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INTRODUCTION
installed on the same side of substrate or surface. Substrate can be ceramic, paper
Many but not all through whole components have a surface mountable
e.g.
High capacity capacitor and power transformers, still most circuit can
be assembled, using SMT, even though some conventional through hole components
are required.
know the general physical configuration and operating parameters of various SMC’s.
1. Chip resister :
These are most widely produced of all SMC’s. They are originally
developed for used in hybrid micro circuit. The chip registers are leadless registers.
The typical size of resisters are 1.6 × 3.2 mm., 1.4 × 2 mm, 2.6 × 3.3
mm. The resistance range of most chip resistor is 10 Ω to 2.2 MΩ some companies
2. Chip Capacitor :
b) Electrolytic
c) Tantalum
Ceramic multi layer chip capacitors are commonly used. They are
stable and highly reliable. The capacitance value available are from 1 PF to 1 µF.
Package style is identical to chip resister. The size of chip capacitor depends on the
value of capacitor.
Tantalum capacitors are available for the values of 0.1 µF to 100 µF. Aluminium
electrolytic capacitors are larger than that of tantalum. Tantalum capacitors are
3. Potentiometer :
surface mountable configuration. They are made from ceramic or high temperature
single term trimmer is 4 x 4 mm. Multi terms trimmers are not designed for repeated
adjustments. They can be adjusted mostly 10 times. The trimmers are designed to
4. Inductors :
Many kind of surface mountable lead and leadless inductors and even
transformers are available. Inductance’s value ranges from few 10’s of nano henry to
5. Descript Semiconductors :
for diodes. The SOT ( Small outline transistor ) packages are used for transistors,
semiconductor.
i.e. small outlet device occupies 1/4th board space of an equipment ( Dual In Line
Package ) DIP.
There are many other surface mountable devices available like photo
relays.
machine.
board from 1000 to 5 lakhs components per hour. There are three other categories of
CONDUCTING BONDING
to circuit board pads. Conductive adhesive also used, both methods are important.
TYPES OF SOLDERING
1) Hand soldering.
2) Wave soldering.
3) Reflow soldering.
In hand soldering the soldering paste is applied to the board and the
SMC’s. The simplest form of reflow soldering occurs when tinned terminals and
thickly tinned pad is heated by soldering iron or other means. Until the two tinned
the conductive traces. They are relatively easy to use and they eliminate thermal
contain conductive powder in one or two part base. The most common conductive
powder in order of increasing resistance includes gold, silver, copper, nickel, carbon
and graphite. Adhesive base includes urathene, polyster and one or two part epoxies.
dispenser, just like tooth paste and automatically metered gringe or a piece of wire.
ordinary soldering iron or hot air gun. The SMC’s can be removed after adhesive
becomes soften. A new SMCs can be bonded to the same location by reheating the
adhesive.
The major draw back of conductive adhesive is cost, self life, remains
ADVANTAGES OF SMT
There are various advantages of SMT.
1. Reduce Circuit Board Size : The compact size of SMC’s considerably reduces
2. Light in weight : SMC’s are lighter than their through hole counter port. e.g.
8 – pin DIP, LM 308 M opamp weighs 600 mg. The so package vargen of same
IC Weighs 60 gm.
3. The low weight of SMC’s and smaller circuit board together gives 5 to 1 weight
advantages over conventional board. Also SMT boards are thin therefore they
4. Double – Sided Circuit Board : SMT can also used double sided board with an
circuits.
climinated. SMC’s have no wire leads to cut, bend and insert. Therefore SMT
7. Lower Cost : The SMC’s cost is generally more, till SMT can reduce over all
board cost for variety of reasons. e.g. saving of 40% cost results from elimination
8. Other Advantages : Some advantages of SMT are less obvious than above.
DISADVANTAGES OF SMT
1. SMC Standardisation : The same SMC from two different manufacturers may
2. SMC Availability : Some 15,000 components are available as SMC but not all
3. High start up expenses : The start up cost of SMT for both manufacturers and
inspection particularly for solder ball, improperly soldered joints and missed soldver
connections, etc.
(Plastic Loaded Chip Carrier) i.e. IC having J – profile pins along each four sides and
equipment. Whether testing is done by hand or automatically the test probes should
be touch to SMC’s solder pad or their conductive traces. The test probes should not
be touch to terminals of SMC’s properly designed SMT boards have test point
location. Replacing defective SMC’s required more patience and care because they
are very small and are placed very closed to other components.
and nearby SMC’s. When solder melts SMC’s should be twisted before it is lifted
from the board to broke the solder surface tension otherwise solder pad may comes
Installing new SMC is not difficult just place the SMC and heat its
terminal for best result and old solder should be removed using desoldering tools.
CONCLUSION
than the conventional circuit board. Because it reduces the size of circuit board, cost,
weight etc.
the postal stamp. Also the circuit can be mounted on both sides of the circuit board.
So now a days it is used in mobile, calculator or the circuit where small space circuit
is required.
REFERENCE
- By Harper
Internal Electrode
Secondary Electrode
Protective Glass
Overcoat
External
Electrode
(Solder)
Ceramic
Substrate Register
External Electrode
(Solder)
Ceramic
Substrate
Interleaved
Electrodes Dielectric
INSIDE A CERAMIC CHIP CAPACITOR
Gull Wing
J - Lead
SOP PLCC
PCB
Discrete Component
MSP
Butt Lead
PCB
Through Hole
Soldered
DISCRETE COMPONENTS SOLDERED ON OPPOSITE SIDE OF
COMPONENT SIDE
SOP PLCC
PCB
Discrete Component
MSP
Component
Coat
COMPONENTS SUBSTRATES
Govt. Poly. Washim 15
SOLDER
ELECTRICAL
INSPECTION
REFLOW
DEVICE
PASTE
CLEANING
BAKE
PLACEMENT
SOLDERING
&SCREEN
REWORK
TEST INVERT BOARD
Surface Mount Technology