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CAMPO- FET
FET X BJT (NPN)
Drain Collector
Gate Base
Source Emitter
2
Field Effect Transistors
CCT - UDESC
Enriquecimento(tipo N):
Substrato tipo p (corpo);
Duas regiões dopadas “n”;
Camada dióxido de silício;
Metal por cima do SiO2;
Metal no dreno e fonte;
4 terminais: Porta(G), Dreno
(D), Fonte (S) e Corpo (B);
Região do D p/ S, região do
canal;
Resistência porta – 1012 Ω.
NMOS
3
Field Effect Transistors
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4
Field Effect Transistors
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5
Field Effect Transistors
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Criando o canal – canal induzido
Operação normal –
junções “p n” são
mantidas reversamente
polarizadas.
Tensão do dreno positiva
em relação à fonte.
As duas junções podem
estar reversamente
polarizadas conectando-se
os terminais da fonte e
substrato – operação
normal. 6
Field Effect Transistors
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7
Field Effect Transistors
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Para VGS 0 o NMOS não conduz
ID 0
I D 0 REGIÃO DE CORTE
8
Field Effect Transistors
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MOSFET tipo Enriquecimento (NMOS)
VGS 0 e VDS 0, com VGS pequeno
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Field Effect Transistors
CCT - UDESC
MOSFET tipo Enriquecimento (NMOS)
VGS 0 e VDS 0, com VGS crescendo
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Field Effect Transistors
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MOSFET tipo Enriquecimento (NMOS)
VGS Vth e VDS 0
11
Field Effect Transistors
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Corrente fluindo
Efeito de campo:
Porta e corpo – capacitor de
placas paralelas: cargas positivas
na parte de cima, cargas
negativas em baixo (canal
induzido)
Campo elétrico – controla a
quantidade de cargas no canal,
condutividade, corrente de
circulação. 12
Field Effect Transistors
CCT - UDESC
G v GS > V TN
S D vDS Small Waterfalls analogy
+ + Water
n n
S G v GS > V TN v =v - V TN
D DS GS
+ +
n n
De pletio n p
Re gion
+ +
n n
De pletio n p
Re gion Pinch-o ff Po int
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Field Effect Transistors
CCT - UDESC
VDS pequeno: vGS Vtn
V =5V
GS 0 vDS vDSSAT= vGS-Vtn
6.00e-4
Drain-Source Current (A)
VGS= 4 V
W vDS
2
VTN =1V iD μnCOX vGS Vtn vDS
4.00e-4
L 2
VGS= 3 V
small vDS
W
vGS Vtn vDS
2.00e-4
V
GS
=2V iD k n'
L
0.00e+0
diD
k n'
W
vGS Vtn
0.0 0.2 0.4 0.6 0.8 dvDS L
Drain-Source Voltage (V)
NMOS i-v characteristics in the linear region (VSB = 0)
kn' μnCOX
Operation of the enhancement NMOS transistor as vDS is increased. The induced channel acquires a tapered shape and its resistance
increases as vDS is increased. Here, vGS is kept constant at a value > Vt.
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Field Effect Transistors
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Curva característica iD x vGS
The drain current iD versus the drain-to-source voltage vDS for an enhancement-type NMOS transistor operated with vGS > Vt.
