3 TYPES OF FPC

CONSTRUCTION
http://www.shax-eng.com

Flexible printed circuits have become an

indispensable part of our lives, being used in
various devices including computers, tablets,
heart monitoring devices and much more. In
this write-up let us discuss about flexible
circuit construction and their different
types.

FLEXIBLE CIRCUIT
CONSTRUCTION

Even though the flexible circuit materials are

extremely variable, still there is a specific
topology to FPC fabrication that follows
limited generic differences. A wide array of
flexible circuits that are discovered in
various interconnections and flexible
packaging applications follow these basic
designs:

SINGLE SIDED FLEXIBLE

CIRCUITS

When it comes to single sided FPC, they are

actually the most basic forms of available
flexible circuits. They compromise of a single
conductor layer on a flexible dielectric film. This
layer has entre from just one side to circuit
termination. The single sided flexible circuits
can be developed with or without protective
coatings and cover lays. Additionally, they
consist of an extremely simple design, making
them highly reasonably priced. The conductors
that can be utilized can be low cost polymer
thick film or metal foil can also be used.

DOUBLE ACCESS FLEXIBLE

CIRCUITS

These forms of PCB fab have been manufactured

for meeting the demands for reasonably priced
circuits that can handle an enhancement in
component real estate demand. Using these kinds
of circuits permits the designers placing
components on both sides of the flexible
dielectric film. For accessing both dies of the
film, it needs vigilant designs to permit the areas
of the conductors that are exposed to become
available for attaching the underside component.
This many a times infer that through holes need
to be punched in the dielectric film before it is
laminated with the conductor.

DOUBLE SIDED FLEX CIRCUITS

These forms of FPC fabrication are also

extremely famous. Higher conductor numbers
are required due to the ever increasing
demand for placing extra components on a
circuit and enhancing the power handling
capabilities and circuit density. This can be
ensured through the incorporation of more
than a single conductive layer on the same
base film. They can be built through different
forms like printed conductors separated via
printed insulating cover lays and spate
conductors on both sides of the base firm.

A problem with double sided PCB fab is

ascertaining credible connectivity mediums
between components that are mounted on
the bottom and the top of the board. But
due to great advancement in technology,
these issues can now be easily overcome
through providing connectivity via
multilayered laminates.

CONTACT US

Shax Engineering, Inc.

2365-F Paragon Drive,
San Jose, CA 95131
408.452.1500 Toll Free 800.814.1380
info@shax-eng.com
408.441.063