JOB HAZARD ANALYSIS

ON
MANUFACTURING OF
IC(SEMICONDUCTOR)
MASKING
Job Location: Analyst: Date:
METAL SHOP Rodessa Jane D. Corpuz September 16,
2017
TASK DESCRIPTION:
A photoresist or light-sensitive film is applied to the wafer, giving it characteristics similar to a piece of photographic
paper. A photo aligner aligns the wafer to a mask and then projects an intense light through the mask and through a
series of reducing lenses, exposing the photoresist with the mask pattern.

HAZARD DESCRIPTION:
Exposure to ultraviolet (UV) radiation during photoexposure. Exposure to mercury from lamp rupture.

HAZARD CONTROLS:
1. Identify UV hazards; perform exposure evaluations when applicable.
2. Enclose operations with UV emissions; provide shielding and interlocks as necessary.
3. Provide PPE as appropriate during operations when exposure is necessary.
4. Provide adequate ventilation to control ozone concentrations.
5. Implement preventive maintenance to inspect and replace lamps routinely.
6. Store and dispose of lamps properly.
ETCHING
Job Location: Analyst: Date:
METAL SHOP Rodessa Jane D. Corpuz September 16, 2017

TASK DESCRIPTION:
The exposed photoresist is removed and baked to harden the remaining photoresist pattern. It is then exposed to a
chemical solution or plasma (gas discharge) so that areas not covered by the hardened photoresist are etched away. The
photoresist is removed using additional chemicals or plasma and the wafer is inspected to ensure the image transfer from
the mask to the top layer is correct.

HAZARD DESCRIPTION:
Exposure to acids used for wet chemical etching. Exposure to fluorinated, chlorinated, and other reactive gases used for
dry etching
HAZARD CONTROLS:
1. Identify acid/caustic hazards and gas hazards and perform exposure measurements for the chemicals
used as well as appropriate exposure evaluations.
2. Provide appropriate ventilation to reduce concentration levels and gas concentration levels in the air.
3. Provide PPE as appropriate to prevent eye and skin contact.
4. Use gas monitoring systems with automatic shut-offs and alarm systems, as appropriate.
5. Install emergency facilities to provide immediate treatment in the event of an accidental exposure.
 WAFER
FABRICATION
Job Location: Analyst: Date:
METAL SHOP Jasmine R. Bontia September 23,
2017
TASK DESCRIPTION:Photoresist (chemical )patterns are photo-masked in micrometer detail onto the wafers'
surface. The wafers are then exposed to short-wave ultraviolet light and the unexposed areas are thus etched away
and cleaned. Hot chemical vapors are deposited in the desired zones and baked in high heat , which permeate the vapors
into the desired zones. In some cases, ions, such as O2+ or O+, are implanted in precise patterns and at a specific depth
by using RF-driven ion sources.

HAZARD DESCRIPTION:
Possible employee exposure to photoresist chemicals

HAZARD CONTROLS:
1. Use of personal protective equipments
2. Local exhaust ventilation (to remove any leakage at the source and preventing a large release)
3. Restricted flow orifice ( to limit the maximum gas flow)
4. Leak Detection & Alarm system
DOPING
Job Location: Analyst: Date:
METAL SHOP Jasmine R. Bontia September 23, 2017

TASK DESCRIPTION:
Dopants are impurity elements added to the semiconductor crystal to form electrical junctions or boundaries between
"n" and "p" regions in the crystal.The most common doping methods include diffusion and ion implantation. Materials
used for dopants mainly include compounds of antimony, arsenic, phosphorous, and boron, in gaseous, liquid, and solid
physical states.

HAZARD DESCRIPTION:
Chemical exposures to maintenance personnel working on reaction chambers, pumps, and other associated equipment
that may contain reaction-product residues. Substances such as arsenic, arsine, phosphine, etc., may be found in ion
implantation equipment.
HAZARD CONTROLS:
1. Identify chemical hazards and perform appropriate exposure evaluations.
2. Provide appropriate ventilation to reduce chemical concentration levels in the air.
3. Provide PPE as appropriate to prevent eye and skin contact.
4. Use respiratory protection when necessary to further reduce exposure and protect employees
5.Implement appropriate maintenance procedures and work practices designed to prevent or minimize exposure.
6.Provide proper training for maintenance and other affected personnel.
WAFER PRODUCTION
Job Location: Analyst: Date:
METAL SHOP Christopher Philippe C. Palma September 23, 2017

TASK DESCRIPTION:
In wafer production, a semiconductor crystal is sliced into a diamond-tipped saw so that it will produce thin wafers. They
are being sorted according to their thickness and such damaged wafers are removed when they already undergo process
of lapping. They will be etched in a chemical to remove any remaining crystal damage. In the end, it will be polished to
smoothen any uneven surfaces caused by the sawing.

HAZARD DESCRIPTION:
Exposure to chemicals when etching takes place.

HAZARD CONTROLS:
1. Identify chemical hazard/risks and perform exposure evaluations.
2. Wearing of protective suits to avoid physical contact with corrosive chemicals.
3. Using of masks and protective respiratory suits to prevent inhalation of chemicals.
4. Ventilation and temperature control is a must in such cases that some chemicals reacts into certain
temperature levels.
THERMAL OXIDATION
Job Location: Analyst: Date:
METAL SHOP Christopher Philippe C. Palma September 23, 2017

TASK DESCRIPTION:
Thermal oxidation is accomplished using an oxidation furnace (or diffusion furnace, since oxidation is basically a
diffusion process involving oxidant species), which provides the heat needed to elevate the oxidizing ambient
temperature. A furnace typically consists of: 1) a cabinet; 2) a heating system; 3) a temperature measurement and control
system; 4) fused quartz process tubes where the wafers undergo oxidation; 5) a system for moving process gases into and
out of the process tubes; and 6) a loading station used for loading (or unloading) wafers into (or from) the process tubes.
HAZARD DESCRIPTION: Emission of chemical wastes after oxidation. Wastes that may be generated
from this process include silicon dioxide or other raw material being used for wafer fabrication, organic
solvent vapors from cleaning gases, rinsewater with organic solvents from cleaning operations, spent
solvents, and spent acids and solvents in the wastewater.
HAZARD CONTROLS:
1. Proper Waste Disposal
2. Usage of Proper Protective Equipment or PPE
3. Proper Training before exposure to chemicals
4. Proper training for personnel