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Field Effect Transistors
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Curva característica iD x vGS
2.20e-4
iD 0 for vGS Vtn
Linea r VGS = 5 V
2.00e-4 Re gion
2
iD k n vGS Vtn vDS
W v
Drain-Source Current (A)
'
1.80e-4 DS
Pincho ff Locus
1.60e-4
L 2
vGS Vtn
Sa turation Regio n
1.40e-4
VGS = 4 V for
vDS vDSSAT vGS Vtn
1.20e-4
1.00e-4
k n' W
vGS Vtn 2
8.00e-5
V =3V
iD
6.00e-5 GS 2 L
4.00e-5
V Š1V vGS Vtn
VGS = 2 V GS for
vDS vDSSAT vGS Vtn
2.00e-5
0.00e+0
0 2 4 6 8 10 12
SB
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Field Effect Transistors
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Equação
W vDS
2
iD μnCOX vGS Vtn vDS
L 2
kn' μnCOX
p+ Channel Region p+
N-Type Substrate
Body
i v >0
B B
Cross section of an enhancement-mode PMOS transistor
B
S D
S D
ID
ID
G G
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Field Effect Transistors
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2.50e-4 iD 0 for vGS Vtp
iD k p vGS Vtp vDS
V = 5 V (V = -5 V) 2
SG GS ' W v
DS
2.00e-4
Source-Drain Current (A)
L 2
1.50e-4 vGS Vtp
V = 4 V (V = -4 V) for
vDS vDSSAT vGS Vtp
SG GS
1.00e-4
k p' W
5.00e-5
V
SG
= 3 V (V
GS
= -3 V)
iD vGS Vtp 2
V
SG
= 2 V (V
GS
= -2 V) 2 L
0.00e+0
vGS Vtp
V Š1V (V •-1 V) for
vDS vDSSAT vGS Vtp
SG GS
-5.00e -5
-2 0 2 4 6 8 10 12
Source -Drain Vo ltage (V)
SB
Output characteristics for a
PMOS transistor with
G
Vtp = -1V and k’P (W/L)= 25 x 10-6 A/V2 vS vD
ID
D
20
Field Effect Transistors
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Cross section of a CMOS integrated circuit. Note that the PMOS transistor is formed in a separate n-type region, known as an n well.
Another arrangement is also possible in which an n-type body is used and the n device is formed in a p well.
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Field Effect Transistors
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(d)
(a) An n-channel enhancement-type MOSFET with vGS and vDS applied and with the normal directions of current flow indicated.
(b)The iD - vDS characteristics for a device with Vt = 1 V and k’n(W/L) = 0.5 mA/V2 (d) The iD - vGS characteristic for an enhancement-
type NMOS transistor in saturation.
22
Field Effect Transistors
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Channel Length Modulation
Cox W
iD vGS Vt 2 I D L LM L vDS
1
VA L
2 L
SAT
LM
I DSAT
I DSAT 1 L Cox W
iD iD vGS Vt 2 1 vDS
1 L LM 2 L
LM
LM
Increasing vDS beyond vDSsat causes the channel pinch-off point to move slightly away from the drain, thus reducing the effective
channel length (by L).
23
Field Effect Transistors
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Cox W
iD vGS Vt 2 1 vDS Saturation
2 L
Output Resistance:
-1
i vDS 1
ro D
vDS vGS constant
ID
ro I D
1 VA
VDS VA
ID
VA is directly proportional to L; thus two devices with the same process, and having channel lengths L1 e L2,
will have Early voltage VA1 and VA2,.
V A1 L1
V A 2 L2
Effect of vDS on iD in the saturation region. The MOSFET parameter VA is typically in the range of 30 to 200 V.
24
Field Effect Transistors
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Large-signal equivalent circuit model of the n-channel MOSFET in saturation, incorporating the output resistance ro. The output
resistance models the linear dependence of iD on vDS and is given by ro VA/ID.
25
Field Effect Transistors
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Resumo das equações para o MOSFET enriquecimento
D D D P-channel S
N-channel ID
G B G G B G
or or
ID
Vtp < 0
Vtn > 0
vDS 0 D
S vDS 0 S S
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Field Effect Transistors
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Resumo da característica para o MOSET enriquecimento
D N-channel D
ID
G B G
ou
Vtn > 0
S vDS 0 S
k n' μnCox
D S
P-channel
G B G
ou
ID
Vtp < 0
S vDS 0 D
k p' μ pCox
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Field Effect Transistors
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MOSFET - Depleção
The current-voltage characteristics of a depletion-type n-channel MOSFET for which Vt = -4 V and k’n(W/L) = 2 mA/V2:
(a) transistor with current and voltage polarities indicated; (b) the iD - vDS characteristics; (c) the iD - vGS characteristic in saturation.
