- DocumentoPaper_2-with-cover-page-v2enviado porYeong-Tsuen Pan
- DocumentoCrystallographic Texture in Materialsenviado porYeong-Tsuen Pan
- DocumentoA_critical_review_of_ohmic_and_rectifyinenviado porYeong-Tsuen Pan
- DocumentoUnder_bump_metallurgy_UBM_-_A_technology_reviewenviado porYeong-Tsuen Pan
- DocumentoClip die bonder使用於高功率元件製造之製程技術與生產自動化設備enviado porYeong-Tsuen Pan