INTRODUCTION

 The 3D printing process builds a three-dimensional object from a

computer-aided design (CAD) model, usually by successively adding
material layer by layer, which is why it is also called additive
manufacturing. The term "3D printing" covers a variety of processes in
which material is joined or solidified under Computer control to create
a Three-dimensional object.
 How Does It Work?
 Make the 3D Object Using CAD Software
 Convert CAD File in to STL (Standard Tessellation Language“).
 STL file needs to be processed by a piece of software called a "slicer,“.
 The printer is make 3D Object.
Methods of 3D Printing
1. Selective Laser Sintering(SLS)
2. Fused Deposition Modeling(FDM)
3. Stereolithography
Stereolithography
The 3D printing technology used for creating models, prototypes, patterns, and
production parts in a layer by layer fashion using photochemical processes by which
light causes chemical monomers to link together to form polymers.
 LITERATURE REVIEW
S.N Author JOURNAL materials Results and
O Name parameter conclusions
1 Yukako The resin used was 1. By increasing glass
Sanoa Elsevier a cationic UV-cure powder content, the
Ryosuke epoxy resin tensile strength and
Matsuzak Young’s modulus
ia increase.
(2012) 2. Fracture strain was
confirmed to decrease.
Saeed D. SCI Nanoparticles An increased stiffness
2
Mohan achieved directly up to 35% in the post
Artur within the acrylic cured, 45% in the green
Mateus based polyurethane state, fracture toughness
(2012) resin. up to 29%, a decrease in
3 Yanfeng Springer The monomers Mechanical properties
Lu, used are 1,6- (aspect ratio of ~500 to
Morteza hexanediol 1000, elastic modulus of
Vatani diacrylate ~0.64 TPa, stiffness of
and Jae- (HDDA)and ~1,000 GPa, and tensile
Won ethoxylated strength of ~100 GPa)
Choi bisphenol A
(2013) dimethacrylate
Andrés SCI Stereolithograph Thermal conductivity
4 Díaz y using a shape (epoxy) 0.2 W/(m·K) at
Lantada memory epoxy 25 °C Specific heat
and sold under the (epoxy) 1200 J/(kg·K)
María trade name of Emissivity (epoxy) 0.86
Angeles Accura 60 Convection coefficient
5 Brett G. Nature These values represent up to a 9x
Compto Epon 826 epoxy increase in the Young’s modulus
n and resin, over cast samples composed of pure
Jennifer epoxy resin. Failure strength values,
A. σ , for the printed composites are
Lewis comparable to that of the cast epoxy
(2013) resin samples (71.1 ± 5.3 MPa),
6 B.Goloz research gate Adifunctional Isothermal dark-curing enabled
V.Minch cycloa- significant conversion increases up
aud Liphatic epoxy to the occurrence of vitrification,
(2013) mono- mer was while thermal post-curing
cationically above Tg led to conversion as high
photo- as 71%. Thermo-mechanical
polymerized in measurements enabled to
7 Carola research gate 3,4Epoxycyclohexylmet Young’s modulus E
Esposito hyl- ,2202.1±46
Corcione 30,40epoxycyclohExane strength σmax
(2014) c- 56.84±5.9and strain
arboxylate possessing a εbreak 0.027±0.001
viscosity of 220–250
mPa·s a 25°C was
chosen as a precursor of
the cationic polymer
matrix.
8 Esposito SCI Methacrylic-siloxane The heat measured for the
Corcion Resion UV-light-induced reaction
Striani, of the nanocomposite, in
(2015) air, calculated by
9 Dong SCI Polyethylene Glycol Thermo-mechanical
Lin, Sh Diacrylate measurements enabled
engyu (PEGDA) Resin to quantify Tg and the
Jin Fen effects of the increase
g in conversion
(2016) provided by thermal
post-curing.
10 Andres NATURE Shape memory Heating resistors 50
Díaz epoxy sold under the °C–60 °C Eltier
Lantada trade name of devices 40 °C–50 °C
, Adrián Accura 60
(2016)
11 C.Esposi Research Gate Morphological and
to Cycloaliphatic epoxy thermal analysis
Corcione resin
R.
Striani,
F.Monta
g-na
(2016)
12 Z. Elsevier The UV-cured resin Tensile strength and
Manapat was prepared by shear strength. The
Jo mixing UV-MI-25N experimental results
(2017) epoxy with 0, 5, 10, showed that the tensile
15, and 20 wt.% of strength was improved
Al2O3, SiO2, and SiC with proper particle
13 Gabriele SCI The starting monomers The presence of a high-
Taormina were commercially modulus filler resulted in a
ID Corrado available acrylic resins decrement of strain at break
Sciancalep provided by Allnex in for all the filled resins, even
(2017) particular an amine if the loss in strain at break
functional acrylic resin was relatively limited, with
(Ebecryl 7100) and respect to the reference value
pentaerythritoltriacrylate . of 6.1% for unfilled resin.