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Field Effect Transistors
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Bias Circuits 1
- usually neglected ( 1/ =VA)
- Q-point most often located in saturation for analog circuits
R2
VG VDD
R1 R2 R2
VDD
VGS VDD RS I D
VS RS I D R1 R2
RD
R1
ID
VDS VDD RD RS I D
VG
k n' W
ID VGS Vt ( assuming the MOSFET to be
2
R2 RG 2 L in the saturation region )
RS
2
k n' W R2 ( two solutions only one
ID V V RS D
I
2 L R1 R2
DD t
is possible )
ID
2 L
RG
RS
VGS VDD RD I D
kn'
I D VDD Vt RD I D
-VSS
2
V GS1
Q
RG
I V GS2
V GS3
-VSS
A simple circuit utilizing V DS = VGS2 V DD
a current source
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Field Effect Transistors
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Example: VDD = 5V ;IREF=100A; Q1 and Q2 are
matched ; L=10 m and W=100 m; Vt = 1V ;
k’n=20 A/V2 VA = 10L; Vo=+3V
I D1 I REF 100
1 100
20 VGS 12
2 10
Q1: I V converter VGS 2V
Q2: V I converter 52
R 30 K
If Q2 in saturation 100
v omin VGS Vt vomin 2 1 1V
100V
VA 10 x 10 100V ro 1M
W
then 100 μA
Vo 3V
Io
W L
I o 3 μA 3%
L 2
ro 1M
I REF
1 Basic MOSFET current mirror.
31
Field Effect Transistors
CCT - UDESC
DC Bias Point
1 W
I D k n' VGS Vt 2 0
2 L
VD VDD RD I D VD VGS Vt
The signal Current in the Drain Terminal
W
iD I D id id k n'VGS Vt vgs
L
i
gm D
i
d k n'
W
VGS Vt 2kn' W L I D
vGS v V v gs L
GS
GS
transconductance
Voltage Gain
vD VDD RD iD VDD RD ( I D id ) VD RD id
vd
vd id RD g m RD v gs Av g m RD
v gs
Small-signal models for the MOSFET: (a) neglecting the dependence of iD on vDS in saturation (channel-length modulation effect); and
(b) including the effect of channel-length modulation modeled by output resistance ro = |VA|/ID.
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Field Effect Transistors
CCT - UDESC
Example: Vt = 1.5V ; k’n(W/L)=0.25 mA/V2 VA = 50V
DC Analysis
0.25mVD 1.5
1
VGS VD I D
2
2
VD 15 RD I D 15 10K I D
I D 1.06mA and VD 4.4V Physically Meaningful
g m 0.25m(4.4 1.5) 0.725mA/V
50
ro 47KΩ
1.06m
AC Analysis
vo v v
g m vi o i 0
ro // RD // RL RG
Voltage Gain
34
Field Effect Transistors
CCT - UDESC
Body Transcondu ctance
iD
g mb gm
vBS vGS constante
v DS constante
0.1 χ 0.3
Small-signal equivalent-circuit model of a MOSFET in which the body is not connected to the source.
35
Field Effect Transistors
CCT - UDESC
Basic amplifier configurations with current sources
VDD VDD
VDD
I
I
vo
vo
vI
vo
vI
I
vI
-VSS
36
Field Effect Transistors
CCT - UDESC
ID2
ID2
Ri Ro ro1 // ro 2
Av g m1 ro1 // ro 2
The CMOS common-source amplifier: (a) circuit; (b) i-v characteristic of the active-load Q2; (c) graphical construction to determine
the transfer characteristic; and transfer characteristic.
