Chapter 11

Dispersion Strenghtening and Eutectic Phase Diagrams

Interphase interface is a surface where the atomic arrangement is not

perfect
In metallic materials, this boundary interfers with the slip or movement of
dislocations, causing strengthening.

Dispersion Strengthening Increasing the strength of a material by forming

more than one phase. By proper control of the size, shape, amount, and
individual properties of the phase, excellent combination of properties can be
obtained.

Matrix The continuous solid phase in a complex miscrostructure. Solid

dispresed phase particles may form within the matrix.

Dispersed phase A solid phase that forms the original matrix phase when the
solubility limit is exceeded.

Microconstituent A phase or mixture of phases in a alloy that has a distinct

appearance.

Eutectic - A three-phase invariant reaction in which one solid phase

transforms to two different solid phase.

When increased strength and toughness are the goals of incoporatng a

dispersed phase, the guidelines below should be followed (Figure 11-1).
1.

The matrix should be soft and ductile, while the dispersed phase should be
hard and strong. The dispersed phase particles interfere with slip, while
the matrix provides at least some ductility to the overall alloy.

2.

The hard dispersed phase should be discontinuous, while the soft, ductile
matrix should be continuous. If the hard and brittle dispersed phase were
continuous, cracks could propagate through the entire structure.

3.

The dispersed phase particles should be small and numerous, increasing the
likelihood that they interfere with the slip process since the area of the
interphase interface is increased significantly.

4.

The dispersed phase particles should be round, rather than needle-like or

sharp edged, because the rounded shape is less likely to initiate a crack or to
act as a notch.

5.

Higher concentrations of the dispersed phase increase the strength of the

alloy.

Intermetallic compound- contains two or more metallic elements,

produceing a new phase with its own composition, crystal structure, and
properties.

Are almost always very hard and brittle.

Are similar to ceramic materials in terms of their mechanical properties.

Soinchiometric intermetallic compounds have a fixed composition

Nonstoichiometric intermetallic compounds have a range of composition

and are sometimes called intermediate solid solution.

Phase Diagrams Containing Three-Phase

Reaction

Eutectic A three-phase invariant reaction in which one liquid phase solidifies

to produce to solid phases.

Peritectic A three-phase reaction in which a solid and a liquid combine to

produce a second solid on cooling.

Monotectic A three-phase reaction in which one liquid transforms to a sold

and a second liquid on cooling

Eutectoid A three-phase invariant reaction in which one solid phase

transfroms to two different solid phase.

Peritectoid A three-phase reaction in which two solids combine to form a

third solid on cooling.

The Eutectic Phase Diagram

The lead-tin (Pb-Sn) system contains only a simple eutectic. This alloy system is the
basis for the most common alloys used for soldering. As mentioned before, because of
the toxicity of Pb, there is an intense effort underway to replace lead in Pb-Sn
solders. We will continue to use a Pb-Sn system, though, to discuss the eutectic phase
diagram

Solid-Solution Alloys
Alloys that contain 0 to 2% Sn behave exactly like the copper-nickel alloys; a singlephase solid solution forms during solidification. These alloys are strengthened by
solid-solution strengthening, strain hardening, and controlling the solidification
process to refine the grain structure.

Alloys that Exceed the Solubility Limit

Alloys containing between 2% and 19% Sn also solidify to produce a single solid solution
; however, as the alloy continues to cool, a solid-state reaction occurs, permitting a
second solid phase () to precipitate from the original phase.

Hypoeutectic alloy
is an alloy with a composition between that of the left-hand end of the tie line
defining the eutectic reaction and the eutectic composition.
- as a hypoeutectic alloy containing between 19% and 61.9% Sn cools, the liquid
begins to solidify at the liquidus temperature, producing solid ; however,
solidification is completed by going through the eutectic reaction.

Hypereu-tectic alloy is an alloy composition between that of the right-hand

end of the tie line defining the eutectic reaction and eutectic composition. In
the Pb-Sn system; any composition between 61.9% and 97.5% Sn is
hypereutectic.

Strength of Eutectic Alloys

Each phase in the eutectic alloy is, to some degree, solid-solution strengthened. In the
lead-tin system, , which is a solid solution of tin in lead, is stronger than pure lead.
Some eutectic alloys can be strengthened by cold working. We also cantrol grain size
by adding appropriate inoculants or grain refiners during solidification.

Eutectic Colony Size

Eutectic colonies each nucleate and grow independently. Within each colony, the
orientation of the lamellae in the eutectic microconstituent is identical. The
orientation changes on crossing a colony boundary [Figure 11-16(a)].

Interlamellar Spacing
The interlamellar spacing of a eutectic is the distance from the center of one
lamella to the center of the next lamella [Figure 11-16(b)]. A small interlamellar
spacing indicates that the amount of to interface area is large. A small
interlamellar spacing therefore increases the strength of the eutectic.
the interlamellar spacing is determined primarily by the growth rate of the
eutectic,

Nanowires and the Eutectic Phase Diagram

Nanowires are cylinders or wires of material with diameters on the order of 10 to
10 nm. Nanowires have generated great technological interest due to their electrical,
mechanical, chemical, and optical properties. Potential applications include biological
and chemical sensors and electrical conductors in nanoelectronic devices. A common
method of fabricating nanowire materials is through the technique known as VaporLiquid-Solid (VLS) growth. The growth of silicon nanowires can be understood by
considering the gold-silicon binary diagram in Figure 11-25(a). Notice that there is no
mutual solubility between gold and silicon.