14 Xinhao research Various contents of lignin- Mechanical properties

Feng gate coated cellulose increased with the addition of
Zhaozhe nanocrystals (L-CNC) were 0.1% and 0.5% L-CNC after
Yang incorporated into postcure, and the thermal
(2017) methacrylate (MA) resin stability was improved
at0.5% L-CNC
15 Sushant Material Science Polyethylene Glycol The electrical and
a forum Diacrylate rheological
Ghoshal (PEGDA) Resin. measurements on the
(2017) nanocomposites.
From the processed
nanocomposite,
electrical conductivity
in the range of as high
as 10 S/m–100
16 Hongzhi ELSEVIER Novel acrylate-based The thermal stability
Peng photosensitive resins slightly enhances
chen designed for DLP are with the increasing
Chao prepared to fabricate content
Cai SMP parts with tert- of, crosslinker and
17 Marta Wiley Periodicals The matrix chosen for The effect of GNPs on
Inverniz this work was a neat resin viscosity and
zi resin consisting of wettability for
Raffaell Polylactic acid– printing processes has
aSuriano polyurethane oligomer been examined, with
(2019) PLA–PUA, Triethylene systematic
glycol dimethacrylate characterization of
TEGDMA, and Irgacure their
819 with the ratio of thermomechanical as
58:39:3 in weight. PLA– well as mechanical
PUA was chosen as the properties. With the
oligomer owing to its addition of 0.5 wt.%
good biodegradability, graphene
and TEGDMA was used nanoplatelets in the
18 Uwe Research gate Accuracies are
Berger restricted to DIN
Aalen Standard resin Accura ISO 2768-m,
Universi 60 respectively to ISO
ty tolerance grade 10.
Beethov Surface
enstrass smoothness of
e1 about 2µ Ra can be
(2019) realized.
19 Zuying Elsevier Commercial The flexural
feng polyurethane resin as an strength and
Yan Li oligomer, modulus can reach
Liag trimethylolpropane 115 MPa and
Hao trimethacrylate as a 5.8 GPa,
 20 Dennis Elsevier Influence of Tensile tests of casted
Graf Al2O3 Nanoparticle Addition specimens showed an
Sven on a UV Cured Polyacrylate improvement of the
Burchard for 3D Inkjet Printing tensile strength and
Thomas elongation at break in
haneman composites filled with
(2019) 31 nm by 10.7% .
21 L. Gong research The specimens were prepared The rate of shift per unit
R. J. gate using 5 mm thick strain for an uncoated
Young A. poly(methyl methacrylate) graphene bilayer (-31
Kinloch beams spin-coated with 300 cm-1/% strain) is
nm of cured SU-8 epoxy resin significantly less that of
the same flake deformed
after being coated
GAP AND OPPORTUNITIES
The epoxy resin used in stereolithography (SLA) process in literature review are
mansion below and find out the opportunities.
(4) SU-8 epoxy resin
Properties Calculated
Strain
Result
The rate of shift per unit strain for an uncoated graphene bilayer (-31 cm-
1/% strain) is significantly less that of the same flake deformed after being coate.

(7) Epon 826 epoxy resin

Properties Calculated
Young’s modulus , Failure strength values
Result
These values represent up to a 9x increase in the Young’s modulus over cast
samples composed of pure epoxy resin. Failure strength values, σ , for the printed
composites are comparable to that of the cast epoxy resin samples (71.1 ± 5.3
MPa).
(8) Adifunctional cycloa-Liphatic epoxy mono- mer was cationically photo-
polymerized in the presence of a diaryliodonium salt photoinitiator and an
isopropyl thioxanthone photosensitizer at different temperatures and UV
intensities
Properties Calculated
Accuracy , Surface roughness ,Elongation at break , Heat deflection
temperature .
Result
Accuracy 0.1-0.2 mm, DIN ISO 2768-m
Surface roughness Ra approximately 2µ
Elongation at break approximately 10%
Heat deflection temperatur approximately 60°C
9) 3,4-Epoxycyclohexylmethyl-30,40-epoxycyclohexanecarboxylate ,
possessing a viscosity of 220–250 mPa·s a 25°C was chosen as a precursor of
the cationic polymer matrix.
Properties Calculated
Young’s modulus E, strength σmax and strain εbreak for photocured bars.
Result

Sample E (GPa) σmax (MPa) εbreak

SLresin 2202.1±46 56.84±5.9 0.027±0.001
B 2501.5±34 53.17±4.3 0.022±0.001
c 3937.3±14 85.37±2.2 0.026±0.00

(12) Accura 60
Properties Calculated
Properties of the materials calculated is Density,Tensile strength, Young’s
modulus, Activation temperature , Hardness-Shore D scale.
Result
Density 1.21 g cm−3
Tensile strength 58–68 MPa
Young’s modulus 2690–3100 MPa
Activation temperature (Tact) 58 °C–62 °C
Hardness-Shore D scale 86

(13) Cycloaliphatic epoxy resin

Properties Calculated
Morphological and thermal analysis
Result
The enhancement of the glass transition temperature found for
nanocomposite with the lowest amount of Dellite 43B is explained with the
better dispersion obtained with this concentration of nanofiller, which
corresponds to exfoliated structures, as confirmed by XRD and SEM
analysis.
(14) The UV-cured resin was prepared by mixing UV-MI-25N epoxy with
0, 5, 10, 15, and 20 wt.% of Al2O3, SiO2, and SiC particles of an average
grain size of 30 μm, respectively.
Properties Calculated
Tensile strength and shear strength
Result
Tensile strength and shear strength. The experimental results showed that
the tensile strength was improved with proper particle addition, but the
shear strength was always decreased.
 OBJECTIVE
From the above Gap and Oppurtunities , we concluded the objectives are
following:-
1. Prepare the Resin.
2. Experimentation on the bases of taguchi method.
3. Prepare the workpiece for tensile test,toughness,fatigue,shore hardness.
4. Testing of prepared workpiece.
5. Analysed the testing results using taguchi method on the software.
6. Obtain the optimal process parameters of process with respect to calculated
mechanical properties.
7. Conduct the confirmation experiment on the bases of optimal process
parameters.
“Parametric optimization of stereolithiography 3D process for part
strength using taguchi method.’’