0003602 5.6 V, ,SMD ,1005, 60pF
6 SACD00 SACD0040201 Slide LCD FPCB
TOP
CONNECTOR,BOARD TO
7 CN601 ENBY0023701 54 PIN,0.4 mm,ETC , ,H=0.9, Socket
BOARD
PCB
5 SACB00 SACB0034901 Key FPCB Ass'y
ASSY,FLEXIBLE,INSERT
6 SACC00 SACC0029501 Key FPCB Ass'y
BOTTOM
7 C502 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
7 C503 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
CONNECTOR,BOARD TO
7 CN501 ENBY0017201 70 PIN,0.4 mm,STRAIGHT ,AU ,FEMALE
BOARD
6 SACD00 SACD0040301 Key FPCB Ass'y
TOP
- 146 -
Location
No
7 C509 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
7 C515 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
CONNECTOR,BOARD TO
7 CN502 ENBY0023601 54 PIN,0.4 mm,ETC , ,H=0.9, Header
BOARD
7 KB_CAM SWITCH,TACT ESCY0004201 12 V,0.02 A,HORIZONTAL ,0.2 G,
7 L501 INDUCTOR,CHIP ELCH0010402 270 nH,M ,1005 ,R/TP ,CHIP
7 L503 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP ,
WHITE ,ETC ,R/TP ,SIDEVIEW ,; ,[empty] ,2.9~3.75

7 LD501 DIODE,LED,CHIP EDLH0013701
,30mA , , ,120mW ,[empty] ,[empty] ,2P
WHITE ,ETC ,R/TP ,SIDEVIEW ,; ,[empty] ,2.9~3.75

7 LD502 DIODE,LED,CHIP EDLH0013701
,30mA , , ,120mW ,[empty] ,[empty] ,2P
7 LD503 DIODE,LED,MODULE EDLM0008601 WHITE ,1 LED,2.0*1.5*0.45 ,R/TP ,PB-FREE
7 MIC501 MICROPHONE SUMY0010508 PIN ,42 dB,4*4 ,SMD Bridge Type
7 Q501 TR,BJT,NPN EQBN0013701 EMT6 ,150 mW,R/TP ,DUAL TRANSISTORS
7 R501 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
7 R509 RES,CHIP,MAKER ERHZ0000410 12 ohm,1/16W ,J ,1005 ,R/TP
7 R512 RES,CHIP,MAKER ERHZ0000346 7500 ohm,1/16W ,F ,1005 ,R/TP
7 R513 RES,CHIP,MAKER ERHZ0000294 5100 ohm,1/16W ,F ,1005 ,R/TP
- 147 -
Location
No
7 U501 IC EUSY0295501 TQFN , PIN,R/TP ,6 BLU+2 LDO+1 Flash LED Drv, 4*4
7 VA503 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005
POLYI , 0.28mm,3-1-3 RF ,KE/ME970 KEY FPCB ,; , , , ,

6 SPCY00 PCB,FLEXIBLE SPCY0088201 35
,,,,,
4 SJMY00 VIBRATOR,MOTOR SJMY0008404 3 V,80 mA,10*2.7 , ,; ,3V ,55mA , ,12000 , , , , 17
5 ELCH00 INDUCTOR,CHIP ELCH0004711 22 nH,J ,1005 ,R/TP ,
5 ELCH01 INDUCTOR,CHIP ELCH0005807 5.6 nH,S ,1005 ,R/TP ,
5 ENWY00 CONN,RF SWITCH ENWY0003901 ,SMD , dB,
5 ERHZ00 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
3.0 ,-2.0 dBd,, ,internal, GSM900/1800/1900 ,; ,TRIPLE ,-

5 SNGF00 ANTENNA,GSM,FIXED SNGF0022501 31
2.0 ,50 ,3.0
4 SUSY00 SPEAKER SUSY0024101 ASSY ,8 ohm,88 dB, mm, ,; , , , , ,750 ,18*10*3T ,WIRE 15
4 SVLM00 LCD MODULE SVLM0021001 MAIN ,240*320 ,37.9*53.9 ,262k ,TFT ,TM ,HM15CP200 , 12
3 SAFY00 PCB ASSY,MAIN SAFY0179902
4 SAFB00 PCB ASSY,MAIN,INSERT SAFB0064701
5 SVCY00 CAMERA SVCY0012801 CMOS ,MEGA ,2M AF (FPCB, 1/4", SOC2020) 37
91 mm,2 LINE, ,; ,[empty] ,[empty] ,[empty] , ,WHITE ,

