XIPING HUO 4300 Albany Drive, #L229 * San Jose, California 95129 * (607) 206-2901 * xh 1299bbe@westpost.

net SUMMARY OF QUALIFICATIONS Adept Electrical Engineer with lengthy experience in electro-mechanical system d esign, development and testing. * Demonstrates skill in design of analog and digital circuits, such as microcont roller based circuits, A/D, D/A, Op-amps, serial and parallel port interface, PL C, motor drive and PCB boards. Familiarity with Altium Designer, LabVIEW, Oscill oscope and Data acquisition system. * Offers experiment designs, root cause failure analyses and mechanical designs. Proficient in CAD software, such as Solidworks, Pro-E and AutoCAD. * Develops and implements reliability plans and quality control procedures for n ew and current products, resulting in considerable reduction in failure rates. * Serves capably in responsible roles, maintaining technical documents, training project contributors, and monitoring work of contracted vendors. EDUCATION Ph.D., Mechanical Engineering, State University of New York at Binghamton 2009 Master of Engineering, Electro-Mechanical Engineering, Beijing Institute of Tech nology, Beijing, China 2002 B.S., Electro-Mechanical Engineering, Inner Mongolia University of Technology, H ohhot, China 1998 PROFESSIONAL EXPERIENCE Matthews International Corporation, Pittsburgh, Pennsylvania 2008-Present Electrical Engineer - Brand Solutions Group * Played key role in building C84+, CX16, and HX64 ink jet printer models, which ultimately went to market; designed and developed analog/digital control circui ts and contributed to mechanical parts and assemblies. * Redesigned P31 model and introduced additional quality control procedure durin g production, driving as much as 70% reduction in field failure rates due to ele ctrical noise. * Achieved $2,000 decrease in production cost per C84+ model by introducing stre amlined design, replacing key components with less costly parts, and bringing on new vendors to supply materials. * Developed reliability test plans and conducted validation testing for printer controllers and print heads; utilized thermal chamber, oscilloscope, LabVIEW and data acquisition systems to carry out reliability tests such as thermal cycling shock, EMC, ESD, temperature and humidity. * Diagnosed root cause of failures during design and production, conducting anal ysis for issues ranging from encoder interface and print head drive board failur es to high voltage noise. * Utilized SolidWorks and AutoCAD to create 2D detail drawings and 3D models, us ed in production of five printers consisting of more than 600 parts. * Outlined and implemented quality control and testing methods for production of new models and modified existing procedures, affecting significant reduction in reported failures. * Designed filtered I/O interface and cable harnesses with Altium Designer to im prove the printer performance in harsh electromagnetic and high static environme nt. * Sourced domestic and international vendors to procure or fabricate engineering builds and prototypes according to design specifications. * Directed design process, producing and tracking technical documents such as dr awings, engineering change notices, and schematics; oversaw vendors to ensure de livery that facilitated quality of fabrications. * Designed enclosure shielding system and conducted tests to ensure printers met

requirements for levels of EMC, ESD, and EMI. * Trained production, sales, repair, and field engineers and provided ongoing te chnical troubleshooting support and indirectly supervised their work. * Conducted failure mode and effects analysis (FMEA), identifying possible produ ct failures and enabling team to develop design accordingly. SUNY at Binghamton, Binghamton, New York 2004-2008 Research Assistant - Vibration and Microacoustic Sensor Research Lab * Analyzed and designed mechanical prototype of two MEMS microphones: first-orde r directional comb finger beam microphone and novel, second-order directional be am microphone. * Created products with smaller size, better sensitivity, and wider frequency re sponse range when compared with other microphone products, and can be used in he aring aid devices. * Employed Pro-E, ANSYS, MATLAB, and acoustic numerical analysis method to devel op theoretical models and FEA models to predict acoustic responses, natural freq uencies, and directivity of microphones with goal of optimizing performance of m icrophones and identifying fatal flaws in design concepts. * Defined experimental methods for measurement and characterization of microphon e sensors. * Designed protective package of the microphones, consisting of duct and screen on top of diaphragm, to shield the MEMS microphones from environmental effects; predicted response of microphone in package, measured response with package, and correlated results with predictions. * Used FEA model in ANSYS to simulate and analyze failures during fabrication ca used by thermal stress. * Developed and Created MEMS microphone micro-fabrication process and mask via L -Edit and C. Beijing Kenuohua Electronic Technology Co., Ltd., Beijing, China 2002-2004 Lead Electronic Engineer * Directed five engineers in development of ink jet printer; developed architect ure of microcontroller-based printer control and driver circuits. * Wrote and debugged the firmware of embedded micro-controller system in Assembl y language and C for two models of ink jet printers, including GUI, message edit or, printing control, and ink viscosity PID control. * Developed and tested printer control and driver circuit board, which includes dual-microcontroller system, ADC, DAC, LCD display and keyboard interface, seria l and parallel port interfaces, DC-DC convertor, power supplies and op-amp; desi gned PCB board layout with Protel. * Diagnosed root cause of printer failures; oversaw creation of PCB layout, CAD drawings, engineering analysis, and test plans for software, firmware, electroni c, and mechanical designs. TECHNICAL COMPETENCIES CAD Modeling: Altium Designer, Pro-E, SolidWorks, AutoCAD, Autodesk Inventor, LEdit Design Simulation: ANSYS, Pro Mechanica, MATLAB Programming Languages: C/C++, Assembly Language, Ladder logic General Software: MS Office, SAP Engineering Tools: Oscilloscope, data acquisition devices, LabVIEW, signal gener ator