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X
CC
GROUND
OUTPUT
SUPPLY
The three package styles available provide a magnetically optimized package for most applications. Suffix LT is a miniature SOT89/TO243AA transistor package for surface-mount applications; suffix UA features wire leads for through-hole mounting. Prefix UGN devices are rated for continuous operation over the temperature range of -20C to +85C, prefix UGS devices over an extended range of -40C to +125C, and prefix UGL devices over the range of -40C to +150C.
FEATURES
s 4.5 V to 24 V Operation s Reverse Battery Protection s Superior Temperature Stability s Superior Supply Voltage Stability
Dwg. PH-003A
s Activate with Multi-Pole Ring Magnets s Solid-State Reliability s Small Size s Constant Output Amplitude s Resistant to Physical Stress
Always order by complete part number including prefix and suffix, e.g., UGN3132LT .
VCC
REG.
OUTPUT GROUND
Dwg. FH-005-2
NOTE: As used here, negative flux densities are defined as less than zero (algebraic convention.) Typical values are at TA = +25C and VCC = 12 V. 1 gauss (G) is exactly equal to 0.1 millitesla (mT). * Complete part number includes a prefix denoting operating temperature range (UGL, UGN, or UGS) and a suffix denoting package type (LT or UA).
115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 Copyright 1996, 2003 Allegro MicroSystems, Inc.
40
40
OPERATE POINT 20
OPERATE POINT
20
VCC = 12 V I OUT = 20 mA
T A = 25C I OUT = 20 mA
-40 -50
-25
25
50
75
100
125
-40 4.0
8.0
12
16
20
24
28
Dwg. GH-021
AMBIENT TEMPERATURE IN C
Dwg. GH-022
200
6.0
I OUT = 20 mA
B B OP
VCC = 12 V
SATURATION VOLTAGE IN mV
SUPPLY CURRENT IN mA
175
5.0
150
4.0 B B RP
125
100 -50
-25
25
50
75
100
125
3.0 -50
-25
25
50
75
100
125
AMBIENT TEMPERATURE IN C
Dwg. GH-024
AMBIENT TEMPERATURE IN C
Dwg. GH-023
Powering up in the absence of a magnetic field (less than BOP and higher than BRP) will allow an indeterminate output state. The correct state is warranted after the first excursion beyond BOP or BRP.
Bipolar switches may switch on removal of field but require field reversal for reliable operation over temperature range; latches will not switch on removal of magnetic field.
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SUFFIX LT
ACTIVE AREA DEPTH 0.0305" 0.775 mm NOM 0.089" 2.26 mm
0.043" 1.09 mm
A
1 2 3
Dwg. MH-008-2D
SUFFIX UA
ACTIVE AREA DEPTH 0.0195" 0.50 mm NOM 0.082" 2.07 mm
The products described herein are manufactured under one or more of the following U.S. patents: 5,045,920; 5,264,783; 5,442,283; 5,389,889; 5,581,179; 5,517,112; 5,619,137; 5,621,319; 5,650,719; 5,686,894; 5,694,038; 5,729,130; 5,917,320; and other patents pending. Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro products are not authorized for use as critical components in life-support appliances, devices, or systems without express written approval. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use; nor for any infringements of patents or other rights of third parties that may result from its use.
A
BRANDED SURFACE 1 2 3
0.055" 1.39 mm
Dwg. MH-011-10A
Allegro
115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000
PACKAGE DESIGNATOR LT
(SOT89/TO-243AA) Dimensions in Inches (for reference only) Dimensions in Millimeters (controlling dimensions)
0.063 0.055
0.0173 0.0138
1.60 1.40
0.44 0.35
0.090 0.084
2.29 2.13
1 0.028
TYP
1 0.7
TYP
Pads 1, 2, 3, and A Standard SOT89 Layout Pads 1, 2, 3, and B Low-Stress Version Pads 1, 2, and 3 only Lowest Stress, But Not Self Aligning
Dwg. MA-012-3 in
Pads 1, 2, 3, and A Standard SOT89 Layout Pads 1, 2, 3, and B Low-Stress Version Pads 1, 2, and 3 only Lowest Stress, But Not Self Aligning
Dwg. MA-012-3 mm
NOTES: 1. Exact body and lead configuration at vendors option within limits shown. 2. Supplied in bulk pack (500 pieces per bag) or add "TR" to part number for tape and reel. 3. Only low-temperature (240C) reflow-soldering techniques are recommended for SOT89 devices.
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PACKAGE DESIGNATOR UA
Dimensions in Inches (controlling dimensions)
0.164 0.159
45
0.062 0.058
45
1.57 1.47
0.085
MAX
2.16
MAX
0.640 0.600
0.0173 0.0138
16.26 15.24
0.44 0.35
SEE NOTE
0.0189 0.0142
SEE NOTE
0.48 0.36
0.050
BSC
Dwg. MH-014E in
1.27
BSC
Dwg. MH-014E mm
Dwg. MH-026
NOTE:
Lead-form dimensions are the nominals produced on the forming equipment. No dimensional tolerance is implied or guaranteed for bulk packaging (500 pieces per bag).
115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000
This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.