5 SWCC00 CABLE,COAXIAL SWCC0003901 40
,[empty]
4 SAFF00 PCB ASSY,MAIN,SMT SAFF0101102
PCB ASSY,MAIN,SMT
5 SAFC00 SAFC0081801
BOTTOM
2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67,

6 BAT301 BATTERY,CELL,LITHIUM SBCL0001701
phi 4.8, Pb-Free
6 C101 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
6 C111 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
- 148 -
Location
No
6 C131 CAP,CHIP,MAKER ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP
6 C137 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
6 C138 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
6 C204 CAP,CERAMIC,CHIP ECCH0009103 100 pF,50V ,J ,X7R ,TC ,0603 ,R/TP
6 C209 CAP,CERAMIC,CHIP ECCH0009514 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP
6 C210 CAP,CERAMIC,CHIP ECCH0009506 27 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP
- 149 -
Location
No
6 C215 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C227 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP
6 C247 CAP,CERAMIC,CHIP ECCH0009512 1000 pF,25V ,K ,X7R ,HD ,0603 ,R/TP
- 150 -
Location
No
6 C329 CAP,CERAMIC,CHIP ECCH0009110 22 nF,6.3V ,K ,X7R ,TC ,0603 ,R/TP
6 C330 CAP,CERAMIC,CHIP ECCH0009514 10 pF,25V ,D ,X7R ,HD ,0603 ,R/TP
6 C331 CAP,CERAMIC,CHIP ECCH0009110 22 nF,6.3V ,K ,X7R ,TC ,0603 ,R/TP
6 C343 CAP,CHIP,MAKER ECZH0000803 2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C401 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 CN201 CONNECTOR,ETC ENZY0019401 3 PIN,3.0 mm,ETC , ,H=5.3
CONNECTOR,BOARD TO
6 CN302 ENBY0017301 70 PIN,0.4 mm,STRAIGHT ,AU ,MALE
BOARD
6 CN303 CONNECTOR,I/O ENRY0006501 18 PIN,0.4 mm,ETC , ,1.2 Offset
- 151 -
Location
No
6 FB201 FILTER,BEAD,CHIP SFBH0001003 220 ohm,2012 ,
6 FL302 FILTER,EMI/POWER SFEY0012901 SMD ,TDFN,100Ohm & 15pF / 15kV
6 FL308 FILTER,DIELECTRIC SFDY0001601 2450 MHz,2.0*1.25 ,SMD ,Pb-free_Bluetooth_Dielectric
6 L201 INDUCTOR,SMD,POWER ELCP0005104 10 uH,M ,3.8*3.8*1.8 ,R/TP ,power inductor/ 850mA
6 L304 INDUCTOR,CHIP ELCH0001411 1.2 nH,S ,1005 ,R/TP ,PBFREE
6 Q301 TR,BJT,NPN EQBN0007101 EMT3 ,0.15 W,R/TP ,LOW FREQUENCY
6 R101 RES,CHIP,MAKER ERHZ0000488 4.7 ohm,1/16W ,J ,1005 ,R/TP
6 R102 RES,CHIP ERHY0009517 22 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R103 RES,CHIP ERHY0009522 3.3 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R104 RES,CHIP ERHY0000166 390 Kohm,1/16W ,F ,1005 ,R/TP
6 R105 RES,CHIP,MAKER ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP
6 R107 RES,CHIP ERHY0009501 0 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
6 R203 RES,CHIP ERHY0011901 47 mohm,1/4W ,F ,2012 ,R/TP
- 152 -
Location
No
6 R210 RES,CHIP ERHY0000278 82K ohm,1/16W,J,1005,R/TP
6 R320 RES,CHIP ERHY0009507 1 Mohm,1/20W(0.05W) ,J ,0603 ,R/TP
BGA ,105 PIN,R/TP ,1G Nor+256MSDRAM, 1 8V

6 U101 IC EUSY0302101
I/O(Sibely)
6 U103 IC EUSY0274601 BGA ,293 PIN,R/TP ,EDGE BASE BAND S-GOLD2
SOT23-5 ,5 PIN,R/TP ,2.5V Sense voltage(max), current