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Field Effect Transistors
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Example: VDD=10V;Vtn = | Vtp| = 1V ; k’n= 2 k’p= 20 A/V2
(W=100 m; L =10 m |VA|= 100V for both the n and p device)
IREF=100 A.
vO
I REF I D 2 I D1 100 μA 10
Slope = -100V/V
I D 3 I REF 100 μA
1 ' W
k p VSG Vtp
2 L 3
V
2
SG 2.41V
8.59
Bias Point
vOmax 10 (VSG Vtp ) 8.59V
vOmin VI Vtn 1V
4.795
VO vOmax vOmin ro1
ro1 ro 2
vOmin 4.795V
1 ' W
I D1 I REF 100 μA k n VI Vtn VI 2V
2
2 L 1
1
W
g m1 2k I REF 0.2m A
'
n
L 1 V
1.96 2 2.04 vI
VA
ro1 ro 2 1MΩ
I REF
^ ^
Av o g m1 ro1 // ro 2 100 V
v v o 3.795Vp v i 40mVp
vi V
Rin Ro ro1 // ro 2 0.5MΩ
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Field Effect Transistors
CCT - UDESC
vo 1
Av g m1 g mb1 ro1 // ro 2
vi ro1
Av g m1 g mb1 ro1 // ro 2
vi 1 ro 2
Ri 1
ii g g 1 ro1
m1 mb1
ro1
1 ro 2
Ri 1
g m1 g mb1 ro1
The CMOS common-gate amplifier: (a) circuit; (b) small-signal equivalent circuit; and (c) simplified version of the circuit in (b).
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Field Effect Transistors
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vo g m1 RS g m1
Av
vi 1 g m1 RS g g 1 1
m1 mb1
ro1 ro 2
g m1 1
Av
g m1 g mb1 1 χ
Ro 1 // 1 // r // r
o1 o 2
g m1 g mb1
Ro 1 // 1 1
g m1 g mb1 g m1 1 χ
The source follower: (a) circuit; (b) small-signal equivalent circuit; and (c) simplified version of the equivalent circuit.
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Field Effect Transistors
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W L 1 W L 1
vO VDD Vt V v
W L 2 t W L 2 I
W L 1 1 W L 1
Av
W L 2 1 2 W L 2
(a) NMOS amplifier with enhancement load; (b) graphical determination of the transfer characteristic; (c) transfer characteristic.
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Field Effect Transistors
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vo 1
Av g m1 // ro1 // ro 2
vi g mb1
Av
g m1
W L 1 1
g mb2 W L 2 χ
The NMOS amplifier with depletion load: (a) circuit; (b) graphical construction to determine the transfer characteristic; and
(c) transfer characteristic. 42
Field Effect Transistors
CCT - UDESC
rDSN 1
' W
n L
k VDD V
tn
n
Operation of the CMOS inverter when v1 is high: (a) circuit with v1 = VDD (logic-1 level, or VOH); (b) graphical construction to
determine the operating point; and (c) equivalent circuit.
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Field Effect Transistors
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rDSP 1
' W
k p VDD Vtp
L p
Operation of the CMOS inverter when v1 is low: (a) circuit with v1 = 0V (logic-0 level, or VOL); (b) graphical construction to
determine the operating point; and (c) equivalent circuit.
44
Field Effect Transistors
CCT - UDESC
VIH
1
5VDD 2Vt
8
VIL 3VDD 2Vt
1
8
Noise Margins
NM H 3VDD 2Vt
1
8
NM L 3VDD 2Vt
1
8
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Field Effect Transistors
CCT - UDESC
Dynamic operation of a capacitively loaded CMOS inverter: (a) circuit; (b) input and output waveforms; (c) trajectory of the operating
point as the input goes high and C discharges through the QN; (d) equivalent circuit during the capacitor discharge.
46
Field Effect Transistors
CCT - UDESC
Strong inversion and saturation:
g m 2 k W LI D
VA VDS
ro
ID
2
C gs CoxW L
3
(a) High-frequency equivalent circuit model for the MOSFET; (b) the equivalent circuit for the case the source is connected to the
substrate (body); (c) the equivalent circuit model of (b) with Cdb neglected (to simplify analysis).
