PHOTOLITHOGRAPHY

SUBMITTED BY –

RAJARSHI HALDER (68)

TAMALESH DUTTA (35)
UNDER THE GUIDANCE OF—
SWARUP KAR (37) Mr. SUSOBHAN RAY
 INTRODUCTION

 Semiconductor Device Fabrication or IC Fabrication

IC- a microchip, basically a semiconductor wafer.

Can carry out multiple tasks of electronic compnents

at the same time
 Various IC Fabrication Techniques
Photolithography.
E-Beam lithography
X-Ray lithography
 PHOTOLITHOGRAPHY

• The Process to produce microscopically small electronics devices

• Transfer a geometrical pattern on to a substrate
• Standard method for PCB & Microprocessor fabrication
HISTORY :
ROOT WORDS – Photo , Litho , Graphy
ORIGINS
FIRST USED IN U.S MILITARY
DIAGRAMATIC REPRESENTATION OF
PHOTOLITHOGRAPHY
BASIC PROCEDURE OF PHOTOLITHOGRAPHY

Steps involved in the process of Photolithography-

i. Film deposition or substrate preparation

ii. Photoresist application
iii. Prebake
iv. Alignment & Exposure
v. Development
vi. Postbake
vii. Pattern transfer
viii.Photoresist Stripping
FILM DEPOSITION OR SUBSTRATE PREPARATION
SUBSTRATE PREPARATION
Substrate- A thin slice of Semiconductor (crystalline silicon)

Used as a base in Photolithography on

which pattern is printed .

Substrate Preparation needed in order to improve the

adhesion of the Photoresist
PHOTORESIST APPLICATION
Photoresist- A light sensitive liquid

characteristics of a good photoresist

• Uniform film formation
•Good adhesion to the substrate
•Resolution
•Resistance to wet and dry etch processes
 Types of Photoresist

Positive Photoresist Negative Photoresist

Method of applying Photoresist
• Spin Coating
PREBAKE
 Prebake or soft bake
• involves drying the photoresist after spin coat by
removing this excess solvent

• The main reason for reducing the solvent content is to

stabilize the resist film.

• there are other consequences of baking most photoresists

At temperatures greater than 70c
 ALIGNMENT & EXPOSURE
• The coated wafer is placed in an apparatus called mask
aligner and aligned very closed to a photomask.

• The photomask is a glass plate, typically about 125 mm

square and about 2 mm thick with a pattern on one side.

• The whole setup is exposed to a UV light

 Types of Printing or Exposure

Contact Printing Proximity Printing Projection Printing

 DEVELOPMENT

• After exposure Photoresist is developed in oreder to

reveal the pattern

• Developers are applied on the resist.

• AS a developer tetramethyl ammonium hydroxide

(TMAH) is used in concentrations of 0.2 - 0.26 N
Different methods of applying Developer
Spray Method

Spin Method

Puddle Method
POSTBAKE
 Post bake or Hard bake
• used to harden the final resist image

• The use of high temperatures (120°C - 150°C)

make the image more thermally stable.

• the postbake can remove residual solvent, water,

and gasses
PATTERN TRANSFER
• Printed pattern on photoresist is transferred to the substrate

• Approaches of pattern Transfer

1. Etching
2. Selective Deposition
3. Ion implantation
 Oxide Etching or Wet etching

• Etching is performed either using wet chemicals such as acids,

or more commonly in a dry plasma environment

• For etching of oxide, the wafers are immersed in or sprayed

with a hydrofluoric [HF] acid solution.
PHOTORESIST STRIPPING
• The process to remove the remaining photoresist.

• There are two classes of resist stripping techniques

wet stripping using organic or inorganic solutions and
dry (plasma) stripping.
 Photo-resist Stripping

Wet Stripping Dry Plasma Stripping

APPLICATIONS OF PHOTOLITHOGRAPHY

Photolithography has application in various fields—

1. MicroElectroMechanical System (MEMS)
2. Fabrication of Microprocessor
3. Sensors
MICROELECTROMECHANICAL SYSTEMS
 MEMS
Functional elements are in minimized structures

Elements having Mechanical functionality

Basic elements are microsensors and microactuators

FABRICATION OF MICROPROCESSORS
 MICROPROCESSOR FABRICATION

• The function of a CPU integrated onto a single or few Ics

• The most Important application Of PHOTOLITHOGRAPHY

• Introduced automation for difficult manual jobs

SENSORS
 SENSORS
• Important part in the age of automation

• An input device that provides output according to the

specific physical quantity
 DIFFERENCE BETWEEN PHOTOLITHOGRAPHY
AND OTHER TECHNIQUES
Photolithography VS E-Beam lithography—
Photolithography VS X-Ray lithography—
ADVANTAGES OF PHOTOLITHOGRAPHY
• Printing Pattern into the surface with a single UV beam
• Highly Efficient and cost effective
• Controls the exact size and shape of the substrate
DISADVANTAGES OF PHOTOLITHOGRAPHY

1. Requires Complete flat substrate

2.Requires Extremely clean condition

 REFERENCES

• WWW.GOOGLE.COM
• WWW.WIKIPEDIA.ORG
• WWW.CIRCUITSTODAY.COM
• WWW.ELECTRONICSHUB.COM
• WWW.MEPITS.COM
THANK YOU