6 U201 IC EUSY0286901
monitor
6 U203 IC EUSY0269101 PG-VQFN-48 ,48 PIN,R/TP ,PMIC, Pb Free
6 U204 IC EUSY0304401 DFN ,10 PIN,R/TP ,2.8V/3.3V 300mA Dual LDO
SC70 ,5 PIN,R/TP ,Comparator, pin compatible to

6 U306 IC EUSY0250501
EUSY0077701
6 U401 IC EUSY0279801 SC70 ,6 PIN,R/TP ,Dual Buffer, Pb Free
- 153 -
Location
No
6 VA305 DIODE,TVS EDTY0009101 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4
6 VA306 DIODE,TVS EDTY0009101 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4
32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9

6 X101 X-TAL EXXY0018701
,
5 SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0080601
6 C235 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP
6 C240 CAP,TANTAL,CHIP,MAKER ECTZ0004203 68 uF,6.3V ,M ,STD ,3216 ,R/TP
6 C252 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP
6 C260 CAP,CHIP,MAKER ECZH0003121 68 nF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C264 CAP,TANTAL,CHIP,MAKER ECTZ0006301 100 uF,4V ,M ,L_ESR ,3216 ,R/TP
6 C266 CAP,TANTAL,CHIP,MAKER ECTZ0006301 100 uF,4V ,M ,L_ESR ,3216 ,R/TP
6 C270 CAP,CHIP,MAKER ECZH0003121 68 nF,10V ,K ,X7R ,HD ,1005 ,R/TP
- 154 -
Location
No
6 C342 CAP,TANTAL,CHIP,MAKER ECTZ0000318 33 uF,10V ,M ,STD ,3216 ,R/TP
6 C404 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
6 C407 CAP,CERAMIC,CHIP ECCH0000701 1.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C409 CAP,CHIP,MAKER ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
6 C413 CAP,TANTAL,CHIP,MAKER ECTZ0004203 68 uF,6.3V ,M ,STD ,3216 ,R/TP
6 C416 CAP,CERAMIC,CHIP ECCH0004906 2.5 pF,50V ,C ,X7R ,TC ,1005 ,R/TP
6 C417 CAP,CERAMIC,CHIP ECCH0004906 2.5 pF,50V ,C ,X7R ,TC ,1005 ,R/TP
6 C420 CAP,CHIP,MAKER ECZH0000822 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C421 CAP,CHIP,MAKER ECZH0000822 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C436 CAP,CERAMIC,CHIP ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP
6 C444 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP
- 155 -
Location
No
6 CN202 CONN,SOCKET ENSY0017901 14 PIN,ETC , ,2.54 mm,Micro-SD, UIM Dupli Socket
CONNECTOR,BOARD TO
6 CN301 ENBY0015601 34 PIN,0.4 mm,STRAIGHT ,AU ,0.9MM HEIGHT
BOARD
6 CN401 CONN,RF SWITCH ENWY0004001 ,SMD ,1.3 dB,
SOD-123 ,40 V,1 A,R/TP , ,; , , , , , , ,[empty] ,[empty] ,2P

6 D201 DIODE,SWITCHING EDSY0017701
,1
6 FB301 FILTER,BEAD,CHIP SFBH0007102 10 ohm,1005 ,Ferrite Bead
850.900 ,1800.1900 ,3.5 dB,3.5 dB, dB, dB,ETC

6 FL401 FILTER,SEPERATOR SFAY0009001
,5.4X3.2X1.2 Size, Quad FEM
6 L402 INDUCTOR,CHIP ELCH0001413 22 nH,J ,1005 ,R/TP ,PBFREE
6 L403 INDUCTOR,CHIP ELCH0001402 18 nH,J ,1005 ,R/TP ,Pb Free
NTC ,10000 ohm,SMD ,1005, 3350~3399k, J, R/T,

6 PT401 THERMISTOR SETY0006301
PBFREE
6 Q201 TR,FET,P-CHANNEL EQFP0008301 TSOP-6 ,1.14 W,-30 V,-3.7 A,R/TP ,P-Channel FET
SOT-323 ,.29 W,1.8 V,.86 A,R/TP ,P-Chanel MOSFET,