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Field Effect Transistors
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Io gm
I i sCgs Cgd
For physical frequencies s = j, it cam be seen that the magnitude of the current gain
becomes unity at the frequency:
gm
fT
2πCgs Cgd
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Field Effect Transistors
CCT - UDESC
The Junction Field-Effect Transistor
G De pletio n
G De pletio n
re gion
re gion
p
p
p
p
vGS = 0 VP < vGS < 0
S D W'
S D
n W
+- n
i
G
p
p
p
De pletio n
De pletio n
re gion
G G re gion
G De pletio n
re gion
vGS = VP < 0
p
De pletio n
G re gion
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Field Effect Transistors
CCT - UDESC
De pletion
G
re gion
p
vGS < 0
S D
+- n i DS
( a ) JFET with small drain-source
v
DS
De pletion
G re gion
De pletio n
G re gion
p
p
vGS
S D
+- n i DS
( b ) JFET with channel just at
v =v
DS DSP
pinch-off with vDS = vDSP
p
De pletio n
G re gion
The Junction Field-Effect Transistor ( a ) JFET with small drain-source ( b ) JFET with channel just at
pinch-off with vDS = vDSP 50
Field Effect Transistors
CCT - UDESC
Summary of equations for the JFET
D
S P-channel
iD N-channel G
G VP 0 VP 0
vGSmin 0
iD
vGSmax 0
S D
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Field Effect Transistors
CCT - UDESC
2.20e-4
Linea r VGS = 0 V
2.00e-4 Re gion I DSS
0.00e+0
0 2 4 6 8 10 12
52
Field Effect Transistors
CCT - UDESC
1.50e-3
5.00e-4
0.00e+0
V
P
-5.00e -4
-6 -5 -4 -3 -2 -1 0 1 2 3
53
Field Effect Transistors
CCT - UDESC
When to use JFETs
JFET have much higher input impedances
and much lower input currents than BJTs.
BJTs are more linear than JFETs.
The gain of a BJT is much higher than that
of a JFET.
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Field Effect Transistors
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JFET (Example)
The JFET in the circuit below has VP=-3V, IDSS=9mA, For the JFET circuit designed in the former exercise,
and =0. Find the values of all resistors so that VG=5V, let an input signal vi be capacitively coupled to the
ID=4mA, and VD=11V. Design for 0.05mA in the gate, a large bypass capacitor be connected between
voltage divider. the source and ground, and the output signal vo be
taken from the drain through a large coupling
capacitor. The resulting common-source amplifier is
shown below. Calculate gm and ro (assuming
VA=100V). Also find Ri and Ro.
R G2
5 5 VS
2
15
R G2 R G1 4m 9m1
3
15 2x9m 4m
0.05m Saturation
g m 4m A ro 100 25KΩ
R G2 R G1 VS' 6V VS'' 10V 3 9m
V 4m
R G1 200KΩ Ok
R G2 100KΩ R S 1.5KΩ
g m ro // R D 3.85 V
vo
15 11 Av
V
RD 1KΩ vi
4m Ro ro // R D 962 Ri R G1//R G2 66.7KΩ
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Field Effect Transistors
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References
SEDRA. Adel S. e SMITH, Kenneth C. Microelectronic
Circuits. Oxford University Press.
BOYLESTAD, Robert e NASHELSKY, Louis.
Dispositivos Eletrônicos e Teoria de Circuitos. Prentice
Hall do Brasil.
SZE, S. M. Physics of Semiconductor Devices. John Wiley
& Sons.
SCHILLING, Donald L. e BELOVE, Charles. Circuitos
Eletrônicos Discretos e Integrados. Guanabara Dois.
COMER, David J. Introduction to Semiconductor
Circuits Design. Addison Wesley Publishing Company.
MALVINO, Albert P. Eletrônica. Volume I. McGraw-Hill.
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Field Effect Transistors
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