Envios by themikemachine

A Nanoporous Silicon Membrane Electrode Assembly for on-Chip Micro Fuel Cell Applications - Chu Et Al. - Journal of Microelectromechanic

A Note on Measurements of Onsager Coefficients in Maple Petioles and Maple Woody Xylem by Electroosmotic Techniques - Nelson - Unknown

A New Stem Hygrometer , Corrected for Temperature Gradients and Calibrated Against the Pressure Bomb - Dixon, Departtnent - Plant, Cell

A New Analytic Equation of State for Liquid Water - Jeffery Et Al. - The Journal of Chemical Physics - 1999

A High Sensitivity and High Linearity Pressure Sensor Based on a Peninsula-structured Diaphragm for Low-pressure Ranges - Huang, Zhan(2)

A Low-temperature Bonding Technique Using Spin-On Fluorocarbon Polymers to Assemble Microsystems - Oh Et Al. - Journal of Micromechanics

A Kinetic Theory of Homogeneous Bubble Nucleation - Shen, Debenedetti - The Journal of Chemical Physics - 2003

A New Similarity Found From the Correspondence of the Critical and Zeno-Line Parameters - Apfelbaum, Ev - The Journal of Physical Chemis

A Model of Bubble Growth Leading to Xylem Conduit Embolism. - Hölttä, Vesala, Nikinmaa - Journal of Theoretical Biology - 2007

A Nanofilter Array Chip for Fast Gel-Free Biomolecule Separation. - Fu, Mao, Han - Applied Physics Letters - 2005

A MEMS-based Flow Rate and Flow Direction Sensing Platform With Integrated Temperature Compensation Scheme - Ma Et Al. - Sensors - 2009

A High Sensitivity and High Linearity Pressure Sensor Based on a Peninsula-structured Diaphragm for Low-pressure Ranges - Huang, Zhang

A Microtensiometer Capable of Measuring Water Potentials Below -10 MPa. - Pagay Et Al. - Lab on a Chip - 2014

A Hollow Stiffening Structure for Low-pressure Sensors - Kinnell Et Al. - Sensors and Actuators, A Physical - 2010

A Hermetic Glass-silicon Package Formed Using Localized Aluminumsilicon-glass Bonding - Cheng, Lin, Najafi - … Systems, Journal of - 200

A New Dielectric Isolation Method Using Porous Silicon - Imai - Solid State Electronics - 1981

A Hermetic Glass-silicon Micropackage With High-Density on-chip Feedthroughs for Sensors and Actuators - Ziaie, Arx - … Systems, Journal

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