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Electronics Components Mechanical and Electro-mechanical: PCB mounted DIP switches, mains switches, disc drives Passive Solid State Devices: Resistors, Capacitors Active Solid State Devices: Transistors, Diodes, Thermionic valves, FETs and MOSFETs
Wire-wound resistor wind wire leads mold seal - high power, low resistance, high frequency apps
Film resistor Film is cut by laser high precision - low frequency applications
Disk-ceramic capacitor
Pure Monocrystalline Si: Melt pure Si, Seed crystal drawn out slowly Typical Single Crystal Ingot sizes: 1-2m long, 8cm / 15cm / 30 cm diameter
Silicon
Doping processes: Diffusion (heat wafer in atmosphere with atoms of dopant) Ion implantation (ions of dopant are accelerated, bombard surface)
NPN transistor
Silk-screening
vacuum deposition
Subtractive process
Additive process
- Photolithography is the most commonly used process - Photoresists: positive: more soluble when exposed negative: less soluble when exposed - Feature size = f(wavelength) small features need low l radiation - Mask = = Artwork - Projection: - Direct: mask scale is 1:1 - Reducing: mask scale is 10:1
Packaging of components
- Packaging puts the chip (silicon) into a protective case
- Package provides external connections that are spaced conveniently (at distance, arranged in array) for soldering
Packaging of components
SOIC package Small Outline IC
Avoiding possible heat damage to IC during soldering: - Solder a chip carrier to the PCB - Insert chip into carrier
IC
Chip carrier
[source: www.towajapan.co.jp]
Packaging
- Make leadframe
Steps in Lead Frame Manufacture: (1) Cut copper strips (2) Clean in a chemical bath (3) laminate a layer of photoresist (4) Expose photoresist through mask (5) Develop and etch (6) Remove lamination (7) Plate internal regions with gold/silver
Dual Inline Package and its lead-frame
- Die attachment (chip bonded to leadframe using epoxy) - Wire bonding (ultrasonic welding) - Encapsulation (moisture resistant coating) - Molding (plastic package)
- Marking (chip number, co. name, marked on package [laser, silkscreen]) - DTFS: deflash, trim the leadframe, form the leads, singulate (cut dambars) - Leadfinishing: electroplating the leads
PCB Manufacture
Typical PCB
Types of PCB's single-side, double-side and multi-layer Which type to use ? (a) Circuit complexity (b) Available space (c) Cost
Place copper sheet on the lower plate Place few layers of glass cloth impregnated with epoxy on top [IF two-sided PCB's]: Place copper sheet on above Press between steel plates in a steam-heated hydraulic press (~7,000,000 Pa) Water cooling to 25 C Trim to clean out extruded epoxy
Punch/Drill holes for alignment Make circuit on PCB (lithography) Drill through holes (for component leads)
Multi-layer PCBs
Similar process as single layer, but takes several steps
PCB Assembly
- Insert leaded component into holes on PCB - Solder - Protective coating
Leaded Component
PCB Manufacture
Surface mount chip assembly: - Silk-screening to apply solder paste on the board - Automated assembly of components (>30,000 components per hour) - IR or Wave soldering
Automatic soldering
Step 1. Application of the solder resist Cover PCB with solder resist except Lands
Land
Foam fluxing
Spray fluxing
Automatic soldering..
Automatic soldering..
air-jet
SOLDER WAVE