PRINTED CIRCUIT

BOARD
PREPARED BY:

GROUP 1
IV-EINSTEIN

PRINTED CIRCUIT BOARD

A flat plastic or fiberglass board on which interconnected circuits and
components are laminated or etched.

PRINTED CIRCUIT BOARD

Electronic circuits in schools and industry are normally manufactured
through the use of PCBs (Printed Circuit Boards). The boards are
made from glass reinforced plastic with copper tracks in the place of
wires. Components are fixed in position by drilling holes through the
board, locating the components and then soldering them in place. The
copper tracks link the components together forming a circuit

PCBS CAN BE SINGLE SIDED ( THROUGH HOLE PRINTED

CIRCUIT BOARDS) OR DOUBLE SIDED. IN THROUGH HOLE PCBS
THERE ARE TWO LAYERS : THE COMPONENT SIDE AND THE
TRACK SIDE.

Component Side

Track Side

PARTS OF A PCB
It consists of an insulating base
material that supports the copper
traces. The standard thickness of the
insulating base material is 1/16
inches or .062 inches.
The insulating base material is
typically epoxy fiberglass but ceramic
and Teflon are also used as base
material in special cases.

Epoxy Fiber Glass

Teflon

Ceramic

PARTS OF A PCB
The standard thickness of the
solid copper foil that is bonded
to the base material is 1oz or
.003 inches. One ounce refers to
the weight of copper spread over
one square foot.

The additional layers are nonconductive and form the component layout
layer and the solder mask.
The component layout layer acts as a map when assembling and
troubleshooting the printed circuit board. This layout layer consists of text
and graphic symbols that identify each component with its proper
orientation.

NOTE : A good component layer can

save a tremendous amount of time.

 The solder mask controls or indicates where the solder will be placed
on the printed circuit boards pads. This solder will only connect the
components to the solder pads. It adds corrosion protection to the
printed circuit traces.

The desired traces are printed onto the copper called resist. The board is
then placed in a chemical tray with a chemical for etching.

The chemical is also known as etchant. It is used to remove the copper not
covered by the resist.

ETCHANT CHEMICALS

Ferric Chloride

Ammonium persulphate

PCB DESIGNING
Schematic Diagram
A circuit such can be drawn using softwares.
This allows individual components such as resistors, integrated circuits and
capacitors to be dragged onto the screen and connected together, forming a
complete circuit.

The finished circuit can then be simulated on screen. If the circuit is not correct it can
be altered until it works in the desired way.

This allows you to test the circuit on the computer and correct any mistakes or make
improvements. This saves time as there is no need to build the circuit with real
components.

PCB DESIGNING
Circuits can also be built on a
breadboard using real
components. This is a time
consuming method and often
mistakes occur as many
components are small and it is
easy to connect components
incorrectly, causing a circuit to
fail. Also, breadboards are
prone to damage as the small
connections on the boards are

PCB DESIGNING
When the PCB layout
is finished it is printed
on a transparency and
becomes known as a
PCB mask. The PCB
mask is transferred to
the UV box, which is
the next stage in the
manufacture of a
printed circuit board.

PHOTO-RESIST
BOARD is a piece of
glass reinforced
plastic. One of the
sides is copper clad
and this copper has a
photosensitive
coating.

The PCB mask (now

on a transparency) is
placed underneath
the photo-resist
board, touching the
sensitive surface.
Remember the plastic
film must be removed.

PCB mask and

board are then
transferred to the
UV light Box.

But what is etching?

What does Mr.
Wikipedia has to
say?

ETCHING PROCESS
Etching is the process of using strong acid or
mordant to cut into the unprotected parts of a metal
surface to create a design in intaglio in the metal (the
original processin modern manufacturing other
chemicals may be used on other types of material).

 There are two major techniques to remove copper from a copper

clad board to form a printed circuit board. Using Acid or using a
computer program.
To use the tray method, the copper clad board with applied resist
is etched in glass tray by dropping the board onto the surface of
the acid. The copper side of the board should face toward the
acid. Float it on the acid for approximately fifteen to twenty
minutes. The acid laden with copper sinks to the bottom and
fresh acid replaces it.
A different technique uses a one inch square of sponge to the
dab the acid on the printed circuit board. The acid is absorbed in
the sponge by pouring a small amount on it. The sponge is
dabbed continuously on the copper on the board until the copper
is removed.

PREPARING THE ETCHED PRINTED

CIRCUIT BOARD
After etching, the resists needs to be removed. Remove the printed
circuit board from the acid, rinse it thoroughly in running water and dry
it. The resist can be removed by soaking the board in a solvent,
scrubbing it with powder cleanser, or using steel wool to rub it off.

The next step is optional in fabricating a printed circuit board. The

printed circuit board can be tin plated to stop oxidation of the copper
using a tin-plating solution.

MATERIAL SAFETY DATA SHEET

OSHA ( the Occupational Safety and Health Administration) requires that a material
safety data sheet be supplied when a chemical or hazardous substance is
purchased.

When unpacking a shipment of chemicals , look for the MSDA in the box. File the
MSDS in a folder in the location where the chemical is being used.

MSDS should be kept on file for two reasons:

1.To help protect personnel from injury and exposure hazards
2.To abide by the law.
Read each MSDS before using hazardous material. Everyone who uses the
chemical product must understand its dangers and the precautions to be taken while
using it.

The 16 sections of the MSDS:

Identification
Hazard(s) identification
Composition/information on ingredients
First-aid measures
Fire-fighting measures
Accidental release measures
Handling and storage
Exposure controls/personal protection
Physical and chemical properties
Stability and reactivity
Toxicological information
Ecological information
Disposal considerations
Transport information
Regulatory information
Other information