6 Q202 TR,FET,P-CHANNEL EQFP0004501
Pb free
6 R209 RES,CHIP ERHY0009560 33 Kohm,1/20W(0.05W) ,F ,0603 ,R/TP
6 R221 RES,CHIP ERHY0000715 0.15 ohm,1/8W ,F ,2012 ,R/TP
- 156 -
Location
No
6 R406 RES,CHIP ERHY0000101 0 ohm,1/16W,F,1005,R/TP
6 R407 RES,CHIP ERHY0000101 0 ohm,1/16W,F,1005,R/TP
6 R411 RES,CHIP ERHY0000185 820 ohm,1/16W ,F ,1005 ,R/TP
- 157 -
Location
No
6 SPFY00 PCB,MAIN SPFY0136901 FR-4 ,0.8 mm,STAGGERED-10 , ,; , , , , , , , , , 38
6 SW401 CONN,RF SWITCH ENWY0002304 STRAIGHT ,SMD ,0.8 dB,MUSE MODEL
DFN ,8 PIN,R/TP ,Li-ion charger IC, 8 Ld 2 x 3 DFN, Pb-

6 U202 IC EUSY0292601
free
WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog

6 U205 IC EUSY0300101
Switch, PB-Free
6 U206 IC EUSY0314501 QFN ,16 PIN,R/TP ,
Output capless audio subsystem with 3D ,24 PIN,R/TP

6 U207 IC EUSY0309801
,NS subsystem audio amp
WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog

6 U208 IC EUSY0300101
Switch, PB-Free
SOT-23 ,3 PIN,R/TP ,DC MOTOR DRIVER /

6 U302 IC EUSY0160401
INTEGERATED RELAY
6 U304 IC EUSY0319201 DFN ,10 PIN,R/TP ,OVP
6 U402 PAM SMPY0012301 dBm, %, A, dBc, dB, ,SMD ,
6 U403 IC EUSY0274801 VQFN ,40 PIN,R/TP ,GPRS, EDGE TRANSCEIVER
26 MHz,2 PPM,10 pF,SMD ,3.2*2.5*0.9 ,2.5ppm at -20 to

6 X401 VCTCXO EXSK0005603
+75, AFC 0.5V to 2.5V, Supply 2.6V
- 158 -
12.3 Accessory Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
Location
No
3.7 V,800 mAh,1 CELL,PRISMATIC ,CMW PJT BATT,
Innerpack, Europe Label, Pb-Free ,; ,3.7 ,800 ,0.2C
3 SBPL00 BATTERY PACK,LI-ION SBPL0085703 AIRY BLUE 55
,PRISMATIC ,43x34x46 , ,ALLTEL SILVER ,Innerpack
,CMW Slide & Folder
3 SGDY00 DATA CABLE SGDY0010901 LG-US03K ,18pin USB DataCable
EAR PHONE/EAR MIKE ; ,40mW ,16 OHM ,100dB ,F0 ,10KHZ ,[empty] ,[empty]
3 SGEY00 SGEY0005526
SET ,18P MMI CONNECTOR ,SILVER,LG MARK
3 SSAD00 ADAPTOR,AC-DC SSAD0021002 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug
- 159 -
Note
Note

Ke970 SVC Eng 070115

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Ke970 SVC Eng 070115

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Service Manual

Date: January, 2007 / Issue 1.0

G.C. LIM 2006/03/29 0.1

1.2. Regulatory Information

E. Notice of Radiated Emissions

G. Interference and Attenuation

H. Electrostatic Sensitive Devices

APC Automatic Power Control

BER Bit Error Ratio

CC-CV Constant Current - Constant Voltage

CLA Cigar Lighter Adapter

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milli-watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GPRS General Packet Radio Service

GSM Global System for Mobile Communications

IPUI International Portable User Identity

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

STMR Side Tone Masking Rating

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

WAP Wireless Application Protocol

2.1 H/W Feature

Standard Battery Li-ion, 800mAh

AVG TCVR Current 280mA PL5

Standby Current <2.7mA @PP9

Talk time 3hours (GSM TX Level 7)

Standby time 277 hours (Paging Period:9, RSSI: -85dBm)

Charging time 3 hours

RX Sensitivity GSM900 : -105dBm, DCS/PCS : -105dBm

GSM900: 32dBm (Level 5)

GPRS compatibility Class 10

SIM card type 3V Small

ANT Built in antenna

Speech coding EFR/FR/AMR

Data and Fax Yes

Voice Recoding Yes

Travel Adapter Yes