AIR COOLING

Introduction
Electronic equipment has made its way into practically every aspect of modern life. The reliability of the electronics system is a major factor. Electronic components depend on the passage of electric current to perform their duties, and they become potential sites for excessive heating, since the current flow through a resistance is accompanied by heat generation. The failure rate of electronic equipment increases exponentially with temperature. Therefore, thermal control has become increasingly important in the design and operation of electronic equipment. Several cooling techniques commonly used in electronic equipment such as Conduction cooling, Natural convection and Radiation cooling, Forcedair cooling, Liquid cooling, and Immersion cooling. An important consideration in the selection of a cooling technique is the environment in which the electronic equipment is to operate. The manufacturers of electronic devices usually specify the rate of heat dissipation and the maximum allowable component temperature for reliable operation. These two numbers help us determine the cooling techniques that are suitable for the device under consideration.

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When the power rating of a device or component is given, the heat flux is determined by dividing the power rating by the exposed surface area of the device or component.
Forced convection with water can be used effectively for cooling electronic components with high heat fluxes. Also note that dielectric liquids such as fluorochemicals, can remove high heat fluxes by immersing the component directly in them. Low-power electronic systems convection and radiation. are conveniently cooled by natural

Considering that the maximum allowable temperature difference is typically under 80 C, the natural convection cooling of this component in air is out of the question.

But forced convection with air is a viable option if using a fan is acceptable. Note that at heat fluxes greater than 1 W/cm2, even forced convection with air will be inadequate, and we must use a sufficiently large heat sink or switch to a different cooling fluid such as water.

Air Cooling
Air has mass and thermal capacity. It transfer energy. Although it has a rather low specific heat compared to other fluids, air is the most commonly used medium for heat transfer. It is available everywhere on the surface of the planet

Air is usually taken directly from surrounding atmosphere and returned to it with a revised thermal content. Materials or objects that are cooled are almost always immersed in air.
Even if another medium is used to cool a heat source , the ultimate heat sink is still the atmosphere. The thermal capacity of air based on that value , is 0.569W.min/c/ft3. For every cubic foot of air per minute in an air stream, 0.569 Watts of power dissipated as heat are transferred for air temperature change of one degree Celsius. The thermal capacity of air, when held at constant pressure is often expressed as 7.59 W.min/c/lb.

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Natural convection is based on the fluid motion caused by the density differences in a fluid due to a temperature difference. A fluid expands when heated and becomes less dense. In a gravitational field, this lighter fluid rises and initiates a motion in the fluid called natural convection currents.

Fig. Natural convection currents around a hot object in air.

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Low power electronic systems are conveniently cooled by natural convection and radiation. Electronic components or PCBs placed in enclosures such as a TV or DVD player are cooled by natural convection by providing a sufficient number of vents on the case to enable the cool air to enter and the heated air to leave the case freely, as shown in Fig.

Fig. Natural convection cooling of electronic components in an enclosure with air vents.

Forced air cooling

When natural convection cooling is not adequate, we simply add a fan and blow air through the enclosure that houses the electronic components The higher the velocity, the larger the flow rate and the higher the heat transfer rate. The fluid velocities associated with natural convection currents are naturally low, and thus natural convection cooling is limited to low-power electronic systems.

Fig. Forced convection cooling of electronic components in an enclosure.