STUDY AND DESIGN OF LOW COST PRESSURE SENSORS FOR PREVENTING THEFT OF VEHICLE

A Project Report Submitted in Partial Fulfillment of the Requirements for the Degree of Bachelor of Technology in Mechanical Engineering

by GROUP M17

MECHANICAL ENGINEERING

MOTILAL NEHRU NATIONAL INSTITUTE OF TECHNOLOGY ALLAHABAD, INDIA

December, 2011

CERTIFICATE
Certified that the work contained in this titled STUDY AND DESIGN OF LOW COST PRESSURE SENSORS FOR PREVENTING THEFT OF VEHICLE, has been carried out under my supervision and that this work has not been submitted elsewhere for a degree.

Asst. Prof. S.B. MISHRA Mechanical Engineering MNNIT

Contents
INTRODUCTION MEMS APPLICATION OF MEMS ADVANTAGES OF MEMS MEMES BASED PRESSURE SENSOR DESIGN VARIOUS RESPONSE OF PIEZORESISITIVE SENSOR MECHANICAL DESIGN

Chapter 1

Introduction
Mems, micro electro mechanical systems, are the integration of electronic and mechanical components on micro level. These consists of sensor to obtain signals from the environment, electronic system provides logic and manipulation of signal obtained and finally actuators produce desired output. This technology is targeted at devices that range in size from millimeters down to microns, and involve precision mechanical components that can be manufactured using semiconductor manufacturing technologies. A diverse range of application areas has been proposed, and applications developed for these devices include a wide range of sensor, fluid mechanics, optics, RF, storage, and biotechnology applications.
1.1 APPLICATION OF MEMS

MEMS are most popular in the automotive industry as accelerometers for airbag systems. MEMS have many other uses besides airbag systems, and not only for the automotive market. They also have applications in industrial, military, and consumer markets. Automotive Market:

Airbag Systems Vehicle Security Systems

Intertial Brake Lights Headlight Leveling Rollover Detection Automatic Door Locks Active Suspension

Consumer Market:

Appliances Sports Training Devices Computer Peripherals Car and Personal Navigation Devices Active Subwoofers

Industrial Market:

Earthquake Detection and Gas Shutoff Machine Health Shock and Tilt Sensing

Military:

Tanks Planes Equipment for Soldiers

1.2 ADVANTAGES OF MEMS

They have proven to be a key enabling technology of developments in areas such as transportation, telecommunications and health care, but the range of MEMS applications covers nearly every field. The most significant advantage of MEMS is their ability to communicate easily with

electrical elements in semiconductor chips. Other advantages include small size, lower power consumption, lower cost, increased reliability and higher precision.

(1) IC Technology used: Integrated multiple and more complex functions on a chip, to form a monolithic system(sensors+processing+ actuators), Miniaturization with no loss of functionality, Improved Performanc.

(2) Batch Fabrication: Reduced Manufacturing Cost & Time.

(3)

Microcomponents make the system faster, more reliable, more

portable, cheaper, low power consumption, easily & massively employed, easily maintained & replaced.

(4) Easy to integrate into systems or modify.

(5) Little harm to environment and capable of incorporating.

(6) Exploitation of new physics domains.

Chapter 2

MEMS BASED PRESSURE SENSEOR DESIGN

The pressure microsensors often use a thin square-shaped diaphragm as their main sensor element. This is because of its compatibility with bulk and surface silicon micromachining processes. A pressure applied on the diaphragm generates an increase in its deflection until the elastic force is balanced by the pressure. The pressure range that can be measured by the diaphragm depends on its dimensions (surface area and thickness), geometry, edge conditions, and material . The diffused resistors on the silicon substrate are used to measure the strain of the diaphragm of the pressure microsensors. This piezoresistive microsensor generally has four piezoresistors in a Wheatstone bridge configuration to measure the stresses in a silicon diaphragm under normal Pressure.

The deformation response of piezoresistive sensor to a pressure of 2*10^6 Pa

The stress response of piezoresistive sensor to a pressure of 2*10^6 Pa

Data Used

pi(t)= 71.8*10^-11 / Pa pi(l)= - 66.3*10^-11 / Pa E=169.8 GPa Nu= .066

MECHANICAL DESIGN

The del(v)/v vs pressure response of piezoresistor