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Diamond chips

Diamond chips are now ready for


mass production.

12/07/2021 yogita pal Deptt. of ECE 1


Introduction:-
 Electronics without silicon is unbelievable, but it
will come true with evolution of diamond or
carbon chip.
 Now-a-days we are using silicon for
manufacturing of electronic chips.
 It has many disadvantages when it is used in
power electronic applications, such as bulk size,
slow operating speeds, etc…
 By using carbon as manufacturing material, we
can achieve smaller, faster and stronger chips
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What is diamond chip?
What is Diamond chip?
 Diamond chip is nothing
but carbon chip. Carbon
chip is an electronic chip
manufactured on a
diamond structural carbon
wafer.
 The major component
using Carbon is (cnt)
”CARBON NANOTUBE”
•  
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Form of carbon for diamond chip
 Dean Freeman, senior analyst
at Gartner, said that diamonds are
a geek's best friend and will probably
be the first carbon chip seen.
 He said work had been going on graphene
chip using diamond chips for 15 years
and thus diamond is the closest form
of carbon-based chip to becoming
commercialized.
silicon chip

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Contd 2...
 Diamond offers 10 times the heat dissipation of silicon
and has been used for 40nm to 15µ diamond films on
silicon wafers.

Fig. Heat dissipation curve of silico and diamond.

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 Semiconductors fabbed using carbon
could kill off silicon chips by attaining
10 times better electron mobility.

Fig.Electron hole mobility for carbon

Fig. Electron hole mobility for silicon

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What is a carbon nanotube???
 Carbon nanotubes were
discovered in 1991.
 It is a nano - size cylinder
of carbon atoms.
 They are made of one or several
concentric walls in which carbon atoms
are arranged in hexagonal pattern,
measuring several tens of microns in
length and less than a few nanometers
in diameter.

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How nanotechnology works?
 Imagine a sheet of carbon
atoms, which would look like
a sheet of hexagons.
 If you roll that sheet into a
tube, you'd have a carbon
nanotube.
 Carbon nanotube properties
depend on how you roll the
sheet.
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CARBON FEATURES…
  Carbon will succeed

silicon as the predominate
semiconducting material for
the integrated circuits of the future.
 Carbon--which sits just above
silicon on the periodic table can
surpass silicon’s abilities in thermal
performance, frequency range and
perhaps even superconductivity.

12/07/2021 yogita pal Deptt. of ECE 9


• One-dimensional carbon-
1nm-diameter nanotubes—could
solve digital silicon's speed woes.
• Nanotubes will appear first as
printable "inks" that are 10 times
faster than competing organic
transistors.
• Zero-dimensional carbon-
-60-atom, hollow spheres of
carbon called fullerenes—could
answer silicon's inability to attain
high-temperature superconductivity.

12/07/2021 yogita pal Deptt. of ECE 10


Carbon transistors:-
 Transistors less than one-quarter the size of
the tiniest silicon ones - and potentially
more efficient - can be made using sheets of
carbon just one-tenth of a nanometre thick,
research shows.
 The transistors are made of graphene, a
sheet of carbon atoms in a flat honeycomb
arrangement. Graphene makes graphite
when stacked in layers,and carbon nanotubes
when rolled into a tube.
 Graphene also conducts electricity faster
than most materials since electrons can travel
through in straight lines between atoms without
being scattered. This could ultimately mean faster,
more efficient electronic components that also require
less power.

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 When placed a piece of graphene
on top of silicon and positioned this
over a metallic grate.
 Acid was used to dissolve the silicon,
leaving graphene suspended across
500 nm gaps.
 A transmission electron microscope
then revealed it is covered in tiny ripples,
which keep the material stable.
 The ripples extend about 1 nm up and
down and are around 25 nm across.
It's not flat at all..
 Sheets of graphene are a single carbon
atom thick and have a wavy structure that
keeps them stable
 
12/07/2021 yogita pal Deptt. of ECE 12
Advantages:-
SMALLER COMPONENTS ARE POSSIBLE
 As the size of the carbon atom is small compared with that of silicon atom,
it is possible to etch very smaller lines through diamond structural carbon.
We can realize a transistor whose size is one in hundredth of silicon
transistor.
IT WORKS AT HIGHER TEMPERATURE
 Diamond is very strongly bonded material. It can withstand higher
temperatures compared with that of silicon. At very high temperature, crystal
structure of the silicon will collapse. But diamond chip can function well in
these elevated temperatures.
Diamond is very good conductor of heat.
 So if there is any heat dissipation inside the chip, heat will very quickly
transferred to the heat sink or other cooling mechanics.

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FASTER THAN SILICON CHIP
 Carbon chip works faster than silicon chip. Mobility of the
electrons inside the doped diamond structural carbon is
higher than that of in he silicon structure. As the size of the
silicon is higher than that of carbon, the chance of collision
of electrons with larger silicon atoms increases. But the
carbon atom size is small, so the chance of collision
decreases.
LARGER POWER HANDLING CAPACITY
 For power electronics application silicon is used, but it has
many disadvantages such as bulk in size, slow operating
speed, less efficiency, lower band gap etc at very high
voltages silicon structure will collapse. Diamond has a
strongly bonded crystal structure. So carbon chip can work
under high power environment.. We can connect high
power circuit direct to the diamond chip
 
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Conclusion:-

Thus diamond chip replaces the


need of silicon in every aspect
in future generations…..

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12/07/2021 yogita pal Deptt. of ECE 16
Queries??

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